Dual Bootstrapped, High Voltage MOSFET
Driver with Output Disable
ADP3419
FEATURES
All-in-one synchronous buck driver
One PWM signal generates both drives
Anticross-conduction protection circuitry
Output disable function
Crowbar control
Synchronous override control
Undervoltage lockout
SIMPLIFIED FUNCTIONAL BLOCK DIAGRAM
VCC
5
BST
10
IN
1
SD
2
UVLO,
OVERLAP
PROTECTION,
SHUTDOWN
AND
CROWBAR
CIRCUITS
9
DRVH
SW
8
DRVLSD
3
APPLICATIONS
Mobile computing CPU core power converters
Multiphase desk-note CPU supplies
Single-supply synchronous buck converters
Nonsynchronous-to-synchronous drive conversion
CROWBAR
4
6
DRVL
04620-0-001
ADP3419
7
GND
Figure 1.
GENERAL DESCRIPTION
The ADP3419 is a dual MOSFET driver optimized for driving
two N-channel switching MOSFETs in nonisolated synchro-
nous buck power converters used to power CPUs in portable
computers. The driver impedances have been chosen to provide
optimum performance in multiphase regulators at up to 25 A
per phase. The high-side driver can be bootstrapped relative to
the switch node of the buck converter and is designed to
accommodate the high voltage slew rate associated with floating
high-side gate drivers.
The ADP3419 includes an anticross-conduction protection
circuit, undervoltage lockout to hold the switches off until the
driver has sufficient voltage for proper operation, a crowbar
input that turns on the low-side MOSFET independently of the
input signal state, and a low-side MOSFET disable pin to
provide higher efficiency at light loads. The SD pin shuts off
both the high-side and the low-side MOSFETs to prevent rapid
output capacitor discharge during system shutdown.
The ADP3419 is specified over the extended commercial
temperature range of 0°C to 100°C and is available in a 10-lead
MSOP package.
GENERAL APPLICATION CIRCUIT
5V
VDC
5
FROM CONTROLLER
PWM OUTPUT
FROM SYSTEM
ENABLE CONTROL
FROM
CONTROLLER
FROM CONTROLLER
CLAMP OUTPUT
VCC
1
2
3
IN
SD
DRVLSD
BST
10
ADP3419
DRVH
9
SW
8
V
OUT
4
CROWBAR
GND
7
DRVL
6
04620-0-002
Figure 2.
Rev. A
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However, no responsibility is assumed by Analog Devices for its use, nor for any
infringements of patents or other rights of third parties that may result from its use.
Specifications subject to change without notice. No license is granted by implication
or otherwise under any patent or patent rights of Analog Devices. Trademarks and
registered trademarks are the property of their respective owners.
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Tel: 781.329.4700
www.analog.com
Fax: 781.461.3113
© 2005 Analog Devices, Inc. All rights reserved.
ADP3419
TABLE OF CONTENTS
Specifications..................................................................................... 3
Absolute Maximum Ratings............................................................ 5
ESD Caution.................................................................................. 5
Pin Configuration and Function Descriptions............................. 6
Typical Performance Characteristics ............................................. 7
Theory of Operation ........................................................................ 9
Undervoltage Lockout ................................................................. 9
Driver Control Input.................................................................... 9
Low-Side Driver............................................................................ 9
High-Side Driver .......................................................................... 9
Overlap Protection Circuit.......................................................... 9
Low-Side Driver Shutdown....................................................... 10
Low-Side Driver Timeout ......................................................... 10
Crowbar Function ...................................................................... 10
Application Information................................................................ 11
Supply Capacitor Selection ....................................................... 11
Bootstrap Circuit........................................................................ 11
Power and Thermal Considerations ........................................ 11
PC Board Layout Considerations............................................. 12
Outline Dimensions ....................................................................... 13
Ordering Guide .......................................................................... 13
REVISION HISTORY
3/05—Rev. 0 to Rev. A
Updated Format..................................................................Universal
Changes to Specifications ................................................................ 3
4/04—Revision 0: Initial Version
Rev. A | Page 2 of 16
ADP3419
SPECIFICATIONS
VCC = SD = 5 V, BST = 4 V to 26 V, T
A
= 0°C to 100°C, unless otherwise noted.
All limits at temperature extremes are guaranteed via correlation using standard statistical quality control (SQC) methods.
Table 1.
