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S29CD032G0PFAN000

Description
CMOS 2.5 VOLT ONLY BURST MODE DUAL BOOT, SIMULTANEOUS READ /WRITE FLASH MEMORY
Categorystorage    storage   
File Size985KB,93 Pages
ManufacturerSPANSION
Websitehttp://www.spansion.com/
Download Datasheet Parametric View All

S29CD032G0PFAN000 Overview

CMOS 2.5 VOLT ONLY BURST MODE DUAL BOOT, SIMULTANEOUS READ /WRITE FLASH MEMORY

S29CD032G0PFAN000 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerSPANSION
Parts packaging codeBGA
package instruction13 X 11 MM, 1 MM PITCH, FORTIFIED, BGA-80
Contacts80
Reach Compliance Code_compli
ECCN code3A991.B.1.A
Maximum access time54 ns
Other featuresSYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; TOP BOOT BLOCK
startup blockTOP
JESD-30 codeR-PBGA-B80
JESD-609 codee0
length13 mm
memory density33554432 bi
Memory IC TypeFLASH
memory width32
Humidity sensitivity level3
Number of functions1
Number of terminals80
word count1048576 words
character code1000000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
organize1MX32
Package body materialPLASTIC/EPOXY
encapsulated codeLBGA
Package shapeRECTANGULAR
Package formGRID ARRAY, LOW PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)240
Programming voltage2.7 V
Certification statusNot Qualified
Maximum seat height1.4 mm
Maximum supply voltage (Vsup)2.75 V
Minimum supply voltage (Vsup)2.5 V
Nominal supply voltage (Vsup)2.6 V
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature30
typeNOR TYPE
width11 mm
S29CD032G
32 Megabit (1 M x 32-Bit)
CMOS 2.5 Volt-only Burst Mode, Dual Boot,
Simultaneous Read/Write Flash Memory
Data Sheet
ADVANCE
INFORMATION
Distinctive Characteristics
Architecture Advantages
Simultaneous Read/Write operations
— Data can be read from one bank while executing
erase/program functions in other bank
(-40°C to 85°C only)
— Zero latency between read and write operations
— Two bank architecture: 75%/25%
User-Defined x32 Data Bus
Dual Boot Block
— Top and bottom boot sectors in the same device
Flexible sector architecture
— Eight 8 Kbytes, sixty-two 64 Kbytes, and eight 8
Kbytes sectors
Manufactured on 170 nm process technology
SecSi (Secured Silicon) Sector (256 Bytes)
Factory locked and identifiable:
16 bytes for secure,
random factory Electronic Serial Number; remainder
may be customer data programmed by AMD
Customer lockable:
Can be read, programmed or
erased just like other sectors. Once locked, data
cannot be changed
Programmable Burst interface
— Interface to any high performance processor
— Modes of Burst Read Operation:
Linear Burst:
4 double words and 8 double words
with wrap around
Program Operation
— Ability to perform synchronous and asynchronous
write operations of burst configuration register
settings independently
Single power supply operation
— Optimized for 2.5 to 2.75 volt read, erase, and
program operations
Compatibility with JEDEC standards (JC42.4)
— Software compatible with single-power supply Flash
— Backward-compatible with AMD Am29LV and Am29F
flash memories
Ultra low power consumption
— Burst Mode Read: 90 mA @ 66 MHz max, capable of
75 MHz (Fortified BGA only)
— Program/Erase: 50 mA max
— Standby mode: CMOS: 60 µA max
1 million write cycles per sector typical
20 year data retention typical
VersatileI/O™ control
— Device generates data output voltages and tolerates
data input voltages as determined by the voltage on
the V
IO
pin
— 1.65 V to 2.75 V compatible I/O signals
Software Features
Persistent Sector Protection
— A command sector protection method to lock
combinations of individual sectors and sector groups
to prevent program or erase operations within that
sector (requires only V
CC
levels)
Password Sector Protection
— A sophisticated sector protection method to lock
combinations of individual sectors and sector groups
to prevent program or erase operations within that
sector using a user-definable 64-bit password
Supports Common Flash Interface (CFI)
Unlock Bypass Program Command
— Reduces overall programming time when issuing
multiple program command sequences
Data# Polling and toggle bits
— Provides a software method of detecting program or
erase operation completion
Hardware Features
Program Suspend/Resume & Erase Suspend/
Resume
— Suspends program or erase operations to allow
reading, programming, or erasing in same bank
Hardware Reset (RESET#), Ready/Busy# (RY/
BY#), and Write Protect (WP#) inputs
ACC input
— Accelerates programming time for higher throughput
during system production
Package options
— 80-pin PQFP
— 80-ball Fortified BGA
Performance Characteristics
High performance read access
— Initial/random access times as fast as 48 ns
— Burst access time as fast as 7.5 ns for ball grid array
package
Publication Number
30606
Revision
B
Amendment
0
Issue Date
March 22, 2004
The contents of this document are subject to change without notice. This document may contain information on a Spansion product under development by
FASL LLC. FASL LLC reserves the right to change or discontinue work on any product without notice. The information in this document is provided
“as
is”
without warranty or guarantee of any kind as to its accuracy, completeness, operability, fitness for particular purpose, merchantability, non-infringement of
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