SKYPER™ 32PRO -
Technical Explanations
SKYPER™ 32PRO
Technical Explanations
Revision 02
Status:
preliminary
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This Technical Explanation is valid for the following parts:
part number
L6100200
Related documents:
title
Data Sheet SKYPER™ 32PRO
Prepared by: Markus Hermwille
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version
≥
03-06-2005
SKYPER™ 32PRO
type
date code (YYWW)
≥
0520
Content
Application and Handling Instructions...................................................................................................................... 2
Further application support ...................................................................................................................................... 2
General Description................................................................................................................................................. 2
Features of SKYPER™ 32PRO............................................................................................................................... 2
Block diagram.......................................................................................................................................................... 3
Dimensions.............................................................................................................................................................. 3
PIN Array – Primary Side......................................................................................................................................... 4
PIN Array – Secondary Side.................................................................................................................................... 5
Driver Performance ................................................................................................................................................. 6
Insulation ................................................................................................................................................................. 6
Auxiliary Power Supply............................................................................................................................................ 6
Under Voltage Reset (UVR) .................................................................................................................................... 7
Under Voltage Protection (UVP) primary................................................................................................................. 8
Under Voltage Protection secondary ....................................................................................................................... 8
Input Signals............................................................................................................................................................ 8
Short Pulse Suppression (SPS)............................................................................................................................... 9
Failure Management................................................................................................................................................ 9
Halt Logic Signal (HLS) ........................................................................................................................................... 9
Dead Time generation (Interlock TOP / BOT) adjustable (DT) .............................................................................. 10
Dynamic Short Circuit Protection by V
CEsat
monitoring / de-saturation monitoring (DSCP).................................... 11
Adjustment of DSCP.............................................................................................................................................. 12
High Voltage Diode for DSCP................................................................................................................................ 12
Gate resistors ........................................................................................................................................................ 13
Soft Turn-Off (STO) ............................................................................................................................................... 13
External Error Input (EEI) ...................................................................................................................................... 14
Application Example .............................................................................................................................................. 14
Mounting Notes ..................................................................................................................................................... 15
Marking.................................................................................................................................................................. 16
Information furnished in this document is believed to be accurate and reliable. However, no representation or warranty is
given and no liability is assumed with respect to the accuracy or use of such information. Furthermore, this technical
information specifies semiconductor devices but promises no characteristics. No warranty or guarantee expressed or
implied is made regarding delivery, performance or suitability. Specifications mentioned in this document are subject to
change without notice. This document supersedes and replaces all information previously supplied and may be supersede
by updates.
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2005-06-03 – Rev02
© by
SEMIKRON
SKYPER™ 32PRO -
Technical Explanations
Please note:
All values in this technical explanation are typical values. Typical values are the average values expected in large
quantities and are provided for information purposes only. These values can and do vary in different applications. All
operating parameters should be validated by user’s technical experts for each application.
Application and Handling Instructions
Please provide for static discharge protection during handling. As long as the hybrid driver is not completely
assembled, the input terminals have to be short-circuited. Persons working with devices have to wear a
grounded bracelet. Any synthetic floor coverings must not be statically chargeable. Even during
transportation the input terminals have to be short-circuited using, for example, conductive rubber.
Worktables have to be grounded. The same safety requirements apply to MOSFET- and IGBT-modules.
Any parasitic inductances within the DC-link have to be minimised. Over-voltages may be absorbed by C- or
RCD-snubbers between main terminals for PLUS and MINUS of the power module.
When first operating a newly developed circuit, SEMIKRON recommends to apply low collector voltage and
load current in the beginning and to increase these values gradually, observing the turn-off behaviour of the
free-wheeling diode and the turn-off voltage spikes generated across the IGBT. An oscillographic control will
be necessary. Additionally, the case temperature of the module has to be monitored. When the circuit works
correctly under rated operation conditions, short-circuit testing may be done, starting again with low collector
voltage.
It is important to feed any errors back to the control circuit and to switch off the device immediately in failure
events. Repeated turn-on of the IGBT into a short circuit with a high frequency may destroy the device.
The inputs of the hybrid driver are sensitive to over-voltage. Voltages higher than V
S
+0,3V or below -0,3V
may destroy these inputs. Therefore, control signal over-voltages exceeding the above values have to be
avoided.
The connecting leads between hybrid driver and the power module should be as short as possible (max.
20cm), the driver leads should be twisted.
Further application support
Latest information is available at
http://www.semikron.com.
For design support please read the SEMIKRON
Application Manual Power Modules available at
http://www.semikron.com.
General Description
The SKYPER™ 32PRO core constitutes an interface between IGBT modules and the controller. This core is a
half bridge driver. Functions for driving, potential separation and protection are integrated in the driver. Thus it can
be used to build up a driver solution for IGBT modules.
