SPECIALTY LOGIC CIRCUIT, CDIP24, CERAMIC, DIP-24
| Parameter Name | Attribute value |
| Maker | Texas Instruments |
| package instruction | DIP, |
| Reach Compliance Code | unknown |
| series | F/FAST |
| JESD-30 code | R-GDIP-T24 |
| Logic integrated circuit type | LOGIC CIRCUIT |
| Number of functions | 1 |
| Number of terminals | 24 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Output characteristics | 3-STATE |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Certification status | Not Qualified |
| Maximum seat height | 4.572 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | TTL |
| Temperature level | MILITARY |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| width | 15.24 mm |
| Base Number Matches | 1 |
| 54F701DM | 54F701FM | 74F701FC | 74F701SC | 74F701PC | |
|---|---|---|---|---|---|
| Description | SPECIALTY LOGIC CIRCUIT, CDIP24, CERAMIC, DIP-24 | SPECIALTY LOGIC CIRCUIT, CDFP24, CERAMIC, FP-24 | SPECIALTY LOGIC CIRCUIT, CDFP24, CERAMIC, FP-24 | SPECIALTY LOGIC CIRCUIT, PDSO24, SOIC-24 | SPECIALTY LOGIC CIRCUIT, PDIP24, PLASTIC, DIP-24 |
| package instruction | DIP, | DFP, | DFP, | SOP, | DIP, |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| series | F/FAST | F/FAST | F/FAST | F/FAST | F/FAST |
| JESD-30 code | R-GDIP-T24 | R-GDFP-F24 | R-GDFP-F24 | R-PDSO-G24 | R-PDIP-T24 |
| Logic integrated circuit type | LOGIC CIRCUIT | LOGIC CIRCUIT | LOGIC CIRCUIT | LOGIC CIRCUIT | LOGIC CIRCUIT |
| Number of functions | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 24 | 24 | 24 | 24 | 24 |
| Maximum operating temperature | 125 °C | 125 °C | 70 °C | 70 °C | 70 °C |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | DFP | DFP | SOP | DIP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | FLATPACK | FLATPACK | SMALL OUTLINE | IN-LINE |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 4.572 mm | 2.286 mm | 2.286 mm | 2.642 mm | 5.334 mm |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | YES | YES | YES | NO |
| technology | TTL | TTL | TTL | TTL | TTL |
| Temperature level | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal form | THROUGH-HOLE | FLAT | FLAT | GULL WING | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL |
| width | 15.24 mm | 9.4615 mm | 9.4615 mm | 7.5 mm | 15.24 mm |
| Maker | Texas Instruments | Texas Instruments | - | - | Texas Instruments |
| Base Number Matches | 1 | 1 | 1 | 1 | - |
| length | - | 15.435 mm | 15.435 mm | 15.34 mm | 31.915 mm |
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