5962-9322501MXX datasheet, PDF

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5962-9322501MXX: DescriptionStandard SRAM, 64KX4, 45ns, CMOS, CDIP28, CERAMIC, DIP-28; Categorystorage storage; File Size220KB，8 Pages; ManufacturerCypress Semiconductor

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Standard SRAM, 64KX4, 45ns, CMOS, CDIP28, CERAMIC, DIP-28

5962-9322501MXX Parametric

Parameter Name	Attribute value
Parts packaging code	DIP
package instruction	DIP,
Contacts	28
Reach Compliance Code	unknow
ECCN code	3A001.A.2.C
Maximum access time	45 ns
JESD-30 code	R-GDIP-T28
memory density	262144 bi
Memory IC Type	STANDARD SRAM
memory width	4
Number of functions	1
Number of terminals	28
word count	65536 words
character code	64000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	64KX4
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Filter level	MIL-STD-883
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal form	THROUGH-HOLE
Terminal location	DUAL
Base Number Matches	1

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Description	Standard SRAM, 64KX4, 45ns, CMOS, CDIP28, CERAMIC, DIP-28	Standard SRAM, 64KX4, 45ns, CMOS, CQCC28, CERAMIC, LCC-28	Standard SRAM, 64KX4, 25ns, CMOS, CQCC28, CERAMIC, LCC-28	Standard SRAM, 64KX4, 35ns, CMOS, CQCC28, CERAMIC, LCC-28	Standard SRAM, 64KX4, 25ns, CMOS, CDIP28, CERAMIC, DIP-28	Standard SRAM, 64KX4, 45ns, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP-24	Standard SRAM, 64KX4, 35ns, CMOS, CDIP28, CERAMIC, DIP-28	Standard SRAM, 64KX4, 35ns, CMOS, CDIP24, CERAMIC, DIP-24
Parts packaging code	DIP	QLCC	QLCC	QLCC	DIP	DIP	DIP	DIP
package instruction	DIP,	QCCN,	QCCN,	QCCN,	DIP,	DIP, DIP24,.3	DIP,	DIP, DIP24,.3
Contacts	28	28	28	28	28	24	28	24
Reach Compliance Code	unknow	unknow	unknow	unknow	unknow	unknown	unknown	unknown
ECCN code	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C
Maximum access time	45 ns	45 ns	25 ns	35 ns	25 ns	45 ns	35 ns	35 ns
JESD-30 code	R-GDIP-T28	R-CQCC-N28	R-CQCC-N28	R-CQCC-N28	R-GDIP-T28	R-CDIP-T24	R-GDIP-T28	R-GDIP-T24
memory density	262144 bi	262144 bi	262144 bi	262144 bi	262144 bi	262144 bit	262144 bit	262144 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	4	4	4	4	4	4	4	4
Number of functions	1	1	1	1	1	1	1	1
Number of terminals	28	28	28	28	28	24	28	24
word count	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words
character code	64000	64000	64000	64000	64000	64000	64000	64000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
organize	64KX4	64KX4	64KX4	64KX4	64KX4	64KX4	64KX4	64KX4
Package body material	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED
encapsulated code	DIP	QCCN	QCCN	QCCN	DIP	DIP	DIP	DIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Filter level	MIL-STD-883	MIL-STD-883	MIL-STD-883	MIL-STD-883	MIL-STD-883	MIL-STD-883	MIL-STD-883	MIL-STD-883
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	YES	YES	YES	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
Terminal form	THROUGH-HOLE	NO LEAD	NO LEAD	NO LEAD	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal location	DUAL	QUAD	QUAD	QUAD	DUAL	DUAL	DUAL	DUAL
Base Number Matches	1	1	1	1	1	1	1	1

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