TPS7H3301-SP datasheet, PDF - EEWORLD Datasheet

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TPS7H3301-SP: DescriptionTPS7H3301-SP Radiation Hardened 3Amp Sink/Source DDR Termination Regulator w/ Built-in VREF; Categorysemiconductor Power management; File Size2MB，28 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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TPS7H3301-SP Overview

TPS7H3301-SP Radiation Hardened 3Amp Sink/Source DDR Termination Regulator w/ Built-in VREF

TPS7H3301-SP Parametric

Parameter Name	Attribute value
Operating temperature range(C)	-55 to 125,25 only
Vin(Min)(V)	0.9
Rating	Space
Vout VTT(Min)(V)	0.6
Iout VTT(Max)(A)	3
Vin(Max)(V)	3.5
Control mode	S3,S4/S5
DDR memory type	DDR,DDR2,DDR3,DDR3L,DDR4,LPDDR2,LPDDR3
Iq(Typ)(mA)	18
Vin bias(Max)(V)	3.5
Regulator type	Linear Regulator
Output	VREF,VTT
Vin bias(Min)(V)	2.375
Package Group	CFP\|16
Features	Complete Solution,PGOOD,Shutdown Pin for S3

TPS7H3301-SP Related Products

	TPS7H3301-SP	5962R1422801VXC	5962-1422801VXC	TPS7H3301HKR/EM
Description	TPS7H3301-SP Radiation Hardened 3Amp Sink/Source DDR Termination Regulator w/ Built-in VREF	Radiation Hardened 3Amp Sink/Source DDR Termination Regulator w/ Built-in VREF 16-CFP -55 to 125	Radiation Hardened 3Amp Sink/Source DDR Termination Regulator w/ Built-in VREF 16-CFP -55 to 125	Radiation Hardened 3Amp Sink/Source DDR Termination Regulator w/ Built-in VREF 16-CFP 25 only
Brand Name	-	Texas Instruments	Texas Instruments	Texas Instruments
Maker	-	Texas Instruments	Texas Instruments	Texas Instruments
package instruction	-	HDFP,	HDFP,	HDFP,
Reach Compliance Code	-	not_compliant	not_compliant	not_compliant
Factory Lead Time	-	26 weeks	6 weeks	35 weeks
Interface integrated circuit type	-	BUS TERMINATOR SUPPORT CIRCUIT	BUS TERMINATOR SUPPORT CIRCUIT	BUS TERMINATOR SUPPORT CIRCUIT
JESD-30 code	-	R-CDFP-F16	R-CDFP-F16	R-CDFP-F16
length	-	11.01 mm	11.01 mm	11.01 mm
Number of functions	-	1	1	1
Number of signal lines	-	1	1	1
Number of terminals	-	16	16	16
Maximum operating temperature	-	125 °C	125 °C	125 °C
Minimum operating temperature	-	-55 °C	-55 °C	-55 °C
Package body material	-	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	-	HDFP	HDFP	HDFP
Package shape	-	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	-	FLATPACK, HEAT SINK/SLUG	FLATPACK, HEAT SINK/SLUG	FLATPACK, HEAT SINK/SLUG
Peak Reflow Temperature (Celsius)	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Maximum seat height	-	2.333 mm	2.333 mm	2.333 mm
Maximum supply voltage	-	3.5 V	3.5 V	3.5 V
Minimum supply voltage	-	2.375 V	2.375 V	2.375 V
Nominal supply voltage	-	3.3 V	3.3 V	3.3 V
surface mount	-	YES	YES	YES
Temperature level	-	MILITARY	MILITARY	MILITARY
Terminal form	-	FLAT	FLAT	FLAT
Terminal pitch	-	1.27 mm	1.27 mm	1.27 mm
Terminal location	-	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	-	9.63 mm	9.63 mm	9.63 mm

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