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EMIF04-10006F2

Description
4 LINES EMI ILTER AND ESD PROTECTION
CategoryAnalog mixed-signal IC    filter   
File Size231KB,7 Pages
ManufacturerSTMicroelectronics
Websitehttp://www.st.com/
Environmental Compliance
Download Datasheet Parametric Compare View All

EMIF04-10006F2 Overview

4 LINES EMI ILTER AND ESD PROTECTION

EMIF04-10006F2 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerSTMicroelectronics
package instructionLEAD FREE, FLIP CHIP-15
Reach Compliance Codeunknown
ECCN codeEAR99
CertificationIEC
capacitance60 µF
Maximum DC resistance120 Ω
filter typeDATA LINE FILTER
high0.65 mm
length2.92 mm
Manufacturer's serial numberEMIF04-10006F2
Installation typeSURFACE MOUNT
Number of functions4
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Packaging MaterialsPLASTIC
method of packingTAPE AND REEL
physical sizeL2.92XB1.29XH0.65 (mm)/L0.115XB0.051XH0.026 (inch)
width1.29 mm
Base Number Matches1
®
EMIF04-10006F2
IPAD™
4 LINES EMI FILTER
AND ESD PROTECTION
MAIN PRODUCT CHARACTERISTICS
Where EMI filtering in ESD sensitive equipment is
required:
Mobile phones and communication systems
Computers, printers and MCU Boards
DESCRIPTION
The EMIF04-10006F2 is a highly integrated
devices designed to suppress EMI/RFI noise in all
systems
subjected
to
electromagnetic
interferences. The EMIF04 flip-chip packaging
means the package size is equal to the die size.
This filter includes an ESD protection circuitry
which prevents the device from destruction when
subjected to ESD surges up 15kV. This device
includes four EMIF filters and 4 separated ESD
diodes.
BENEFITS
EMI symmetrical (I/O) low-pass filter
High efficiency in EMI filtering
Lead free package
Very low PCB space consuming:
2.92mm x 1.29mm
Very thin package: 0.65 mm
High efficiency in ESD suppression
(IEC61000-4-2 level 4)
High reliability offered by monolithic integration
High reducing of parasitic elements through
integration and wafer level packaging.
COMPLIES WITH THE FOLLOWING STANDARDS:
IEC 61000-4-2 level 4:
15kV (air discharge)
8kV (contact discharge)
MIL STD 883E - Method 3015-6 Class 3: 30kV
®
Flip-Chip
(15 Bumps)
Table 1: Order Code
Part Number
EMIF04-10006F2
Marking
FS
Figure 1: Pin Configuration (ball side)
9
8
7
6
5
4
3
2
1
D3
Gnd
D4
I4
I3
Gnd
O3
I2
I1
Gnd
D1
A
B
O4
O2
O1
D2
C
TM:
IPAD is a trademark of STMicroelectronics.
September 2004
REV. 1
1/7

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