IC,BUS TRANSCEIVER,SINGLE,8-BIT,ACT-CMOS,DIP,24PIN,CERAMIC
| Parameter Name | Attribute value |
| package instruction | DIP, DIP24,.3 |
| Reach Compliance Code | unknown |
| Control type | INDEPENDENT CONTROL |
| Counting direction | BIDIRECTIONAL |
| JESD-30 code | R-XDIP-T24 |
| Logic integrated circuit type | REGISTERED BUS TRANSCEIVER |
| MaximumI(ol) | 0.024 A |
| Number of digits | 8 |
| Number of functions | 1 |
| Number of terminals | 24 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Output characteristics | 3-STATE |
| Output polarity | INVERTED |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP24,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5 V |
| Prop。Delay @ Nom-Sup | 9.5 ns |
| Certification status | Not Qualified |
| Filter level | 38535Q/M;38534H;883B |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Base Number Matches | 1 |
| 54ACTQ544SDMBQ | 54ACTQ544FMBQ | 54ACTQ544LMBQ | |
|---|---|---|---|
| Description | IC,BUS TRANSCEIVER,SINGLE,8-BIT,ACT-CMOS,DIP,24PIN,CERAMIC | IC,BUS TRANSCEIVER,SINGLE,8-BIT,ACT-CMOS,FP,24PIN,CERAMIC | IC,BUS TRANSCEIVER,SINGLE,8-BIT,ACT-CMOS,LLCC,28PIN,CERAMIC |
| package instruction | DIP, DIP24,.3 | DFP, FL24,.4 | QCCN, LCC28,.45SQ |
| Reach Compliance Code | unknown | unknown | unknown |
| Control type | INDEPENDENT CONTROL | INDEPENDENT CONTROL | INDEPENDENT CONTROL |
| Counting direction | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL |
| JESD-30 code | R-XDIP-T24 | R-XDFP-F24 | S-XQCC-N28 |
| Logic integrated circuit type | REGISTERED BUS TRANSCEIVER | REGISTERED BUS TRANSCEIVER | REGISTERED BUS TRANSCEIVER |
| MaximumI(ol) | 0.024 A | 0.024 A | 0.024 A |
| Number of digits | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 |
| Number of terminals | 24 | 24 | 28 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE |
| Output polarity | INVERTED | INVERTED | INVERTED |
| Package body material | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | DIP | DFP | QCCN |
| Encapsulate equivalent code | DIP24,.3 | FL24,.4 | LCC28,.45SQ |
| Package shape | RECTANGULAR | RECTANGULAR | SQUARE |
| Package form | IN-LINE | FLATPACK | CHIP CARRIER |
| power supply | 5 V | 5 V | 5 V |
| Prop。Delay @ Nom-Sup | 9.5 ns | 9.5 ns | 9.5 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified |
| Filter level | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V |
| surface mount | NO | YES | YES |
| technology | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | MILITARY |
| Terminal form | THROUGH-HOLE | FLAT | NO LEAD |
| Terminal pitch | 2.54 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | QUAD |
| Base Number Matches | 1 | 1 | 1 |
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