54ACTQ10DMQB Related Products
|
54ACTQ10DMQB |
54ACTQ10LMQB |
74ACTQ10SCQR |
74ACT10PCQR |
| Description |
NAND Gate, CMOS, CDIP14, |
NAND Gate, CMOS, CQCC20, |
NAND Gate, CMOS, PDSO14, |
NAND Gate, CMOS, PDIP14, |
| Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
incompatible |
| package instruction |
DIP, DIP14,.3 |
QCCN, LCC20,.35SQ |
SOP, SOP14,.25 |
DIP, DIP14,.3 |
| Reach Compliance Code |
unknown |
unknown |
unknown |
unknown |
| JESD-30 code |
R-XDIP-T14 |
S-XQCC-N20 |
R-PDSO-G14 |
R-PDIP-T14 |
| JESD-609 code |
e0 |
e0 |
e0 |
e0 |
| Load capacitance (CL) |
50 pF |
50 pF |
50 pF |
50 pF |
| Logic integrated circuit type |
NAND GATE |
NAND GATE |
NAND GATE |
NAND GATE |
| MaximumI(ol) |
0.024 A |
0.024 A |
0.024 A |
0.024 A |
| Number of terminals |
14 |
20 |
14 |
14 |
| Maximum operating temperature |
125 °C |
125 °C |
85 °C |
85 °C |
| Minimum operating temperature |
-55 °C |
-55 °C |
-40 °C |
-40 °C |
| Package body material |
CERAMIC |
CERAMIC |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| encapsulated code |
DIP |
QCCN |
SOP |
DIP |
| Encapsulate equivalent code |
DIP14,.3 |
LCC20,.35SQ |
SOP14,.25 |
DIP14,.3 |
| Package shape |
RECTANGULAR |
SQUARE |
RECTANGULAR |
RECTANGULAR |
| Package form |
IN-LINE |
CHIP CARRIER |
SMALL OUTLINE |
IN-LINE |
| power supply |
5 V |
5 V |
5 V |
5 V |
| Prop。Delay @ Nom-Sup |
9.5 ns |
9.5 ns |
8.5 ns |
10 ns |
| Schmitt trigger |
NO |
NO |
NO |
NO |
| Nominal supply voltage (Vsup) |
5 V |
5 V |
5 V |
5 V |
| surface mount |
NO |
YES |
YES |
NO |
| technology |
CMOS |
CMOS |
CMOS |
CMOS |
| Temperature level |
MILITARY |
MILITARY |
INDUSTRIAL |
INDUSTRIAL |
| Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
| Terminal form |
THROUGH-HOLE |
NO LEAD |
GULL WING |
THROUGH-HOLE |
| Terminal pitch |
2.54 mm |
1.27 mm |
1.27 mm |
2.54 mm |
| Terminal location |
DUAL |
QUAD |
DUAL |
DUAL |
| Base Number Matches |
1 |
1 |
1 |
- |
| Maker |
- |
Fairchild |
Fairchild |
Fairchild |