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HSMD-H670

Description
Surface Mount Flip Chip LEDs
CategoryLED optoelectronic/LED    photoelectric   
File Size223KB,8 Pages
ManufacturerHP(Keysight)
Websitehttp://www.semiconductor.agilent.com/
Download Datasheet Parametric Compare View All

HSMD-H670 Overview

Surface Mount Flip Chip LEDs

HSMD-H670 Parametric

Parameter NameAttribute value
MakerHP(Keysight)
Reach Compliance Codeunknow
color@wavelengthAmbe
Maximum forward current0.02 A
Maximum forward voltage2.6 V
Lens typeDIFFUSED
minimum luminous intensity165 cd
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
total height1.1 mm
peak wavelength606 nm
Maximum reverse voltage5 V
perspective
H
Surface Mount Flip Chip LEDs
Technical Data
HSMX-H670 Series
HSMX-H690 Series
Features
• Improved Reliability
Through Elimination of
Internal Wire Bond
• -40 to 85
°
C Operating
Temperature Range
• Small Size
• Industry Standard Footprint
• Diffused Optics
• Compatible with IR
Solder Process
• Four Colors Available
• Available in 8 mm Tape on 7"
(178 mm) Diameter Reels
Description
The HSMX-H670 and HSMX-H690
introduce a revolutionary concept
to the world of LEDs. The internal
flip chip construction eliminates
the wire bond between the chip
and printed circuit board.
Consequently as a result of the
robust construction, product
reliability is greatly improved.
The HSMX-H670 and HSMX-H690
are available in four colors. The
HSMX-H670 adheres to the
industry standard 2.0 x 1.25 mm
footprint and is intended for
designs where space is limited.
The small size, low 1.1 mm profile
and wide viewing angle make these
LEDs excellent for backlighting
applications and front panel
illumination. The HSMX-H690
adheres to the 1.6 x 0.8 mm
Applications
• Keypad Backlighting
• LCD Backlighting
• Symbol Backlighting
• Front Panel Indicator
industry standard footprint. The
low 0.6 mm profile make this
excellent for designs where
space is limited.
Both packages are compatible
with IR and convective reflow
soldering processes.
Device Selection Guide
Footprint
(mm)
[1][2]
1.6 x 0.8 x 0.6
2.0 x 1.25 x 1.1
High
Efficiency
Red
HSMS-H690
HSMS-H670
Orange
HSMD-H690
HSMD-H670
Yellow
HSMY-H690
HSMY-H670
Green
HSMG-H690
HSMG-H670
Notes:
1. Dimensions in mm.
2. Tolerance
±
0.1 mm unless otherwise noted.

HSMD-H670 Related Products

HSMD-H670 HSMD-H690 HSMG-H670 HSMG-H690 HSMS-H690 HSMS-H670 HSMX-H670 HSMX-H690 HSMY-H670 HSMY-H690
Description Surface Mount Flip Chip LEDs Surface Mount Flip Chip LEDs Aluminum Electrolytic Radial Lead Low Impedance Capacitor; Capacitance: 3300uF; Voltage: 25V; Case Size: 16x35.5 mm; Packaging: Bulk Surface Mount Flip Chip LEDs Surface Mount Flip Chip LEDs Surface Mount Flip Chip LEDs Surface Mount Flip Chip LEDs Surface Mount Flip Chip LEDs Surface Mount Flip Chip LEDs Surface Mount Flip Chip LEDs
Reach Compliance Code unknow unknow unknow unknow unknow unknow - - unknow unknow
color@wavelength Ambe Ambe Gree Gree Red Red - - Yellow Yellow
Maximum forward current 0.02 A 0.02 A 0.02 A 0.02 A 0.02 A 0.02 A - - 0.02 A 0.02 A
Maximum forward voltage 2.6 V 2.6 V 2.6 V 2.6 V 2.6 V 2.6 V - - 2.6 V 2.6 V
Lens type DIFFUSED DIFFUSED DIFFUSED DIFFUSED DIFFUSED DIFFUSED - - DIFFUSED DIFFUSED
minimum luminous intensity 165 cd 165 cd 165 cd 165 cd 165 cd 165 cd - - 165 cd 165 cd
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C - - 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C - - -40 °C -40 °C
total height 1.1 mm 0.6 mm 1.1 mm 0.6 mm 0.6 mm 1.1 mm - - 1.1 mm 0.6 mm
peak wavelength 606 nm 606 nm 566 nm 566 nm 639 nm 639 nm - - 584 nm 584 nm
Maximum reverse voltage 5 V 5 V 5 V 5 V 5 V 5 V - - 5 V 5 V
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