IC,PSEUDO-STATIC RAM,128KX8,CMOS,DIP,32PIN,PLASTIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | NXP |
| package instruction | DIP, DIP32,.6 |
| Reach Compliance Code | unknown |
| Maximum access time | 80 ns |
| I/O type | COMMON |
| JESD-30 code | R-PDIP-T32 |
| JESD-609 code | e0 |
| memory density | 1048576 bit |
| memory width | 8 |
| Number of terminals | 32 |
| word count | 131072 words |
| character code | 128000 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 128KX8 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP32,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum standby current | 0.0002 A |
| Minimum standby current | 4.5 V |
| Maximum slew rate | 0.07 mA |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Base Number Matches | 1 |
| MCM51L8128P80 | MCM51L8128F10 | |
|---|---|---|
| Description | IC,PSEUDO-STATIC RAM,128KX8,CMOS,DIP,32PIN,PLASTIC | IC,PSEUDO-STATIC RAM,128KX8,CMOS,SO,32PIN,PLASTIC |
| Is it Rohs certified? | incompatible | incompatible |
| Maker | NXP | NXP |
| package instruction | DIP, DIP32,.6 | SOP, SO32(UNSPEC) |
| Reach Compliance Code | unknown | unknown |
| Maximum access time | 80 ns | 100 ns |
| I/O type | COMMON | COMMON |
| JESD-30 code | R-PDIP-T32 | R-PDSO-G32 |
| JESD-609 code | e0 | e0 |
| memory density | 1048576 bit | 1048576 bit |
| memory width | 8 | 8 |
| Number of terminals | 32 | 32 |
| word count | 131072 words | 131072 words |
| character code | 128000 | 128000 |
| Maximum operating temperature | 70 °C | 70 °C |
| organize | 128KX8 | 128KX8 |
| Output characteristics | 3-STATE | 3-STATE |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | SOP |
| Encapsulate equivalent code | DIP32,.6 | SO32(UNSPEC) |
| Package shape | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | SMALL OUTLINE |
| power supply | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified |
| Maximum standby current | 0.0002 A | 0.0002 A |
| Minimum standby current | 4.5 V | 4.5 V |
| Maximum slew rate | 0.07 mA | 0.07 mA |
| Nominal supply voltage (Vsup) | 5 V | 5 V |
| surface mount | NO | YES |
| technology | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | GULL WING |
| Terminal location | DUAL | DUAL |
| Base Number Matches | 1 | 1 |
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