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CD4051BMJ

Description
SGL ENDED MULTIPLEXER
CategoryAnalog mixed-signal IC    The signal circuit   
File Size434KB,12 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
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CD4051BMJ Overview

SGL ENDED MULTIPLEXER

CD4051BMJ Parametric

Parameter NameAttribute value
MakerTexas Instruments
Parts packaging codeDIP
package instructionDIP, DIP16,.3
Contacts16
Reach Compliance Codeunknown
Other featuresLG-MAX
Analog Integrated Circuits - Other TypesSINGLE-ENDED MULTIPLEXER
JESD-30 codeR-GDIP-T16
length19.94 mm
Number of channels8
Number of functions1
Number of terminals16
On-state resistance matching specifications10 Ω
Maximum on-state resistance (Ron)400 Ω
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package body materialCERAMIC, GLASS-SEALED
encapsulated codeDIP
Encapsulate equivalent codeDIP16,.3
Package shapeRECTANGULAR
Package formIN-LINE
power supply5/15 V
Certification statusNot Qualified
Maximum seat height5.08 mm
Maximum supply voltage (Vsup)15 V
Minimum supply voltage (Vsup)5 V
Nominal supply voltage (Vsup)10 V
surface mountNO
Maximum disconnect time420 ns
Maximum connection time1200 ns
switchBREAK-BEFORE-MAKE
technologyCMOS
Temperature levelMILITARY
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
width7.62 mm

CD4051BMJ Related Products

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Description SGL ENDED MULTIPLEXER SGL ENDED MULTIPLEXER 4-CHANNEL, DIFFERENTIAL MULTIPLEXER, PDSO16, 0.150 INCH, PLASTIC, SOP-16 DIFFERENTIAL MULTIPLEXER 8-CHANNEL, SGL ENDED MULTIPLEXER, PDSO16, 0.150 INCH, PLASTIC, SOP-16 SGL ENDED MULTIPLEXER DIFFERENTIAL MULTIPLEXER SGL ENDED MULTIPLEXER SGL ENDED MULTIPLEXER IC,ANALOG MUX,SINGLE,8-CHANNEL,CMOS,DIP,16PIN,PLASTIC
Maker Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments
package instruction DIP, DIP16,.3 DIP-16 SOP-16 DIP, DIP16,.3 SOP, SOP16,.25 DIP, DIP16,.3 DIP, DIP16,.3 DIP, DIP16,.3 LSOP, SOP16,.25 DIP, DIP16,.3
Reach Compliance Code unknown unknown compliant unknown unknown unknown unknown unknown unknown unknown
Analog Integrated Circuits - Other Types SINGLE-ENDED MULTIPLEXER SINGLE-ENDED MULTIPLEXER DIFFERENTIAL MULTIPLEXER DIFFERENTIAL MULTIPLEXER SINGLE-ENDED MULTIPLEXER SINGLE-ENDED MULTIPLEXER DIFFERENTIAL MULTIPLEXER SINGLE-ENDED MULTIPLEXER SINGLE-ENDED MULTIPLEXER DIFFERENTIAL MULTIPLEXER
JESD-30 code R-GDIP-T16 R-GDIP-T16 R-PDSO-G16 R-GDIP-T16 R-PDSO-G16 R-GDIP-T16 R-GDIP-T16 R-GDIP-T16 R-PDSO-G16 R-PDIP-T16
Number of channels 8 2 4 4 8 8 4 2 2 8
Number of functions 1 3 1 1 1 1 1 3 3 1
Number of terminals 16 16 16 16 16 16 16 16 16 16
Maximum on-state resistance (Ron) 400 Ω 400 Ω 400 Ω 400 Ω 400 Ω 400 Ω 400 Ω 400 Ω 400 Ω 1200 Ω
Maximum operating temperature 125 °C 125 °C 85 °C 85 °C 85 °C 85 °C 125 °C 85 °C 85 °C 85 °C
Minimum operating temperature -55 °C -55 °C -40 °C -40 °C -40 °C -40 °C -55 °C -40 °C -40 °C -40 °C
Package body material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED PLASTIC/EPOXY CERAMIC, GLASS-SEALED PLASTIC/EPOXY CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP DIP LSOP DIP SOP DIP DIP DIP LSOP DIP
Encapsulate equivalent code DIP16,.3 DIP16,.3 SOP16,.25 DIP16,.3 SOP16,.25 DIP16,.3 DIP16,.3 DIP16,.3 SOP16,.25 DIP16,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE SMALL OUTLINE, LOW PROFILE IN-LINE SMALL OUTLINE IN-LINE IN-LINE IN-LINE SMALL OUTLINE, LOW PROFILE IN-LINE
power supply 5/15 V 5/15 V 5/15 V 5/15 V 5/15 V 5/15 V 5/15 V 5/15 V 5/15 V 5/15 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
surface mount NO NO YES NO YES NO NO NO YES NO
switch BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level MILITARY MILITARY INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL MILITARY INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form THROUGH-HOLE THROUGH-HOLE GULL WING THROUGH-HOLE GULL WING THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE GULL WING THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 1.27 mm 2.54 mm 1.27 mm 2.54 mm 2.54 mm 2.54 mm 1.27 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Parts packaging code DIP DIP SOIC DIP - DIP DIP DIP SOIC -
Contacts 16 16 16 16 - 16 16 16 16 -
Other features LG-MAX LG-MAX - LG-MAX - LG-MAX LG-MAX LG-MAX - -
length 19.94 mm 19.94 mm 9.902 mm 19.94 mm 9.902 mm 19.94 mm 19.94 mm 19.94 mm 9.902 mm -
On-state resistance matching specifications 10 Ω 10 Ω 10 Ω 10 Ω 10 Ω 10 Ω 10 Ω 10 Ω 10 Ω -
Maximum seat height 5.08 mm 5.08 mm 1.549 mm 5.08 mm 1.753 mm 5.08 mm 5.08 mm 5.08 mm 1.549 mm -
Maximum supply voltage (Vsup) 15 V 15 V 15 V 15 V 15 V 15 V 15 V 15 V 15 V -
Minimum supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V -
Nominal supply voltage (Vsup) 10 V 10 V 10 V 10 V 10 V 10 V 10 V 10 V 10 V -
Maximum disconnect time 420 ns 420 ns 420 ns 420 ns 420 ns 420 ns 420 ns 420 ns 420 ns -
Maximum connection time 1200 ns 1200 ns 1200 ns 1200 ns 1200 ns 1200 ns 1200 ns 1200 ns 1200 ns -
width 7.62 mm 7.62 mm 3.899 mm 7.62 mm 3.9 mm 7.62 mm 7.62 mm 7.62 mm 3.899 mm -
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