PMADG507AKN Related Products
|
PMADG507AKN |
PMADG506ATE/883B |
PMADG506AKP |
PMADG506ATE |
PMADG506AKN |
PMADG506ABQ |
PMADG507AKP |
PMADG507ATQ |
| Description |
PMADG507AKN |
PMADG506ATE/883B |
PMADG506AKP |
PMADG506ATE |
PMADG506AKN |
PMADG506ABQ |
PMADG507AKP |
PMADG507ATQ |
| Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
incompatible |
| Maker |
ADI |
ADI |
ADI |
ADI |
ADI |
ADI |
ADI |
ADI |
| Reach Compliance Code |
unknown |
unknown |
unknown |
unknown |
unknown |
unknown |
unknown |
unknown |
| Analog Integrated Circuits - Other Types |
DIFFERENTIAL MULTIPLEXER |
SINGLE-ENDED MULTIPLEXER |
SINGLE-ENDED MULTIPLEXER |
SINGLE-ENDED MULTIPLEXER |
SINGLE-ENDED MULTIPLEXER |
SINGLE-ENDED MULTIPLEXER |
DIFFERENTIAL MULTIPLEXER |
DIFFERENTIAL MULTIPLEXER |
| JESD-30 code |
R-PDIP-T28 |
S-XQCC-N28 |
S-PQCC-J28 |
S-XQCC-N28 |
R-PDIP-T28 |
R-XDIP-T28 |
S-PQCC-J28 |
R-XDIP-T28 |
| JESD-609 code |
e0 |
e0 |
e0 |
e0 |
e0 |
e0 |
e0 |
e0 |
| Number of channels |
8 |
16 |
16 |
16 |
16 |
16 |
8 |
8 |
| Number of functions |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
| Number of terminals |
28 |
28 |
28 |
28 |
28 |
28 |
28 |
28 |
| Maximum on-state resistance (Ron) |
1000 Ω |
1000 Ω |
1000 Ω |
1000 Ω |
1000 Ω |
1000 Ω |
1000 Ω |
1000 Ω |
| Maximum operating temperature |
85 °C |
125 °C |
85 °C |
125 °C |
85 °C |
85 °C |
85 °C |
125 °C |
| Minimum operating temperature |
-40 °C |
-55 °C |
-40 °C |
-55 °C |
-40 °C |
-40 °C |
-40 °C |
-55 °C |
| Package body material |
PLASTIC/EPOXY |
CERAMIC |
PLASTIC/EPOXY |
CERAMIC |
PLASTIC/EPOXY |
CERAMIC |
PLASTIC/EPOXY |
CERAMIC |
| encapsulated code |
DIP |
QCCN |
QCCJ |
QCCN |
DIP |
DIP |
QCCJ |
DIP |
| Encapsulate equivalent code |
DIP28,.6 |
LCC28,.45SQ |
LDCC28,.5SQ |
LCC28,.45SQ |
DIP28,.6 |
DIP28,.6 |
LDCC28,.5SQ |
DIP28,.6 |
| Package shape |
RECTANGULAR |
SQUARE |
SQUARE |
SQUARE |
RECTANGULAR |
RECTANGULAR |
SQUARE |
RECTANGULAR |
| Package form |
IN-LINE |
CHIP CARRIER |
CHIP CARRIER |
CHIP CARRIER |
IN-LINE |
IN-LINE |
CHIP CARRIER |
IN-LINE |
| power supply |
12/15,GND/-12/-15 V |
12/15,GND/-12/-15 V |
12/15,GND/-12/-15 V |
12/15,GND/-12/-15 V |
12/15,GND/-12/-15 V |
12/15,GND/-12/-15 V |
12/15,GND/-12/-15 V |
12/15,GND/-12/-15 V |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
| Maximum signal current |
0.02 A |
0.03 A |
0.02 A |
0.02 A |
0.02 A |
0.02 A |
0.02 A |
0.02 A |
| Maximum supply current (Isup) |
1.5 mA |
1.5 mA |
1.5 mA |
1.5 mA |
1.5 mA |
1.5 mA |
1.5 mA |
1.5 mA |
| surface mount |
NO |
YES |
YES |
YES |
NO |
NO |
YES |
NO |
| Maximum connection time |
450 ns |
600 ns |
450 ns |
450 ns |
450 ns |
450 ns |
450 ns |
450 ns |
| switch |
BREAK-BEFORE-MAKE |
BREAK-BEFORE-MAKE |
BREAK-BEFORE-MAKE |
BREAK-BEFORE-MAKE |
BREAK-BEFORE-MAKE |
BREAK-BEFORE-MAKE |
BREAK-BEFORE-MAKE |
BREAK-BEFORE-MAKE |
| technology |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
| Temperature level |
INDUSTRIAL |
MILITARY |
INDUSTRIAL |
MILITARY |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
MILITARY |
| Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
| Terminal form |
THROUGH-HOLE |
NO LEAD |
J BEND |
NO LEAD |
THROUGH-HOLE |
THROUGH-HOLE |
J BEND |
THROUGH-HOLE |
| Terminal pitch |
2.54 mm |
1.27 mm |
1.27 mm |
1.27 mm |
2.54 mm |
2.54 mm |
1.27 mm |
2.54 mm |
| Terminal location |
DUAL |
QUAD |
QUAD |
QUAD |
DUAL |
DUAL |
QUAD |
DUAL |
| Base Number Matches |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
- |