Features of SKYPER™ 32PRO
Two output channels
Integrated potential free power supply for secondary side
Short Pulse Suppression (SPS)
Under Voltage Protection (UVP) primary & secondary
Under Voltage Reset (UVR)
Drive interlock (dead time) top / bottom (DT) adjustable
Dynamic Short Circuit Protection (DSCP) by V
CE
monitoring and
direct switch off
Soft Turn-Off (STO)
Halt Logic Signal (HLS)
Failure Management
External Error Input
DC bus voltage up to 1200V
Coated with varnish
SKYPER™ 32PRO
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2005-06-03 – Rev02
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SEMIKRON
SKYPER™ 32PRO -
Technical Explanations
Block diagram
Block diagram
Dimensions
Dimensions in mm
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SEMIKRON
SKYPER™ 32PRO -
Technical Explanations
PIN Array – Primary Side
Connectors
Connector X10 / X11 (RM2,54, 10pin)
SQ 0,64
2,54
PIN
X10:01
X10:02
X10:03
Signal
PRIM_nPWRFAIL_IN
reserved
PRIM_HALT_OUT
Function
Under Voltage Reset (supervisor
reset to be driven by an external
circuitry)
Specification
Inverted 15 V logic; 100kOhm
impedance; LOW = hold; HIGH =
normal operation
Driver core status output
Digital 15 V logic; 100kOhm
impedance; LOW = ready to operate;
HIGH = not ready to operate
Digital 15 V logic; 100kOhm
impedance; LOW = enable driver; HIGH
= disable driver
X10:04
PRIM_HALT_IN
Driver core status input
GND for power supply and GND for
digital signals
GND for power supply and GND for
digital signals
Switching signal input (TOP switch)
X10:05
X10:06
PRIM_PWR_GND
PRIM_PWR_GND
X10:07
PRIM_TOP_IN
Digital 15 V logic; 100kOhm
impedance; LOW = TOP switch off;
HIGH = TOP switch on
Digital 15 V logic; 100kOhm
impedance; LOW = BOT switch off;
HIGH = BOT switch on
Stabilised +15V ±4%
Stabilised +15V ±4%
X10:08
X10:09
X10:10
X11:01
X11:02
X11:03
X11:04
X11:05
X11:06
X11:07
X11:08
X11:09
X11:10
PRIM_BOT_IN
PRIM_PWR_15P
PRIM_PWR_15P
reserved
reserved
PRIM_PWR_GND
PRIM_PWR_GND
PRIM_CFG_TDT2_IN
PRIM_CFG_SELECT_IN
PRIM_CFG_TDT3_IN
PRIM_CFG_TDT1_IN
PRIM_PWR_GND
PRIM_PWR_GND
Switching signal input (BOTTOM
switch)
Drive core power supply
Drive core power supply
GND for power supply and GND for
digital signals
GND for power supply and GND for
digital signals
Digital adjustment of locking time
Signal for neutralizing locking
function
Digital adjustment of locking time
Digital adjustment of locking time
GND for power supply and GND for
digital signals
GND for power supply and GND for
digital signals
Dead time bit #3
Dead time bit #1
Dead time bit #2
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2005-06-03 – Rev02
© by
SEMIKRON
SKYPER™ 32PRO -
Technical Explanations
PIN Array – Secondary Side
Connectors
Connector X100 / X200 (RM2,54, 10pin)
SQ 0,64
2,54
PIN
X100:01
X100:02
X100:03
X100:04
X100:05
X100:06
X100:07
X100:08
X100:09
X100:10
X200:01
X200:02
X200:03
X200:04
X200:05
X200:06
X200:07
X200:08
X200:09
X200:10
1)
Signal
SEC_TOP_VCE_CFG
SEC_TOP_VCE_IN
SEC_TOP_15P
SEC_TOP_ERR_IN
SEC_TOP_IGBT_ON
SEC_TOP_IGBT_OFF
SEC_TOP_GND
SEC_TOP_GND
SEC_TOP_IGBT_SOFTOFF
SEC_TOP_8N
SEC_BOT_VCE_CFG
SEC_ BOT_VCE_IN
SEC_ BOT_15P
SEC_ BOT_ERR_IN
SEC_ BOT_IGBT_ON
SEC_ BOT_IGBT_OFF
SEC_ BOT_GND
SEC_ BOT_GND
SEC_BOT_IGBT_SOFTOFF
SEC_BOT_8N
Function
Input reference voltage adjustment
Input V
CE
monitoring
Output power supply
External error input
Switch on signal TOP IGBT
Switch off signal TOP IGBT
GND for power supply and GND for
digital signals
GND for power supply and GND for
digital signals
Control input for setting soft turn-off
TOP IGBT
Output power supply
Input reference voltage adjustment
Input V
CE
monitoring
Output power supply
External error input
Switch on signal BOT IGBT
Switch off signal BOT IGBT
GND for power supply and GND for
digital signals
GND for power supply and GND for
digital signals
Control input for setting soft turn-off
BOT IGBT
Output power supply
Specification
Stabilised +15V / max. 10mA
1)
Voltage input; 6,6kOhm impedance;
LOW = ERROR
Stabilised -7V / max. 10mA
1)
Stabilised +15V / max. 10mA
1)
Voltage input; 6,6kOhm impedance;
LOW = ERROR
Stabilised -7V / max. 10mA
1)
The average output current of the driver will be reduced accordingly.
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2005-06-03 – Rev02
© by
SEMIKRON
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