5962-8868101LX datasheet, PDF - EEWORLD Datasheet

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5962-8868101LX: DescriptionStandard SRAM, 64KX4, 35ns, CMOS, CDIP24, CERAMIC, DIP-24; Categorystorage storage; File Size220KB，8 Pages; ManufacturerCypress Semiconductor

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5962-8868101LX Overview

Standard SRAM, 64KX4, 35ns, CMOS, CDIP24, CERAMIC, DIP-24

5962-8868101LX Parametric

Parameter Name	Attribute value
Parts packaging code	DIP
package instruction	DIP, DIP24,.3
Contacts	24
Reach Compliance Code	unknown
ECCN code	3A001.A.2.C
Maximum access time	35 ns
Other features	AUTOMATIC POWER-DOWN
I/O type	COMMON
JESD-30 code	R-GDIP-T24
JESD-609 code	e0
length	31.877 mm
memory density	262144 bit
Memory IC Type	STANDARD SRAM
memory width	4
Number of functions	1
Number of terminals	24
word count	65536 words
character code	64000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	64KX4
Output characteristics	3-STATE
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Encapsulate equivalent code	DIP24,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
power supply	5 V
Certification status	Not Qualified
Filter level	MIL-STD-883
Maximum seat height	5.08 mm
Maximum standby current	0.02 A
Minimum standby current	4.5 V
Maximum slew rate	0.12 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	TIN LEAD
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	7.62 mm
Base Number Matches	1

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Description	Standard SRAM, 64KX4, 35ns, CMOS, CDIP24, CERAMIC, DIP-24	Standard SRAM, 64KX4, 45ns, CMOS, CDIP28, CERAMIC, DIP-28	Standard SRAM, 64KX4, 45ns, CMOS, CQCC28, CERAMIC, LCC-28	Standard SRAM, 64KX4, 25ns, CMOS, CQCC28, CERAMIC, LCC-28	Standard SRAM, 64KX4, 35ns, CMOS, CQCC28, CERAMIC, LCC-28	Standard SRAM, 64KX4, 25ns, CMOS, CDIP28, CERAMIC, DIP-28	Standard SRAM, 64KX4, 45ns, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP-24	Standard SRAM, 64KX4, 35ns, CMOS, CDIP28, CERAMIC, DIP-28
Parts packaging code	DIP	DIP	QLCC	QLCC	QLCC	DIP	DIP	DIP
package instruction	DIP, DIP24,.3	DIP,	QCCN,	QCCN,	QCCN,	DIP,	DIP, DIP24,.3	DIP,
Contacts	24	28	28	28	28	28	24	28
Reach Compliance Code	unknown	unknow	unknow	unknow	unknow	unknow	unknown	unknown
ECCN code	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C
Maximum access time	35 ns	45 ns	45 ns	25 ns	35 ns	25 ns	45 ns	35 ns
JESD-30 code	R-GDIP-T24	R-GDIP-T28	R-CQCC-N28	R-CQCC-N28	R-CQCC-N28	R-GDIP-T28	R-CDIP-T24	R-GDIP-T28
memory density	262144 bit	262144 bi	262144 bi	262144 bi	262144 bi	262144 bi	262144 bit	262144 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	4	4	4	4	4	4	4	4
Number of functions	1	1	1	1	1	1	1	1
Number of terminals	24	28	28	28	28	28	24	28
word count	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words
character code	64000	64000	64000	64000	64000	64000	64000	64000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
organize	64KX4	64KX4	64KX4	64KX4	64KX4	64KX4	64KX4	64KX4
Package body material	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED
encapsulated code	DIP	DIP	QCCN	QCCN	QCCN	DIP	DIP	DIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	IN-LINE	IN-LINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Filter level	MIL-STD-883	MIL-STD-883	MIL-STD-883	MIL-STD-883	MIL-STD-883	MIL-STD-883	MIL-STD-883	MIL-STD-883
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	YES	YES	YES	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
Terminal form	THROUGH-HOLE	THROUGH-HOLE	NO LEAD	NO LEAD	NO LEAD	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal location	DUAL	DUAL	QUAD	QUAD	QUAD	DUAL	DUAL	DUAL
Base Number Matches	1	1	1	1	1	1	1	1

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