IS27C020-90PLI datasheet, PDF - EEWORLD Datasheet

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IS27C020-90PLI: DescriptionOTP ROM, 256KX8, 90ns, CMOS, PQCC32, PLASTIC, LCC-32; Categorystorage storage; File Size458KB，11 Pages; ManufacturerIntegrated Silicon Solution ( ISSI )

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IS27C020-90PLI Overview

OTP ROM, 256KX8, 90ns, CMOS, PQCC32, PLASTIC, LCC-32

IS27C020-90PLI Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Integrated Silicon Solution ( ISSI )
Parts packaging code	QFJ
package instruction	PLASTIC, LCC-32
Contacts	32
Reach Compliance Code	compliant
ECCN code	EAR99
Maximum access time	90 ns
I/O type	COMMON
JESD-30 code	R-PQCC-J32
JESD-609 code	e0
length	13.97 mm
memory density	2097152 bit
Memory IC Type	OTP ROM
memory width	8
Number of functions	1
Number of terminals	32
word count	262144 words
character code	256000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	256KX8
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	QCCJ
Encapsulate equivalent code	LDCC32,.5X.6
Package shape	RECTANGULAR
Package form	CHIP CARRIER
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum seat height	3.55 mm
Maximum standby current	0.00005 A
Maximum slew rate	0.04 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	J BEND
Terminal pitch	1.27 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	11.43 mm

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	IS27C020-90PLI	IS27C020-12W	IS27C020-12TI	IS27C020-90PL	IS27C020-90T	IS27C020-90TI	IS27C020-12PL	IS27C020-12PLI	IS27C020-12T
Description	OTP ROM, 256KX8, 90ns, CMOS, PQCC32, PLASTIC, LCC-32	OTP ROM, 256KX8, 120ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32	OTP ROM, 256KX8, 120ns, CMOS, PDSO32, TSOP-32	OTP ROM, 256KX8, 90ns, CMOS, PQCC32, PLASTIC, LCC-32	OTP ROM, 256KX8, 90ns, CMOS, PDSO32, TSOP-32	OTP ROM, 256KX8, 90ns, CMOS, PDSO32, TSOP-32	OTP ROM, 256KX8, 120ns, CMOS, PQCC32, PLASTIC, LCC-32	OTP ROM, 256KX8, 120ns, CMOS, PQCC32, PLASTIC, LCC-32	OTP ROM, 256KX8, 120ns, CMOS, PDSO32, TSOP-32
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )
Parts packaging code	QFJ	DIP	TSOP	QFJ	TSOP	TSOP	QFJ	QFJ	TSOP
package instruction	PLASTIC, LCC-32	0.600 INCH, PLASTIC, DIP-32	TSOP-32	PLASTIC, LCC-32	TSOP-32	TSOP-32	PLASTIC, LCC-32	PLASTIC, LCC-32	TSOP-32
Contacts	32	32	32	32	32	32	32	32	32
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	90 ns	120 ns	120 ns	90 ns	90 ns	90 ns	120 ns	120 ns	120 ns
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-PQCC-J32	R-PDIP-T32	R-PDSO-G32	R-PQCC-J32	R-PDSO-G32	R-PDSO-G32	R-PQCC-J32	R-PQCC-J32	R-PDSO-G32
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0	e0
length	13.97 mm	41.91 mm	18.4 mm	13.97 mm	18.4 mm	18.4 mm	13.97 mm	13.97 mm	18.4 mm
memory density	2097152 bit	2097152 bit	2097152 bit	2097152 bit	2097152 bit	2097152 bit	2097152 bit	2097152 bit	2097152 bit
Memory IC Type	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM
memory width	8	8	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1	1	1
Number of terminals	32	32	32	32	32	32	32	32	32
word count	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words
character code	256000	256000	256000	256000	256000	256000	256000	256000	256000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	70 °C	85 °C	70 °C	70 °C	85 °C	70 °C	85 °C	70 °C
organize	256KX8	256KX8	256KX8	256KX8	256KX8	256KX8	256KX8	256KX8	256KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	QCCJ	DIP	TSOP1	QCCJ	TSOP1	TSOP1	QCCJ	QCCJ	TSOP1
Encapsulate equivalent code	LDCC32,.5X.6	DIP32,.6	TSSOP32,.8,20	LDCC32,.5X.6	TSSOP32,.8,20	TSSOP32,.8,20	LDCC32,.5X.6	LDCC32,.5X.6	TSSOP32,.8,20
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	CHIP CARRIER	IN-LINE	SMALL OUTLINE, THIN PROFILE	CHIP CARRIER	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	CHIP CARRIER	CHIP CARRIER	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	3.55 mm	4.572 mm	1.2 mm	3.55 mm	1.2 mm	1.2 mm	3.55 mm	3.55 mm	1.2 mm
Maximum standby current	0.00005 A	0.00005 A	0.00005 A	0.00005 A	0.00005 A	0.00005 A	0.00005 A	0.00005 A	0.00005 A
Maximum slew rate	0.04 mA	0.03 mA	0.04 mA	0.03 mA	0.03 mA	0.04 mA	0.03 mA	0.04 mA	0.03 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	NO	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	J BEND	THROUGH-HOLE	GULL WING	J BEND	GULL WING	GULL WING	J BEND	J BEND	GULL WING
Terminal pitch	1.27 mm	2.54 mm	0.5 mm	1.27 mm	0.5 mm	0.5 mm	1.27 mm	1.27 mm	0.5 mm
Terminal location	QUAD	DUAL	DUAL	QUAD	DUAL	DUAL	QUAD	QUAD	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	11.43 mm	15.24 mm	8 mm	11.43 mm	8 mm	8 mm	11.43 mm	11.43 mm	8 mm

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