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CD4052BCM

Description
4-CHANNEL, DIFFERENTIAL MULTIPLEXER, PDSO16, 0.150 INCH, PLASTIC, SOP-16
CategoryAnalog mixed-signal IC    The signal circuit   
File Size434KB,12 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
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CD4052BCM Overview

4-CHANNEL, DIFFERENTIAL MULTIPLEXER, PDSO16, 0.150 INCH, PLASTIC, SOP-16

CD4052BCM Parametric

Parameter NameAttribute value
MakerTexas Instruments
Parts packaging codeSOIC
package instructionSOP-16
Contacts16
Reach Compliance Codecompliant
Analog Integrated Circuits - Other TypesDIFFERENTIAL MULTIPLEXER
JESD-30 codeR-PDSO-G16
length9.902 mm
Number of channels4
Number of functions1
Number of terminals16
On-state resistance matching specifications10 Ω
Maximum on-state resistance (Ron)400 Ω
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeLSOP
Encapsulate equivalent codeSOP16,.25
Package shapeRECTANGULAR
Package formSMALL OUTLINE, LOW PROFILE
power supply5/15 V
Certification statusNot Qualified
Maximum seat height1.549 mm
Maximum supply voltage (Vsup)15 V
Minimum supply voltage (Vsup)5 V
Nominal supply voltage (Vsup)10 V
surface mountYES
Maximum disconnect time420 ns
Maximum connection time1200 ns
switchBREAK-BEFORE-MAKE
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
width3.899 mm
Base Number Matches1

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Description 4-CHANNEL, DIFFERENTIAL MULTIPLEXER, PDSO16, 0.150 INCH, PLASTIC, SOP-16 SGL ENDED MULTIPLEXER DIFFERENTIAL MULTIPLEXER 8-CHANNEL, SGL ENDED MULTIPLEXER, PDSO16, 0.150 INCH, PLASTIC, SOP-16 SGL ENDED MULTIPLEXER SGL ENDED MULTIPLEXER DIFFERENTIAL MULTIPLEXER SGL ENDED MULTIPLEXER SGL ENDED MULTIPLEXER IC,ANALOG MUX,SINGLE,8-CHANNEL,CMOS,DIP,16PIN,PLASTIC
Maker Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments
package instruction SOP-16 DIP-16 DIP, DIP16,.3 SOP, SOP16,.25 DIP, DIP16,.3 DIP, DIP16,.3 DIP, DIP16,.3 DIP, DIP16,.3 LSOP, SOP16,.25 DIP, DIP16,.3
Reach Compliance Code compliant unknown unknown unknown unknown unknown unknown unknown unknown unknown
Analog Integrated Circuits - Other Types DIFFERENTIAL MULTIPLEXER SINGLE-ENDED MULTIPLEXER DIFFERENTIAL MULTIPLEXER SINGLE-ENDED MULTIPLEXER SINGLE-ENDED MULTIPLEXER SINGLE-ENDED MULTIPLEXER DIFFERENTIAL MULTIPLEXER SINGLE-ENDED MULTIPLEXER SINGLE-ENDED MULTIPLEXER DIFFERENTIAL MULTIPLEXER
JESD-30 code R-PDSO-G16 R-GDIP-T16 R-GDIP-T16 R-PDSO-G16 R-GDIP-T16 R-GDIP-T16 R-GDIP-T16 R-GDIP-T16 R-PDSO-G16 R-PDIP-T16
Number of channels 4 2 4 8 8 8 4 2 2 8
Number of functions 1 3 1 1 1 1 1 3 3 1
Number of terminals 16 16 16 16 16 16 16 16 16 16
Maximum on-state resistance (Ron) 400 Ω 400 Ω 400 Ω 400 Ω 400 Ω 400 Ω 400 Ω 400 Ω 400 Ω 1200 Ω
Maximum operating temperature 85 °C 125 °C 85 °C 85 °C 85 °C 125 °C 125 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -55 °C -40 °C -40 °C -40 °C -55 °C -55 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED PLASTIC/EPOXY CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LSOP DIP DIP SOP DIP DIP DIP DIP LSOP DIP
Encapsulate equivalent code SOP16,.25 DIP16,.3 DIP16,.3 SOP16,.25 DIP16,.3 DIP16,.3 DIP16,.3 DIP16,.3 SOP16,.25 DIP16,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, LOW PROFILE IN-LINE IN-LINE SMALL OUTLINE IN-LINE IN-LINE IN-LINE IN-LINE SMALL OUTLINE, LOW PROFILE IN-LINE
power supply 5/15 V 5/15 V 5/15 V 5/15 V 5/15 V 5/15 V 5/15 V 5/15 V 5/15 V 5/15 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
surface mount YES NO NO YES NO NO NO NO YES NO
switch BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL MILITARY INDUSTRIAL INDUSTRIAL INDUSTRIAL MILITARY MILITARY INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form GULL WING THROUGH-HOLE THROUGH-HOLE GULL WING THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE GULL WING THROUGH-HOLE
Terminal pitch 1.27 mm 2.54 mm 2.54 mm 1.27 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 1.27 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Parts packaging code SOIC DIP DIP - DIP DIP DIP DIP SOIC -
Contacts 16 16 16 - 16 16 16 16 16 -
length 9.902 mm 19.94 mm 19.94 mm 9.902 mm 19.94 mm 19.94 mm 19.94 mm 19.94 mm 9.902 mm -
On-state resistance matching specifications 10 Ω 10 Ω 10 Ω 10 Ω 10 Ω 10 Ω 10 Ω 10 Ω 10 Ω -
Maximum seat height 1.549 mm 5.08 mm 5.08 mm 1.753 mm 5.08 mm 5.08 mm 5.08 mm 5.08 mm 1.549 mm -
Maximum supply voltage (Vsup) 15 V 15 V 15 V 15 V 15 V 15 V 15 V 15 V 15 V -
Minimum supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V -
Nominal supply voltage (Vsup) 10 V 10 V 10 V 10 V 10 V 10 V 10 V 10 V 10 V -
Maximum disconnect time 420 ns 420 ns 420 ns 420 ns 420 ns 420 ns 420 ns 420 ns 420 ns -
Maximum connection time 1200 ns 1200 ns 1200 ns 1200 ns 1200 ns 1200 ns 1200 ns 1200 ns 1200 ns -
width 3.899 mm 7.62 mm 7.62 mm 3.9 mm 7.62 mm 7.62 mm 7.62 mm 7.62 mm 3.899 mm -
Other features - LG-MAX LG-MAX - LG-MAX LG-MAX LG-MAX LG-MAX - -
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