5962-89711013A datasheet, PDF - EEWORLD Datasheet

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5962-89711013A: DescriptionCorrelator, 1-Bit, CMOS, CQCC28; CategoryThe embedded processor and controller Microcontrollers and processors; File Size312KB，8 Pages; ManufacturerLOGIC Devices; Websitehttp://www.logicdevices.com/

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5962-89711013A Overview

Correlator, 1-Bit, CMOS, CQCC28

5962-89711013A Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
package instruction	QCCN, LCC28,.45SQ
Reach Compliance Code	unknown
ECCN code	3A001.A.2.C
Other features	2 X 1 BIT DATA INPUT BUS; 2 X 1 BIT DATA OUTPUT BUS; OPTEMP SPECIFIED AS TC; ICC SPECIFIED @ 30MHZ
boundary scan	NO
maximum clock frequency	25 MHz
External data bus width	1
JESD-30 code	S-CQCC-N28
JESD-609 code	e0
low power mode	NO
Humidity sensitivity level	3
Number of terminals	28
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Output data bus width	1
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QCCN
Encapsulate equivalent code	LCC28,.45SQ
Package shape	SQUARE
Package form	CHIP CARRIER
Peak Reflow Temperature (Celsius)	225
power supply	5 V
Certification status	Not Qualified
Filter level	38535Q/M;38534H;883B
Maximum slew rate	55 mA
Maximum supply voltage	5.5 V
Minimum supply voltage	4.5 V
Nominal supply voltage	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb) - hot dipped
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
uPs/uCs/peripheral integrated circuit type	DSP PERIPHERAL, CORRELATOR
Base Number Matches	1

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	5962-89711013A	L10C23IC20	L10C23IC30	L10C23IMB35	L10C23IMB60	L10C23IM20	L10C23IM60	L10C23IMB20	L10C23IC50	L10C23IM35
Description	Correlator, 1-Bit, CMOS, CQCC28	Correlator, 1-Bit, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP-24	Correlator, 1-Bit, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP-24	Correlator, 1-Bit, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP-24	Correlator, 1-Bit, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP-24	Correlator, 1-Bit, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP-24	Correlator, 1-Bit, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP-24	Correlator, 1-Bit, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP-24	Correlator, 1-Bit, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP-24	Correlator, 1-Bit, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP-24
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
package instruction	QCCN, LCC28,.45SQ	DIP, DIP24,.3	DIP, DIP24,.3	DIP, DIP24,.3	DIP, DIP24,.3	DIP, DIP24,.3	DIP, DIP24,.3	DIP, DIP24,.3	DIP, DIP24,.3	DIP, DIP24,.3
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknow
Other features	2 X 1 BIT DATA INPUT BUS; 2 X 1 BIT DATA OUTPUT BUS; OPTEMP SPECIFIED AS TC; ICC SPECIFIED @ 30MHZ	SELECTIVE BIT MASK; ICC SPECIFIED @ 5MHZ	SELECTIVE BIT MASK; ICC SPECIFIED @ 5MHZ	SELECTIVE BIT MASK; ICC SPECIFIED @ 5MHZ	SELECTIVE BIT MASK; ICC SPECIFIED @ 5MHZ	SELECTIVE BIT MASK; ICC SPECIFIED @ 5MHZ	SELECTIVE BIT MASK; ICC SPECIFIED @ 5MHZ	SELECTIVE BIT MASK; ICC SPECIFIED @ 5MHZ	SELECTIVE BIT MASK; ICC SPECIFIED @ 5MHZ	SELECTIVE BIT MASK; ICC SPECIFIED @ 5MHZ
boundary scan	NO	NO	NO	NO	NO	NO	NO	NO	NO	NO
maximum clock frequency	25 MHz	50 MHz	35.71 MHz	30.3 MHz	17.24 MHz	50 MHz	17.24 MHz	50 MHz	20 MHz	30.3 MHz
External data bus width	1	1	1	1	1	1	1	1	1	1
JESD-30 code	S-CQCC-N28	R-GDIP-T24	R-GDIP-T24	R-GDIP-T24	R-GDIP-T24	R-GDIP-T24	R-GDIP-T24	R-GDIP-T24	R-GDIP-T24	R-GDIP-T24
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0	e0	e0
low power mode	NO	NO	NO	NO	NO	NO	NO	NO	NO	NO
Humidity sensitivity level	3	3	3	3	3	3	3	3	3	3
Number of terminals	28	24	24	24	24	24	24	24	24	24
Maximum operating temperature	125 °C	70 °C	70 °C	125 °C	125 °C	125 °C	125 °C	125 °C	70 °C	125 °C
Minimum operating temperature	-55 °C	-	-	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-	-55 °C
Output data bus width	1	7	7	7	7	7	7	7	7	7
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED
encapsulated code	QCCN	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP
Encapsulate equivalent code	LCC28,.45SQ	DIP24,.3	DIP24,.3	DIP24,.3	DIP24,.3	DIP24,.3	DIP24,.3	DIP24,.3	DIP24,.3	DIP24,.3
Package shape	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	CHIP CARRIER	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Peak Reflow Temperature (Celsius)	225	225	225	225	225	225	225	225	225	225
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum slew rate	55 mA	100 mA	100 mA	100 mA	100 mA	100 mA	100 mA	100 mA	100 mA	100 mA
Maximum supply voltage	5.5 V	5.25 V	5.25 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.25 V	5.5 V
Minimum supply voltage	4.5 V	4.75 V	4.75 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.75 V	4.5 V
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	NO	NO	NO	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	COMMERCIAL	COMMERCIAL	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	COMMERCIAL	MILITARY
Terminal surface	Tin/Lead (Sn/Pb) - hot dipped	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	NO LEAD	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	1.27 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	QUAD	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
uPs/uCs/peripheral integrated circuit type	DSP PERIPHERAL, CORRELATOR	DSP PERIPHERAL, CORRELATOR	DSP PERIPHERAL, CORRELATOR	DSP PERIPHERAL, CORRELATOR	DSP PERIPHERAL, CORRELATOR	DSP PERIPHERAL, CORRELATOR	DSP PERIPHERAL, CORRELATOR	DSP PERIPHERAL, CORRELATOR	DSP PERIPHERAL, CORRELATOR	DSP PERIPHERAL, CORRELATOR
ECCN code	3A001.A.2.C	3A001.A.3	3A991.A.2	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	-	3A001.A.2.C
Maker	-	LOGIC Devices	-	LOGIC Devices	LOGIC Devices	LOGIC Devices	LOGIC Devices	LOGIC Devices	LOGIC Devices	LOGIC Devices
Parts packaging code	-	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP
Contacts	-	24	24	24	24	24	24	24	24	24
length	-	31.75 mm	31.75 mm	31.75 mm	31.75 mm	31.75 mm	31.75 mm	31.75 mm	31.75 mm	31.75 mm
Maximum seat height	-	5.08 mm	5.08 mm	5.08 mm	5.08 mm	5.08 mm	5.08 mm	5.08 mm	5.08 mm	5.08 mm
width	-	7.62 mm	7.62 mm	7.62 mm	7.62 mm	7.62 mm	7.62 mm	7.62 mm	7.62 mm	7.62 mm

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