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ICSSSTUB32872AHLF

Description
Bus Driver, PBGA96
Categorylogic    logic   
File Size209KB,18 Pages
ManufacturerIDT (Integrated Device Technology)
Environmental Compliance
Download Datasheet Parametric Compare View All

ICSSSTUB32872AHLF Overview

Bus Driver, PBGA96

ICSSSTUB32872AHLF Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
package instructionFBGA, BGA96,6X16,32
Reach Compliance Codeunknown
JESD-30 codeR-PBGA-B96
Logic integrated circuit typeBUS DRIVER
Number of terminals96
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeFBGA
Encapsulate equivalent codeBGA96,6X16,32
Package shapeRECTANGULAR
Package formGRID ARRAY, FINE PITCH
power supply1.8 V
Certification statusNot Qualified
Nominal supply voltage (Vsup)1.8 V
surface mountYES
Temperature levelCOMMERCIAL
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
Base Number Matches1
Integrated
Circuit
Systems, Inc.
ICSSSTUB32872A
Advance Information
28-Bit Registered Buffer for DDR2
Recommended Application:
DDR2 Memory Modules
Provides complete DDR DIMM solution with
ICS98ULPA877A, ICS97ULP877, or IDTCSPUA877A
Optimized for DDR2 400/533/667 JEDEC 4 Rank
VLP DIMMS
Product Features:
28-bit 1:1 registered buffer with parity check
functionality
Supports SSTL_18 JEDEC specification on data
inputs and outputs
Supports LVCMOS switching levels on RESET input
50% more dynamic driver strength than standard
SSTU32864
Low voltage operation
V
DD
= 1.7V to 1.9V
Available in 96 BGA package
Pin Configuration
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
2
3
4
5
6
96 Ball BGA
(Top View)
Functionality Truth Table
In puts
RESET
H
H
H
H
H
H
H
H
H
H
H
H
L
DCS0
L
L
L
L
L
L
H
H
H
H
H
H
X or
floating
DCS1
L
L
L
H
H
H
L
L
L
H
H
H
X or
floating
CK
L or H
L or H
L or H
L or H
X or
floating
CK
L or H
L or H
L or H
L or H
X or
floating
Dn,
DODTn,
DCK En
L
H
X
L
H
X
L
H
X
L
H
X
X or
floating
Qn
L
H
Q
0
L
H
Q
0
L
H
Q
0
Q
0
Q
0
Q
0
L
Outputs
QCS
L
L
Q
0
L
L
Q
0
H
H
Q
0
H
H
Q
0
L
QODT,
QCKE
L
H
Q
0
L
H
Q
0
L
H
Q
0
L
H
Q
0
L
1222F—3/13/07
ADVANCE INFORMATION
documents contain information on products in the formative or design phase development. Characteristic data and other specifications are design goals.
ICS reserves the right to change or discontinue these products without notice. Third party brands and names are the property of their respective owners.

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Description Bus Driver, PBGA96 D Flip-Flop, 32872 Series, 1-Func, Positive Edge Triggered, 28-Bit, True Output, PBGA96, 5.50 X 13.50 MM, ROHS COMPLIANT, MO-205, LFBGA-96 Bus Driver, PBGA96 D Flip-Flop, 32872 Series, 1-Func, Positive Edge Triggered, 28-Bit, True Output, PBGA96, 5 X 11.50 MM, MO-205, TFBGA-96 D Flip-Flop, 32872 Series, 1-Func, Positive Edge Triggered, 28-Bit, True Output, PBGA96, 5 X 11.50 MM, ROHS COMPLIANT, MO-205, TFBGA-96 Bus Driver, PBGA96 Bus Driver, PBGA96 D Flip-Flop, 32872 Series, 1-Func, Positive Edge Triggered, 28-Bit, True Output, PBGA96, 5.50 X 13.50 MM, MO-205, LFBGA-96
Is it Rohs certified? conform to conform to incompatible incompatible conform to incompatible conform to incompatible
Reach Compliance Code unknown compliant unknown compliant unknown unknown unknown compliant
JESD-30 code R-PBGA-B96 R-PBGA-B96 R-PBGA-B96 R-PBGA-B96 R-PBGA-B96 R-PBGA-B96 R-PBGA-B96 R-PBGA-B96
Logic integrated circuit type BUS DRIVER D FLIP-FLOP BUS DRIVER D FLIP-FLOP D FLIP-FLOP BUS DRIVER BUS DRIVER D FLIP-FLOP
Number of terminals 96 96 96 96 96 96 96 96
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code FBGA LFBGA FBGA TFBGA TFBGA FBGA FBGA LFBGA
Encapsulate equivalent code BGA96,6X16,32 BGA96,6X16,32 BGA96,6X16,25 BGA96,6X16,25 BGA96,6X16,25 BGA96,6X16,32 BGA96,6X16,25 BGA96,6X16,32
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
power supply 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Nominal supply voltage (Vsup) 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V
surface mount YES YES YES YES YES YES YES YES
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form BALL BALL BALL BALL BALL BALL BALL BALL
Terminal pitch 0.8 mm 0.8 mm 0.635 mm 0.65 mm 0.65 mm 0.8 mm 0.635 mm 0.8 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
package instruction FBGA, BGA96,6X16,32 LFBGA, BGA96,6X16,32 - TFBGA, BGA96,6X16,25 5 X 11.50 MM, ROHS COMPLIANT, MO-205, TFBGA-96 FBGA, BGA96,6X16,32 - 5.50 X 13.50 MM, MO-205, LFBGA-96
Base Number Matches 1 1 1 1 1 1 - -
JESD-609 code - e3 - e0 e1 - e1 e0
Terminal surface - MATTE TIN - TIN LEAD Tin/Silver/Copper (Sn/Ag/Cu) - Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn/Pb)
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