M27C322-80P3 datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > storage> storage> M27C322-80P3

M27C322-80P3: Description32 Mbit 2Mb x16 UV EPROM and OTP EPROM; Categorystorage storage; File Size84KB，13 Pages; ManufacturerSTMicroelectronics; Websitehttp://www.st.com/; Environmental Compliance

Download Datasheet Parametric Compare View All

M27C322-80P3 Overview

32 Mbit 2Mb x16 UV EPROM and OTP EPROM

M27C322-80P3 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	STMicroelectronics
Parts packaging code	DIP
package instruction	0.600 INCH, PLASTIC, DIP-42
Contacts	42
Reach Compliance Code	compli
ECCN code	EAR99
Maximum access time	80 ns
I/O type	COMMON
JESD-30 code	R-PDIP-T42
JESD-609 code	e3
length	52.455 mm
memory density	33554432 bi
Memory IC Type	OTP ROM
memory width	16
Number of functions	1
Number of terminals	42
word count	2097152 words
character code	2000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	2MX16
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP42,.6
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum seat height	5.08 mm
Maximum standby current	0.0001 A
Maximum slew rate	0.07 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Matte Tin (Sn)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	15.24 mm

Preview

Download Datasheet

View All

M27C322

32 Mbit (2Mb x16) UV EPROM and OTP EPROM

5V ± 10% SUPPLY VOLTAGE in READ

OPERATION

ACCESS TIME: 80ns

WORD-WIDE CONFIGURABLE

32 Mbit MASK ROM REPLACEMENT

LOW POWER CONSUMPTION

– Active Current 50mA at 5MHz

– Stand-by Current 100µA

PROGRAMMING VOLTAGE: 12V ± 0.25V

PROGRAMMING TIME: 50µs/word

ELECTRONIC SIGNATURE

– Manufacturer Code: 0020h

– Device Code: 0034h

FDIP42W (F)

PDIP42 (P)

Figure 1. Logic Diagram

DESCRIPTION

The M27C322 is a 32 Mbit EPROM offered in the

UV range (ultra violet erase). It is ideally suited for

microprocessor systems requiring large data or

program storage. It is organised as 2 MWords of

16 bit. The pin-out is compatible with a 32 Mbit

Mask ROM.

The FDIP42W (window ceramic frit-seal package)

has a transparent lid which allows the user to ex-

pose the chip to ultraviolet light to erase the bit pat-

tern. A new pattern can then be written rapidly to

the device by following the programming proce-

dure.

For applications where the content is programmed

only one time and erasure is not required, the

M27C322 is offered in PDIP42 package.

VCC

A0-A20

Q0-Q15

GVPP

M27C322

VSS

AI02156

April 2000

1/13

M27C322-80P3 Related Products

	M27C322-80P3	M27C322-80P6	M27C322-80P1	M27C322-100P6	M27C322-100P1	M27C322-100P3
Description	32 Mbit 2Mb x16 UV EPROM and OTP EPROM	32 Mbit 2Mb x16 UV EPROM and OTP EPROM	32 Mbit 2Mb x16 UV EPROM and OTP EPROM	32 Mbit 2Mb x16 UV EPROM and OTP EPROM	32 Mbit 2Mb x16 UV EPROM and OTP EPROM	32 Mbit 2Mb x16 UV EPROM and OTP EPROM
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to
Parts packaging code	DIP	DIP	DIP	DIP	DIP	DIP
package instruction	0.600 INCH, PLASTIC, DIP-42	0.600 INCH, PLASTIC, DIP-42	0.600 INCH, PLASTIC, DIP-42	0.600 INCH, PLASTIC, DIP-42	0.600 INCH, PLASTIC, DIP-42	0.600 INCH, PLASTIC, DIP-42
Contacts	42	42	42	42	42	42
Reach Compliance Code	compli	compli	compli	compli	compli	compli
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	80 ns	80 ns	80 ns	100 ns	100 ns	100 ns
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-PDIP-T42	R-PDIP-T42	R-PDIP-T42	R-PDIP-T42	R-PDIP-T42	R-PDIP-T42
JESD-609 code	e3	e3	e3	e3	e3	e3
length	52.455 mm	52.455 mm	52.455 mm	52.455 mm	52.455 mm	52.455 mm
memory density	33554432 bi	33554432 bi	33554432 bi	33554432 bi	33554432 bi	33554432 bi
Memory IC Type	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM
memory width	16	16	16	16	16	16
Number of functions	1	1	1	1	1	1
Number of terminals	42	42	42	42	42	42
word count	2097152 words	2097152 words	2097152 words	2097152 words	2097152 words	2097152 words
character code	2000000	2000000	2000000	2000000	2000000	2000000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	125 °C	70 °C	125 °C	70 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-	-40 °C	-	-40 °C
organize	2MX16	2MX16	2MX16	2MX16	2MX16	2MX16
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	DIP	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP42,.6	DIP42,.6	DIP42,.6	DIP42,.6	DIP42,.6	DIP42,.6
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5.08 mm	5.08 mm	5.08 mm	5.08 mm	5.08 mm	5.08 mm
Maximum standby current	0.0001 A	0.0001 A	0.0001 A	0.0001 A	0.0001 A	0.0001 A
Maximum slew rate	0.07 mA	0.07 mA	0.07 mA	0.07 mA	0.07 mA	0.07 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	AUTOMOTIVE	COMMERCIAL	AUTOMOTIVE	COMMERCIAL	INDUSTRIAL
Terminal surface	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	15.24 mm	15.24 mm	15.24 mm	15.24 mm	15.24 mm	15.24 mm
Maker	STMicroelectronics	STMicroelectronics	-	STMicroelectronics	STMicroelectronics	-

Recommended Resources

Application of field effect transistors in pocket radio circuits

Power circuit for home appliance repair

Protection circuit diagram for devices during rectification

025 Power supply circuit diagram of CASPER TM-5159 VGA color display

A simple method to determine the quality of high-voltage capacitors

875p computer motherboard circuit diagram_038

There are 28 prizes left in the prize pool, first come first served: Mentor helps you design PCB efficiently: Click to enter>>[url=https://www.eeworld.com.cn/huodong/Mentor_20181203/index.html][color=blue][b]Event page[/b][/color][/url] [size=4][color=white][backcolor=deepskyblue][b]There are only 10 days lef...; EEWORLD社区 PCB Design

Development of camera driver based on Directshow under WinCE: I am working on WinCE and want to use the camera under the DShow framework, but it seems difficult. First of all, in WinCE5/6, Microsoft seems to have extracted the Camera module separately and wrote ...; hurry145 Embedded System

Beginners' confusion about ADS project establishment: [size=18px][size=16px]I am currently using the GEC2440 development board from Guangqian. However, there is no information on how to create an ADS project file for this development board. My confusion ...; morancjy Embedded System

I would like to ask about the problems that occur when using PB4.2 to customize the operating system.: Dear experts, please help me with the following problem. I used PB4.2 to customize an operating system for an experimental box. The BSP I used was also the one that came with the experimental box CD, ...; tsnana Embedded System

Espressif ESP32-S3-USB-OTG development board information: [i=s]This post was last edited by Hot Ximixiu on 2022-1-17 08:27[/i]ESP32-S3-USB-OTG is a development board that focuses on USB-OTG function verification and application development. It is based on ES...; 火辣西米秀 Domestic Chip Exchange

Which module among CC1101, 2530 and 2540 is suitable for beginners?: The lab teacher wants to buy a batch of wireless modules for students to learn, but is not sure which one is better. I hope someone with knowledge can give me some guidance. All students are undergrad...; nemo1991 Wireless Connectivity

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components