CO
M
PL
IA
Features
Four beads in one package
High speed and high impedance
Nickel barrier
The MA Series is
not recommended for new designs.
*R
oH
S
NT
MA Series Chip Ferrite Bead Arrays
Electrical Specifications
Model Number
MA3216-600M4
MA3216-800M4
MA3216-121M4
MA3216-201M4
MA3216-301M4
MA3216-471M4
MA3216-601M4
MA3216-102M4
MA3216-600T4
MA3216-121T4
MA3216-201T4
MA3216-301T4
MA3216-601T4
MA3216-102T4
MA3216-500S4
MA3216-800S4
MA3216-121S4
MA3216-201S4
MA3216-301S4
Impedance
(Ω)
at 100MHz
60
80
120
200
300
470
600
1000
60
120
200
300
600
1000
50
80
120
200
300
RDC
(Ω)
Max.
0.12
0.15
0.20
0.30
0.45
0.45
0.50
0.80
0.12
0.20
0.30
0.45
0.50
0.80
0.20
0.25
0.25
0.30
0.40
IDC
(mA)
Max.
200
150
100
100
100
100
100
100
200
200
150
150
100
50
200
200
200
200
200
General Specifications
Operating Temperature
...................................-55 °C to +125 °C
Storage Temperature ..-55 °C to +125 °C
Storage Condition
......................+40 °C max. at 70 % RH
Impedance Tolerance....................±25 %
Reflow Soldering
......................230 ˚C, 10 seconds max.
Resistance to Soldering Heat
...............................260 ˚C, 10 seconds
Model Designator
M4 ...............................High Impedance
T4 ........................................Low Speed
S4 .......................................High Speed
Rated Current ..................Based on max.
temperature rise of +40 °C
Terminal Strength
(Force “F” applied for 30 seconds)
3216 Series ............................1.2 F (Kg)
Materials
Core Material .................................Ferrite
Internal Conductor...............................Ag
Terminal .....................................Ag/Ni/Sn
Electrical Specifications (continued)
MA3216-600M4
200
100
Z
R
IMPEDANCE (Ω)
IMPEDANCE (Ω)
X
10
IMPEDANCE (Ω)
10
1
0.1
E
T
E
L
O
S
B
O
MA3216-800M4
Z
200
100
1000
100
1
MA3216-121M4
Z
X
R
R
X
10
0.01
0.001
1
10
100
1000 1800
0.1
0.02
1
10
100
1000 1800
1
0.1
FREQUENCY (MHz)
FREQUENCY (MHz)
1
10
100
1000 1800
FREQUENCY (MHz)
MA3216-201M4
500
100
1000
MA3216-301M4
1000
MA3216-601M4
Z
X
IMPEDANCE (Ω)
100
Z
IMPEDANCE (Ω)
100
Z
R
IMPEDANCE (Ω)
10
1
0.1
R
X
10
10
R
X
1
1
0.05
1
10
100
1000 1800
0.1
1
10
100
1000 1800
0.1
1
10
100
1000 1800
FREQUENCY (MHz)
FREQUENCY (MHz)
FREQUENCY (MHz)
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
Surface Mount Chip Inductor Capability Matrix
MA Series Chip Ferrite Bead Arrays
Electrical Specifications (Continued)
MA3216-102M4
10000
1000
200
100
MA3216-121T4
1000
MA3216-201T4
IMPEDANCE (Ω)
IMPEDANCE (Ω)
IMPEDANCE (Ω)
Z
X
R
Z
10
100
Z
R
X
100
10
1
0.1
10
1
R
1
X
1
10
100
1000 1800
FREQUENCY (MHz)
MA3216-301T4
1000
Z
IMPEDANCE (Ω)
100
10
X
R
1
0.1
1
10
100
1000 1800
FREQUENCY (MHz)
MA3216-800S4
500
100
E
T
E
L
O
S
B
O
0.1
1
10
100
1000 1800
1
0.1
10
100
1000 1800
FREQUENCY (MHz)
FREQUENCY (MHz)
MA3216-601T4
MA3216-500S4
1000
500
IMPEDANCE (Ω)
IMPEDANCE (Ω)
100
Z
100
10
1
X
Z
X
R
10
1
R
0.1
0.1
1
10
100
1000 1800
0.02
FREQUENCY (MHz)
1
10
100
1000 1800
FREQUENCY (MHz)
MA3216-121S4
MA3216-201S4
500
5000
1000
100
10
1
0.1
IMPEDANCE (Ω)
IMPEDANCE (Ω)
100
IMPEDANCE (Ω)
Z
10
X
R
Z
10
X
R
Z
X
R
1
1
0.1
1
10
100
1000 1800
0.1
1
10
100
1000 1800
FREQUENCY (MHz)
FREQUENCY (MHz)
1
10
100
1000 1800
FREQUENCY (MHz)
MA3216-301S4
1000
IMPEDANCE (Ω)
100
Z
X
R
10
1
0.2
1
10
100
1000 1800
FREQUENCY (MHz)
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
Surface Mount Chip Inductor Capability Matrix
MA Series Chip Ferrite Bead Arrays
Product Dimensions
0.4
±
0.15
(.016
±
.006)
0.8
±
0.1
(.031
±
.004)
2.5
(.098)
0.8
(.031)
Preheating:
100 to 150°C
2 minutes min.
Recommended Land Pattern
Recommended Soldering
10 seconds max.
Soldering 230°C
200°C
30 seconds max.
1.6
±
0.2
(.063
±
.008)
3.2
±
0.2
(.126
±
.008)
0.2 MIN. TO 0.45 MAX.
(.008 MIN. TO .018 MAX.)
0.8
(.031)
0.4
(.016)
0.2
±
0.1
(.008
±
.004)
0.8
±
0.1
(.031
±
.004)
Reel Dimensions
178.0
DIA.
(7.00)
2.0
±
0.5
(.079
±
.020)
21.0
±
0.8
(.827
±
.031)
13.0
±
0.5
DIA.
(.512
±
.020)
E
T
E
L
O
S
B
O
DIMENSIONS ARE:
MM
(INCHES)
12.5
(.492)
13.0
±
0.5
(.512
±
.020)
DIA.
THICKNESS
0.10
(.004)
MAX.
50.0
(1.969)
9.0
(.354)
EMBOSSED
CARRIER
8.0
(.315)
EMBOSSED
CAVITY
CARRIER TAPE WIDTH:
CAVITY PITCH:
4.0
(.157)
8.0
(.315)
3000 pcs. per reel.
Gross weight: 140g.
REV.
/14
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
Embedded System
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