Correlator, 1-Bit, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP-24
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | LOGIC Devices |
| Parts packaging code | DIP |
| package instruction | DIP, DIP24,.3 |
| Contacts | 24 |
| Reach Compliance Code | unknown |
| ECCN code | 3A001.A.2.C |
| Other features | SELECTIVE BIT MASK; ICC SPECIFIED @ 5MHZ |
| boundary scan | NO |
| maximum clock frequency | 30.3 MHz |
| External data bus width | 1 |
| JESD-30 code | R-GDIP-T24 |
| JESD-609 code | e0 |
| length | 31.75 mm |
| low power mode | NO |
| Humidity sensitivity level | 3 |
| Number of terminals | 24 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Output data bus width | 7 |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP24,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | 225 |
| power supply | 5 V |
| Certification status | Not Qualified |
| Filter level | 38535Q/M;38534H;883B |
| Maximum seat height | 5.08 mm |
| Maximum slew rate | 100 mA |
| Maximum supply voltage | 5.5 V |
| Minimum supply voltage | 4.5 V |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 7.62 mm |
| uPs/uCs/peripheral integrated circuit type | DSP PERIPHERAL, CORRELATOR |
| L10C23IMB35 | 5962-89711013A | L10C23IC20 | L10C23IC30 | L10C23IMB60 | L10C23IM20 | L10C23IM60 | L10C23IMB20 | L10C23IC50 | L10C23IM35 | |
|---|---|---|---|---|---|---|---|---|---|---|
| Description | Correlator, 1-Bit, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP-24 | Correlator, 1-Bit, CMOS, CQCC28 | Correlator, 1-Bit, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP-24 | Correlator, 1-Bit, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP-24 | Correlator, 1-Bit, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP-24 | Correlator, 1-Bit, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP-24 | Correlator, 1-Bit, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP-24 | Correlator, 1-Bit, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP-24 | Correlator, 1-Bit, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP-24 | Correlator, 1-Bit, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP-24 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| package instruction | DIP, DIP24,.3 | QCCN, LCC28,.45SQ | DIP, DIP24,.3 | DIP, DIP24,.3 | DIP, DIP24,.3 | DIP, DIP24,.3 | DIP, DIP24,.3 | DIP, DIP24,.3 | DIP, DIP24,.3 | DIP, DIP24,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknow |
| Other features | SELECTIVE BIT MASK; ICC SPECIFIED @ 5MHZ | 2 X 1 BIT DATA INPUT BUS; 2 X 1 BIT DATA OUTPUT BUS; OPTEMP SPECIFIED AS TC; ICC SPECIFIED @ 30MHZ | SELECTIVE BIT MASK; ICC SPECIFIED @ 5MHZ | SELECTIVE BIT MASK; ICC SPECIFIED @ 5MHZ | SELECTIVE BIT MASK; ICC SPECIFIED @ 5MHZ | SELECTIVE BIT MASK; ICC SPECIFIED @ 5MHZ | SELECTIVE BIT MASK; ICC SPECIFIED @ 5MHZ | SELECTIVE BIT MASK; ICC SPECIFIED @ 5MHZ | SELECTIVE BIT MASK; ICC SPECIFIED @ 5MHZ | SELECTIVE BIT MASK; ICC SPECIFIED @ 5MHZ |
| boundary scan | NO | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| maximum clock frequency | 30.3 MHz | 25 MHz | 50 MHz | 35.71 MHz | 17.24 MHz | 50 MHz | 17.24 MHz | 50 MHz | 20 MHz | 30.3 MHz |
| External data bus width | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| JESD-30 code | R-GDIP-T24 | S-CQCC-N28 | R-GDIP-T24 | R-GDIP-T24 | R-GDIP-T24 | R-GDIP-T24 | R-GDIP-T24 | R-GDIP-T24 | R-GDIP-T24 | R-GDIP-T24 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| low power mode | NO | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| Humidity sensitivity level | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
| Number of terminals | 24 | 28 | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
| Maximum operating temperature | 125 °C | 125 °C | 70 °C | 70 °C | 125 °C | 125 °C | 125 °C | 125 °C | 70 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | - | - | -55 °C | -55 °C | -55 °C | -55 °C | - | -55 °C |
| Output data bus width | 7 | 1 | 7 | 7 | 7 | 7 | 7 | 7 | 7 | 7 |
| Package body material | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP | QCCN | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP24,.3 | LCC28,.45SQ | DIP24,.3 | DIP24,.3 | DIP24,.3 | DIP24,.3 | DIP24,.3 | DIP24,.3 | DIP24,.3 | DIP24,.3 |
| Package shape | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| Peak Reflow Temperature (Celsius) | 225 | 225 | 225 | 225 | 225 | 225 | 225 | 225 | 225 | 225 |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum slew rate | 100 mA | 55 mA | 100 mA | 100 mA | 100 mA | 100 mA | 100 mA | 100 mA | 100 mA | 100 mA |
| Maximum supply voltage | 5.5 V | 5.5 V | 5.25 V | 5.25 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.25 V | 5.5 V |
| Minimum supply voltage | 4.5 V | 4.5 V | 4.75 V | 4.75 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.75 V | 4.5 V |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | YES | NO | NO | NO | NO | NO | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY | MILITARY | MILITARY | MILITARY | COMMERCIAL | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) - hot dipped | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | QUAD | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| uPs/uCs/peripheral integrated circuit type | DSP PERIPHERAL, CORRELATOR | DSP PERIPHERAL, CORRELATOR | DSP PERIPHERAL, CORRELATOR | DSP PERIPHERAL, CORRELATOR | DSP PERIPHERAL, CORRELATOR | DSP PERIPHERAL, CORRELATOR | DSP PERIPHERAL, CORRELATOR | DSP PERIPHERAL, CORRELATOR | DSP PERIPHERAL, CORRELATOR | DSP PERIPHERAL, CORRELATOR |
| Maker | LOGIC Devices | - | LOGIC Devices | - | LOGIC Devices | LOGIC Devices | LOGIC Devices | LOGIC Devices | LOGIC Devices | LOGIC Devices |
| Parts packaging code | DIP | - | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
| Contacts | 24 | - | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
| ECCN code | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.3 | 3A991.A.2 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | - | 3A001.A.2.C |
| length | 31.75 mm | - | 31.75 mm | 31.75 mm | 31.75 mm | 31.75 mm | 31.75 mm | 31.75 mm | 31.75 mm | 31.75 mm |
| Maximum seat height | 5.08 mm | - | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm |
| width | 7.62 mm | - | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm |
京公网安备 11010802033920号
EEWORLD
