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M2S28D30ATP-10

Description
128M Double Data Rate Synchronous DRAM
Categorystorage    storage   
File Size1MB,36 Pages
ManufacturerMitsubishi
Websitehttp://www.mitsubishielectric.com/semiconductors/
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M2S28D30ATP-10 Overview

128M Double Data Rate Synchronous DRAM

M2S28D30ATP-10 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMitsubishi
Parts packaging codeTSOP2
package instructionSOP, TSSOP66,.46
Contacts66
Reach Compliance Codeunknow
ECCN codeEAR99
access modeFOUR BANK PAGE BURST
Maximum access time0.8 ns
Other featuresAUTO/SELF REFRESH
Maximum clock frequency (fCLK)125 MHz
I/O typeCOMMON
interleaved burst length2,4,8
JESD-30 codeR-PDSO-G66
JESD-609 codee0
memory density134217728 bi
Memory IC TypeDDR DRAM
memory width8
Number of functions1
Number of ports1
Number of terminals66
word count16777216 words
character code16000000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize16MX8
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Encapsulate equivalent codeTSSOP66,.46
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply2.5 V
Certification statusNot Qualified
refresh cycle4096
self refreshYES
Continuous burst length2,4,8
Maximum standby current0.02 A
Maximum slew rate0.16 mA
Maximum supply voltage (Vsup)2.7 V
Minimum supply voltage (Vsup)2.3 V
Nominal supply voltage (Vsup)2.5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.635 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
DDR SDRAM (Rev.0.1)
Jun,'00
Preliminary
MITSUBISHI LSIs
M2S28D20/ 30/ 40ATP
128M Double Data Rate Synchronous DRAM
PRELIMINARY
Some of contents are subject to change without notice.
DESCRIPTION
M2S28D20ATP is a 4-bank x 8388608-word x 4-bit,
M2S28D30ATP is a 4-bank x 4194304-word x 8-bit,
M2S28D40ATP is a 4-bank x 2097152-word x 16-bit,
double data rate synchronous DRAM, with SSTL_2 interface. All control and address signals are
referenced to the rising edge of CLK. Input data is registered on both edges of data strobe, and output
data and data strobe are referenced on both edges of CLK. The M2S28D20/30/40ATP achieves very
high speed data rate up to 133MHz, and are suitable for main memory in computer systems.
FEATURES
- Vdd=Vddq=2.5V+0.2V
- Double data rate architecture;
two data transfers per clock cycle
- Bidirectional, data strobe (DQS) is transmitted/received with data
- Differential clock inputs (CLK and /CLK)
- DLL aligns DQ and DQS transitions
with CLK transitions edges of DQS
- Commands entered on each positive CLK edge;
- data and data mask referenced to both edges of DQS
- 4 bank operation controlled by BA0, BA1 (Bank Address)
- /CAS latency- 2.0/2.5 (programmable)
- Burst length- 2/4/8 (programmable)
- Burst type- sequential / interleave (programmable)
- Auto precharge / All bank precharge controlled by A10
- 4096 refresh cycles /64ms (4 banks concurrent refresh)
- Auto refresh and Self refresh
- Row address A0-11 / Column address A0-9,11(x4)/ A0-9(x8)/ A0-8(x16)
- SSTL_2 Interface
- 400-mil, 66-pin Thin Small Outline Package (TSOP II)
- FET switch control(/QFC) for x4/ x8
- JEDEC standard
MITSUBISHI ELECTRIC
1

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