H
Surface Mount Flip Chip LEDs
Technical Data
HSMX-H670 Series
HSMX-H690 Series
Features
• Improved Reliability
Through Elimination of
Internal Wire Bond
• -40 to 85
°
C Operating
Temperature Range
• Small Size
• Industry Standard Footprint
• Diffused Optics
• Compatible with IR
Solder Process
• Four Colors Available
• Available in 8 mm Tape on 7"
(178 mm) Diameter Reels
Description
The HSMX-H670 and HSMX-H690
introduce a revolutionary concept
to the world of LEDs. The internal
flip chip construction eliminates
the wire bond between the chip
and printed circuit board.
Consequently as a result of the
robust construction, product
reliability is greatly improved.
The HSMX-H670 and HSMX-H690
are available in four colors. The
HSMX-H670 adheres to the
industry standard 2.0 x 1.25 mm
footprint and is intended for
designs where space is limited.
The small size, low 1.1 mm profile
and wide viewing angle make these
LEDs excellent for backlighting
applications and front panel
illumination. The HSMX-H690
adheres to the 1.6 x 0.8 mm
Applications
• Keypad Backlighting
• LCD Backlighting
• Symbol Backlighting
• Front Panel Indicator
industry standard footprint. The
low 0.6 mm profile make this
excellent for designs where
space is limited.
Both packages are compatible
with IR and convective reflow
soldering processes.
Device Selection Guide
Footprint
(mm)
[1][2]
1.6 x 0.8 x 0.6
2.0 x 1.25 x 1.1
High
Efficiency
Red
HSMS-H690
HSMS-H670
Orange
HSMD-H690
HSMD-H670
Yellow
HSMY-H690
HSMY-H670
Green
HSMG-H690
HSMG-H670
Notes:
1. Dimensions in mm.
2. Tolerance
±
0.1 mm unless otherwise noted.
Package Dimensions
HSMX-H670 Series
CATHODE MARK
POLARITY
HSMX-H690 Series
POLARITY
2.00
(0.079)
1.27
(0.050)
1.10
(0.043)
1.25
(0.049)
0.50 (0.020)
0.40
(0.016)
0.40 (0.016)
0.48 (0.019)
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS (INCHES).
2. TOLERANCE, UNLESS OTHERWISE SPECIFIED,
±
0.1 mm (± 0.004 INCH).
3. THE LEADS ARE GOLD PLATED; PLATING THICKNESS IS: GOLD – 0.05
MICRONS, NICKEL – 3 MICRONS, COPPER –18 MICRONS.
,
1.00
1.60
0.60
0.30
0.80
TOPSIDE
CATHODE
MARK
BOTTOMSIDE CATHODE MARK
Absolute Maximum Ratings at T
A
= 25
°
C
Parameter
DC Forward Current
[1]
Power Dissipation
Reverse Voltage (I
R
= 100
µA)
Operating Temperature Range
Storage Temperature Range
[2]
HSMX-H670
20
50
5
-40 to +85
-40 to +85
HSMX-H690
20
50
5
-40 to +85
-40 to +85
Units
mA
mW
V
°C
°C
Notes:
1. Derate linearly as shown in Figure 4 for temperatures above 25°C.
2. Maximum temperature for tape and reel packaging is 60°C.
Optical Characteristics at T
A
= 25
°
C
Luminous
Intensity
Peak
I
V
(mcd)
Wavelength
[1]
@ I
F
= 20 mA
λ
peak
(nm)
Min.
Typ.
Typ.
1.6
1.6
1.6
4.0
5.0
4.0
5.0
9.0
639
606
584
566
Color,
Viewing
Dominant
Angle
Wavelength
2θ
1/2
[2]
(nm)
λ
d
Degrees
[3]
Typ.
Typ.
626
604
586
571
165
165
165
165
Luminous
Efficacy
η
v
(lm/W)
Part
Number
HSMS-H6X0
Color
High
Efficiency
Red
Orange
Yellow
Green
145
380
500
595
HSMD-H6X0
HSMY-H6X0
HSMG-H6X0
Notes:
1. The luminous intensity I
V
is measured at the peak of the spatial radiation pattern which may not be aligned with the
mechanical axis of the lamp package.