Parameter
LOGIC INPUTS (IN, SD, DRVLSD, CROWBAR)
Input Voltage High
Input Voltage Low
Input Current
DRVLSD Propagation Delay Time
HIGH-SIDE DRIVER
Output Resistance, Sourcing Current
Output Resistance, Sinking Current
Transition Times
Propagation Delay Times
1
LOW-SIDE DRIVER
Output Resistance, Sourcing Current
Output Resistance, Sinking Current
Transition Times
Propagation Delay Times
1, 2
SW Transition Timeout
2
Zero-Crossing Threshold
SUPPLY
Supply Voltage Range
Supply Current
Normal Mode
Shutdown Mode
Undervoltage Lockout Threshold
Undervoltage Lockout Hysteresis
3
1
2
Symbol
V
IH
V
IL
I
IN
t
pdlDRVLSD
,
t
pdhDRVLSD
Conditions
Min
2.0
Typ
Max
Unit
V
V
µA
ns
Inputs = 0 V or 5 V
C
LOAD
= 3 nF, Figure 3
−1
20
0.8
+1
t
rDRVH
t
fDRVH
t
pdhDRVH
t
pdlDRVH
BST − SW = 4.6 V
BST − SW = 4.6 V
BST − SW = 4.6 V, C
LOAD
= 3 nF, Figure 4
BST − SW = 4.6 V, C
LOAD
= 3 nF, Figure 4
BST − SW = 4.6 V, C
LOAD
= 3 nF, Figure 4
BST − SW = 4.6 V, C
LOAD
= 3 nF, Figure 4
15
1.7
0.8
14
11
32
28
1.7
0.8
13
11
25
16
350
1
3.3
2.3
35
25
70
60
3.3
2.3
30
25
48
30
600
Ω
Ω
ns
ns
ns
ns
Ω
Ω
ns
ns
ns
ns
ns
V
V
mA
µA
V
mV
t
rDRVL
t
fDRVL
t
pdhDRVL
t
pdlDRVL
t
SWTO
V
ZC
V
CC
I
SYS(NM)
I
SYS(SD)
C
LOAD
= 3 nF, Figure 4
C
LOAD
= 3 nF, Figure 4
C
LOAD
= 3 nF, Figure 4
C
LOAD
= 3 nF, Figure 4
BST − SW = 4.6 V
150
4.6
I
CC
+ I
BST
, IN = 0 V or 5 V
I
CC
+ I
BST
, SD = 0 V
VCC rising
VCC falling
0.8
325
4.25
120
6
1.5
600
4.5
3.8
50
For propagation delays, t
pdh
refers to the specified signal going high, and t
pdl
refers to the signal going low with transitions measured at 50%.
The turn-on of DRVL is initiated after IN goes low by either SW crossing a ~1 V threshold or by expiration of t
SWTO
.
3
Guaranteed by characterization, not production tested.
Rev. A | Page 3 of 16
ADP3419
IN
2.0V
DRVLSD
0.8V
tpdl
DRVLSD
tpdh
DRVLSD
DRVL
Figure 3. Output Disable Timing Diagram (Timing is Referenced to the 90% and 10% Points Unless Otherwise Noted)
IN
t
pdl
DRVL
t
f
DRVL
t
pdl
DRVH
t
r
DRVL
DRVL
tf
DRVH
t
pdh
DRVH
t
r
DRVH
DRVH-SW
V
TH
V
TH
SW
≤
t
SWTO
1V
t
pdh
DRVL
04620-0-004
Figure 4. Nonoverlap Timing Diagram (Timing is Referenced to the 90% and 10% Points Unless Otherwise Noted)
Rev. A | Page 4 of 16
04620-0-003
ADP3419
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
VCC
BST
BST to SW
SW
DRVH
DRVL
All Other Inputs and Outputs
θ
JA
2-Layer Board
4-Layer Board
Operating Ambient Temperature
Range
Junction Temperature Range
Storage Temperature Range
Lead Temperature Range
Soldering (10 s)
Vapor Phase (60 s)
Infrared (15 s)
Rating
−0.3 V to +7 V
−0.3 V to +30 V
−0.3 V to +7 V
−3 V to +25 V
SW − 0.3 V to BST + 0.3 V
−0.3 V to VCC + 0.3 V
−0.3 V to VCC + 0.3 V
340°C/W
220°C/W
0°C to 100°C
0°C to 150°C
−65°C to +150°C
300°C
215°C
220°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Unless otherwise specified, all voltages are referenced to GND.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the
human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Rev. A | Page 5 of 16