PMADG506ATE/883B
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | ADI |
| Reach Compliance Code | unknown |
| Analog Integrated Circuits - Other Types | SINGLE-ENDED MULTIPLEXER |
| JESD-30 code | S-XQCC-N28 |
| JESD-609 code | e0 |
| Number of channels | 16 |
| Number of functions | 1 |
| Number of terminals | 28 |
| Maximum on-state resistance (Ron) | 1000 Ω |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC |
| encapsulated code | QCCN |
| Encapsulate equivalent code | LCC28,.45SQ |
| Package shape | SQUARE |
| Package form | CHIP CARRIER |
| power supply | 12/15,GND/-12/-15 V |
| Certification status | Not Qualified |
| Filter level | 38535Q/M;38534H;883B |
| Maximum signal current | 0.03 A |
| Maximum supply current (Isup) | 1.5 mA |
| surface mount | YES |
| Maximum connection time | 600 ns |
| switch | BREAK-BEFORE-MAKE |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | NO LEAD |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| Base Number Matches | 1 |
| PMADG506ATE/883B | PMADG506AKP | PMADG506ATE | PMADG506AKN | PMADG506ABQ | PMADG507AKN | PMADG507AKP | PMADG507ATQ | |
|---|---|---|---|---|---|---|---|---|
| Description | PMADG506ATE/883B | PMADG506AKP | PMADG506ATE | PMADG506AKN | PMADG506ABQ | PMADG507AKN | PMADG507AKP | PMADG507ATQ |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | ADI | ADI | ADI | ADI | ADI | ADI | ADI | ADI |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| Analog Integrated Circuits - Other Types | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | DIFFERENTIAL MULTIPLEXER | DIFFERENTIAL MULTIPLEXER | DIFFERENTIAL MULTIPLEXER |
| JESD-30 code | S-XQCC-N28 | S-PQCC-J28 | S-XQCC-N28 | R-PDIP-T28 | R-XDIP-T28 | R-PDIP-T28 | S-PQCC-J28 | R-XDIP-T28 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| Number of channels | 16 | 16 | 16 | 16 | 16 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
| Maximum on-state resistance (Ron) | 1000 Ω | 1000 Ω | 1000 Ω | 1000 Ω | 1000 Ω | 1000 Ω | 1000 Ω | 1000 Ω |
| Maximum operating temperature | 125 °C | 85 °C | 125 °C | 85 °C | 85 °C | 85 °C | 85 °C | 125 °C |
| Minimum operating temperature | -55 °C | -40 °C | -55 °C | -40 °C | -40 °C | -40 °C | -40 °C | -55 °C |
| Package body material | CERAMIC | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC |
| encapsulated code | QCCN | QCCJ | QCCN | DIP | DIP | DIP | QCCJ | DIP |
| Encapsulate equivalent code | LCC28,.45SQ | LDCC28,.5SQ | LCC28,.45SQ | DIP28,.6 | DIP28,.6 | DIP28,.6 | LDCC28,.5SQ | DIP28,.6 |
| Package shape | SQUARE | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR |
| Package form | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER | IN-LINE |
| power supply | 12/15,GND/-12/-15 V | 12/15,GND/-12/-15 V | 12/15,GND/-12/-15 V | 12/15,GND/-12/-15 V | 12/15,GND/-12/-15 V | 12/15,GND/-12/-15 V | 12/15,GND/-12/-15 V | 12/15,GND/-12/-15 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum signal current | 0.03 A | 0.02 A | 0.02 A | 0.02 A | 0.02 A | 0.02 A | 0.02 A | 0.02 A |
| Maximum supply current (Isup) | 1.5 mA | 1.5 mA | 1.5 mA | 1.5 mA | 1.5 mA | 1.5 mA | 1.5 mA | 1.5 mA |
| surface mount | YES | YES | YES | NO | NO | NO | YES | NO |
| Maximum connection time | 600 ns | 450 ns | 450 ns | 450 ns | 450 ns | 450 ns | 450 ns | 450 ns |
| switch | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | INDUSTRIAL | MILITARY | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | NO LEAD | J BEND | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | J BEND | THROUGH-HOLE |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm |
| Terminal location | QUAD | QUAD | QUAD | DUAL | DUAL | DUAL | QUAD | DUAL |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - |
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