2. The dominant wavelength
λ
d
is derived from the CIE Chromaticity Diagram and represents the perceived color of the device.
3.
θ
1/2
is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
Electrical Characteristics at T
A
= 25
°
C
Forward
Voltage
V
F
(Volts)
@ I
F
= 20 mA
Typ.
Max.
2.0
2.0
2.1
2.3
2.6
2.6
2.6
2.6
Reverse
Breakdown
V
R
(Volts)
@ I
R
= 100
µ
A
Min.
5
5
5
5
Capacitance
C (pF),
V
F
= 0,
f = 1 MHz
Typ.
6
5
5
5
Thermal
Resistance
Rθ
J-PIN
(
°
C/W)
250
250
250
250
Part
Number
HSMS-H670
HSMS-H690
HSMD-H670
HSMD-H690
HSMY-H670
HSMY-H690
HSMG-H670
HSMG-H690
Color
High Efficiency
Red
Orange
Yellow
Green
Green Color Bins
[1]
Bin ID
A
B
C
D
E
F
G
H
J
Minimum (nm)
561.0
564.0
567.0
570.0
573.0
561.0
564.0
567.0
570.0
Maximum (nm)
565.0
568.0
571.0
574.0
577.0
568.0
571.0
574.0
577.0
Notes
Bin A & Bin B
Bin B & Bin C
Bin C & Bin D
Bin D & Bin E
Yellow Color Bins
[1]
Bin ID
A
B
C
D
E
F
G
H
J
Minimum (nm)
581.5
584.0
586.5
589.0
581.5
584.0
586.5
591.5
594.0
Maximum (nm)
585.0
587.5
590.0
592.5
587.5
590.0
592.5
595.0
597.5
Notes
Bin A & Bin B
Bin B & Bin C
Bin C & Bin D
Luminous Intensity Bin Limits
[1]
Bin ID
A
B
C
D
E
F
G
H
J
K
L
M
N
P
Q
R
S
T
U
V
W
X
Y
Minimum (med)
0.10
0.16
0.25
0.40
0.63
1.00
1.60
2.50
4.00
6.30
10.00
16.00
25.00
40.00
63.00
100.00
160.00
250.00
400.00
630.00
1000.00
1600.00
2500.00
Maximum (med)
0.20
0.32
0.50
0.80
1.25
2.00
3.20
5.00
8.00
12.50
20.00
32.00
50.00
80.00
125.00
200.00
320.00
500.00
800.00
1250.00
2000.00
3200.00
5000.00
Note:
1. Bin categories are established for classification of products. Products may not be available in all bin categories.
Please contact your Hewlett-Packard representative for information on currently available bins.
1.0
GREEN
ORANGE
RELATIVE INTENSITY
HIGH EFFICIENCY RED
0.5
YELLOW
0
500
550
600
650
700
750
WAVELENGTH – nm
Figure 1. Relative Intensity vs. Wavelength.
20
I
F
– FORWARD CURRENT – mA
1.2
YELLOW
ORANGE
15
HER
GREEN
10
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
1.0
0.8
0.6
0.4
0.2
0
5
0
1.0
1.5
2.0
2.5
3.0
0
5
10
15
20
V
F
– FORWARD VOLTAGE – V
I
DC
– DC FORWARD CURRENT – mA
Figure 2. Forward Current vs. Forward Voltage.
Figure 3. Relative Luminous Intensity vs. DC Forward
Current.
40
I
F
– FORWARD CURRENT – mA
20°
30°
40°
50°
10°
0°
1.0
35
30
25
20
15
10
.8
.6
60°
70°
80°
.4
.2
5
0
0
20
40
60
80
100
90°
10° 20° 30° 40° 50° 60° 70° 80° 90°100°
ANGLE
T
A
– AMBIENT TEMPERATURE – °C
Figure 4. Maximum DC Current vs. Ambient
Temperature.
Figure 5. Intensity vs. Angle.
NORMALIZED INTENSITY
stm32/stm8
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