HSMY-H670 datasheet, PDF - EEWORLD Datasheet

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HSMY-H670: DescriptionSurface Mount Flip Chip LEDs; CategoryLED optoelectronic/LED photoelectric; File Size223KB，8 Pages; ManufacturerHP（Keysight）; Websitehttp://www.semiconductor.agilent.com/

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HSMY-H670 Overview

Surface Mount Flip Chip LEDs

HSMY-H670 Parametric

Parameter Name	Attribute value
Maker	HP（Keysight）
Reach Compliance Code	unknow
color@wavelength	Yellow
Maximum forward current	0.02 A
Maximum forward voltage	2.6 V
Lens type	DIFFUSED
minimum luminous intensity	165 cd
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
total height	1.1 mm
peak wavelength	584 nm
Maximum reverse voltage	5 V
perspective

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Surface Mount Flip Chip LEDs

Technical Data

HSMX-H670 Series

HSMX-H690 Series

Features

• Improved Reliability

Through Elimination of

Internal Wire Bond

• -40 to 85

C Operating

Temperature Range

• Small Size

• Industry Standard Footprint

• Diffused Optics

• Compatible with IR

Solder Process

• Four Colors Available

• Available in 8 mm Tape on 7"

(178 mm) Diameter Reels

Description

The HSMX-H670 and HSMX-H690

introduce a revolutionary concept

to the world of LEDs. The internal

flip chip construction eliminates

the wire bond between the chip

and printed circuit board.

Consequently as a result of the

robust construction, product

reliability is greatly improved.

The HSMX-H670 and HSMX-H690

are available in four colors. The

HSMX-H670 adheres to the

industry standard 2.0 x 1.25 mm

footprint and is intended for

designs where space is limited.

The small size, low 1.1 mm profile

and wide viewing angle make these

LEDs excellent for backlighting

applications and front panel

illumination. The HSMX-H690

adheres to the 1.6 x 0.8 mm

Applications

• Keypad Backlighting

• LCD Backlighting

• Symbol Backlighting

• Front Panel Indicator

industry standard footprint. The

low 0.6 mm profile make this

excellent for designs where

space is limited.

Both packages are compatible

with IR and convective reflow

soldering processes.

Device Selection Guide

Footprint

(mm)

[1][2]

1.6 x 0.8 x 0.6

2.0 x 1.25 x 1.1

High

Efficiency

Red

HSMS-H690

HSMS-H670

Orange

HSMD-H690

HSMD-H670

Yellow

HSMY-H690

HSMY-H670

Green

HSMG-H690

HSMG-H670

Notes:

1. Dimensions in mm.

2. Tolerance

0.1 mm unless otherwise noted.

HSMY-H670 Related Products

	HSMY-H670	HSMD-H690	HSMD-H670	HSMG-H670	HSMG-H690	HSMS-H690	HSMS-H670	HSMX-H670	HSMX-H690	HSMY-H690
Description	Surface Mount Flip Chip LEDs	Surface Mount Flip Chip LEDs	Surface Mount Flip Chip LEDs	Aluminum Electrolytic Radial Lead Low Impedance Capacitor; Capacitance: 3300uF; Voltage: 25V; Case Size: 16x35.5 mm; Packaging: Bulk	Surface Mount Flip Chip LEDs	Surface Mount Flip Chip LEDs	Surface Mount Flip Chip LEDs	Surface Mount Flip Chip LEDs	Surface Mount Flip Chip LEDs	Surface Mount Flip Chip LEDs
Reach Compliance Code	unknow	unknow	unknow	unknow	unknow	unknow	unknow	-	-	unknow
color@wavelength	Yellow	Ambe	Ambe	Gree	Gree	Red	Red	-	-	Yellow
Maximum forward current	0.02 A	0.02 A	0.02 A	0.02 A	0.02 A	0.02 A	0.02 A	-	-	0.02 A
Maximum forward voltage	2.6 V	2.6 V	2.6 V	2.6 V	2.6 V	2.6 V	2.6 V	-	-	2.6 V
Lens type	DIFFUSED	DIFFUSED	DIFFUSED	DIFFUSED	DIFFUSED	DIFFUSED	DIFFUSED	-	-	DIFFUSED
minimum luminous intensity	165 cd	165 cd	165 cd	165 cd	165 cd	165 cd	165 cd	-	-	165 cd
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	-	-	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-	-	-40 °C
total height	1.1 mm	0.6 mm	1.1 mm	1.1 mm	0.6 mm	0.6 mm	1.1 mm	-	-	0.6 mm
peak wavelength	584 nm	606 nm	606 nm	566 nm	566 nm	639 nm	639 nm	-	-	584 nm
Maximum reverse voltage	5 V	5 V	5 V	5 V	5 V	5 V	5 V	-	-	5 V

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