CD4052BMJ datasheet, PDF - EEWORLD Datasheet

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CD4052BMJ: DescriptionDIFFERENTIAL MULTIPLEXER; CategoryAnalog mixed-signal IC The signal circuit; File Size434KB，12 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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CD4052BMJ Overview

DIFFERENTIAL MULTIPLEXER

CD4052BMJ Parametric

Parameter Name	Attribute value
Maker	Texas Instruments
Parts packaging code	DIP
package instruction	DIP, DIP16,.3
Contacts	16
Reach Compliance Code	unknown
Other features	LG-MAX
Analog Integrated Circuits - Other Types	DIFFERENTIAL MULTIPLEXER
JESD-30 code	R-GDIP-T16
length	19.94 mm
Number of channels	4
Number of functions	1
Number of terminals	16
On-state resistance matching specifications	10 Ω
Maximum on-state resistance (Ron)	400 Ω
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5/15 V
Certification status	Not Qualified
Maximum seat height	5.08 mm
Maximum supply voltage (Vsup)	15 V
Minimum supply voltage (Vsup)	5 V
Nominal supply voltage (Vsup)	10 V
surface mount	NO
Maximum disconnect time	420 ns
Maximum connection time	1200 ns
switch	BREAK-BEFORE-MAKE
technology	CMOS
Temperature level	MILITARY
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	7.62 mm

CD4052BMJ Related Products

	CD4052BMJ	CD4053BMJ	CD4052BCM	CD4052BCJ	CD4051BCM	CD4051BCJ	CD4051BMJ	CD4053BCJ	CD4053BCM	CD4051BC
Description	DIFFERENTIAL MULTIPLEXER	SGL ENDED MULTIPLEXER	4-CHANNEL, DIFFERENTIAL MULTIPLEXER, PDSO16, 0.150 INCH, PLASTIC, SOP-16	DIFFERENTIAL MULTIPLEXER	8-CHANNEL, SGL ENDED MULTIPLEXER, PDSO16, 0.150 INCH, PLASTIC, SOP-16	SGL ENDED MULTIPLEXER	SGL ENDED MULTIPLEXER	SGL ENDED MULTIPLEXER	SGL ENDED MULTIPLEXER	IC,ANALOG MUX,SINGLE,8-CHANNEL,CMOS,DIP,16PIN,PLASTIC
Maker	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
package instruction	DIP, DIP16,.3	DIP-16	SOP-16	DIP, DIP16,.3	SOP, SOP16,.25	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	LSOP, SOP16,.25	DIP, DIP16,.3
Reach Compliance Code	unknown	unknown	compliant	unknown	unknown	unknown	unknown	unknown	unknown	unknown
Analog Integrated Circuits - Other Types	DIFFERENTIAL MULTIPLEXER	SINGLE-ENDED MULTIPLEXER	DIFFERENTIAL MULTIPLEXER	DIFFERENTIAL MULTIPLEXER	SINGLE-ENDED MULTIPLEXER	SINGLE-ENDED MULTIPLEXER	SINGLE-ENDED MULTIPLEXER	SINGLE-ENDED MULTIPLEXER	SINGLE-ENDED MULTIPLEXER	DIFFERENTIAL MULTIPLEXER
JESD-30 code	R-GDIP-T16	R-GDIP-T16	R-PDSO-G16	R-GDIP-T16	R-PDSO-G16	R-GDIP-T16	R-GDIP-T16	R-GDIP-T16	R-PDSO-G16	R-PDIP-T16
Number of channels	4	2	4	4	8	8	8	2	2	8
Number of functions	1	3	1	1	1	1	1	3	3	1
Number of terminals	16	16	16	16	16	16	16	16	16	16
Maximum on-state resistance (Ron)	400 Ω	400 Ω	400 Ω	400 Ω	400 Ω	400 Ω	400 Ω	400 Ω	400 Ω	1200 Ω
Maximum operating temperature	125 °C	125 °C	85 °C	85 °C	85 °C	85 °C	125 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-55 °C	-55 °C	-40 °C	-40 °C	-40 °C	-40 °C	-55 °C	-40 °C	-40 °C	-40 °C
Package body material	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	DIP	LSOP	DIP	SOP	DIP	DIP	DIP	LSOP	DIP
Encapsulate equivalent code	DIP16,.3	DIP16,.3	SOP16,.25	DIP16,.3	SOP16,.25	DIP16,.3	DIP16,.3	DIP16,.3	SOP16,.25	DIP16,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	SMALL OUTLINE, LOW PROFILE	IN-LINE	SMALL OUTLINE	IN-LINE	IN-LINE	IN-LINE	SMALL OUTLINE, LOW PROFILE	IN-LINE
power supply	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
surface mount	NO	NO	YES	NO	YES	NO	NO	NO	YES	NO
switch	BREAK-BEFORE-MAKE	BREAK-BEFORE-MAKE	BREAK-BEFORE-MAKE	BREAK-BEFORE-MAKE	BREAK-BEFORE-MAKE	BREAK-BEFORE-MAKE	BREAK-BEFORE-MAKE	BREAK-BEFORE-MAKE	BREAK-BEFORE-MAKE	BREAK-BEFORE-MAKE
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	MILITARY	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	THROUGH-HOLE	THROUGH-HOLE	GULL WING	THROUGH-HOLE	GULL WING	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	GULL WING	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	1.27 mm	2.54 mm	1.27 mm	2.54 mm	2.54 mm	2.54 mm	1.27 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Parts packaging code	DIP	DIP	SOIC	DIP	-	DIP	DIP	DIP	SOIC	-
Contacts	16	16	16	16	-	16	16	16	16	-
Other features	LG-MAX	LG-MAX	-	LG-MAX	-	LG-MAX	LG-MAX	LG-MAX	-	-
length	19.94 mm	19.94 mm	9.902 mm	19.94 mm	9.902 mm	19.94 mm	19.94 mm	19.94 mm	9.902 mm	-
On-state resistance matching specifications	10 Ω	10 Ω	10 Ω	10 Ω	10 Ω	10 Ω	10 Ω	10 Ω	10 Ω	-
Maximum seat height	5.08 mm	5.08 mm	1.549 mm	5.08 mm	1.753 mm	5.08 mm	5.08 mm	5.08 mm	1.549 mm	-
Maximum supply voltage (Vsup)	15 V	15 V	15 V	15 V	15 V	15 V	15 V	15 V	15 V	-
Minimum supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	-
Nominal supply voltage (Vsup)	10 V	10 V	10 V	10 V	10 V	10 V	10 V	10 V	10 V	-
Maximum disconnect time	420 ns	420 ns	420 ns	420 ns	420 ns	420 ns	420 ns	420 ns	420 ns	-
Maximum connection time	1200 ns	1200 ns	1200 ns	1200 ns	1200 ns	1200 ns	1200 ns	1200 ns	1200 ns	-
width	7.62 mm	7.62 mm	3.899 mm	7.62 mm	3.9 mm	7.62 mm	7.62 mm	7.62 mm	3.899 mm	-

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