OM
PL
IA
N
T
Features
n
For use in telecommunication circuit
applications requiring low current
protection with high surge tolerance
n
Overcurrent protection to Telcordia
GR-1089-CORE Issue 4 (B1250T only)
& UL 1950/60950
n
Bourns
®
TISP
®
products are recommended
for the overvoltage section of the circuit
These models are currently available
but not recommended for new
designs.
*R
oH
S
C
n
Agency recognition: File: E198545
n
RoHS compliant*
LE
AD
F
RE
E
Telefuse
™
SMD Power Cross Protection Fuse
Typical
Cold
Resistance
(Ohms)
0.350
0.075
0.056
Volt-drop
@ 100 % In
(Volts)
Max.
0.23
0.18
0.16
Maximum
Power
Dissipation
(W)
0.20
0.40
0.52
Electrical Characteristics
Ro VE LEA
HS RS D
C ION FRE
OM S E
PL AR
IA E
NT
*
Model
Number
B0500T
B1250T
B2000T
Ampere
Rating
(A)
0.500
1.25
2.0
Voltage
Rating
(VRMS)
600
600
600
Melting I2T
< 10 msec
(A2 sec.)
2
14
33
Melting I2T
@ 10 In
(A2 sec.)
2.3
17
37
Temperature Range
................................-55 °C to +125 °C
Environmental Characteristics
Thermal Shock ................ MIL-STD-202,
Method 107, Test Condition B
(-65 °C to +125 °C)
Shock.......... MIL-STD-202, Method 213,
Test Condition I
(100 Gs peak for 6 milliseconds)
Vibration ...... MIL-STD-202, Method 201
(10-55 Hz, 0.06 inch total excursion)
Salt Spray ... MIL-STD-202, Method 101,
Test Condition B (48 hrs.)
Insulation Resistance ...... MIL-STD-202,
Method 302, Test Condition A
(after opening)
10,000 ohms minimum
Solderability
................. MIL-STD-202, Method 208
Resistance to Solder Heat
................ MIL-STD-202, Method 210,
Test Condition J (235 °C, 30 sec.)
Body Material
..... Ceramic with tin plated brass caps
Solder ........ RoHS 6 Compliant lead free
RoHS reflow compatible;
reference 240 °C, 30 sec. max.
Soldering Process Window
IR Reflow 240 °C for 30 seconds max.
(Not recommended for
Wave solder direct immersion)
Packaging ..........2,000 pcs. per 13 ” reel
Physical Characteristics
Lightning Surge Withstand Capabilities
Max. Rise/
Min. Decay
(µs)
10/1000
10/360
2/10
10/360
2/10
8/20
Repetitions
Each
Total
Polarity
50
25
50
25
20
10
10
5
2
1
2
1
Minimum
Peak
Voltage
(V)
1000
1000
2500
1000
5000
5000
Minimum Withstand Peak Current
(A)
B0500T
25
30
120
30
120
75
B1250T
100
125
500
125
500
300
B2000T
120
150
600
150
600
350
Test Methods per GR-1089/TIA-968-A (FCC Pt. 68)
AC Power Fault Tests
GR-1089
1st Level
Test
Short
Circuit
Current
(A)
Fuse Characteristics
Applications
Duration
B0500T
B1250T
B2000T
1
2
3
4
6
7
8
9
Voltage
(VRMS)
50
100
200,
400,
600
1000
600
440
600
1000
0.33
0.17
1
1
0.5
2.2
3
5
1
1
60
60
1
5
5
5
15 min.
15 min.
1 sec.
Parts pass all 1st Level tests
1 sec.
30 sec.
2 sec.
1.1 sec.
0.4 sec.
Will open
Will open
Will open
Parts pass all 1st
Level tests
AC Current Limiting Protector Tests/Fusing Coordination Tests
Voltage
(Vac)
600
600
600
600
600
600
600
600
600
600
600
Current
(A)
2.2
2.6
3.0
3.75
5
7
10
12.5
20
25
30
Duration
Maximum Time for Fuse to Open (Seconds)
B0500T
B1250T
B2000T
1.0
900
Will not open
0.8
50
2000
0.5
10
100
0.3
5
10
0.2
2
3
0.08
1
2
0.04
0.5
0.7
0.01
0.2
0.3
0.005
0.07
0.1
0.004
0.04
0.07
0.003
0.02
0.05
Up to 15 Min.
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
Telefuse
™
SMD Power Cross Protection Fuse
Time/Current Characteristic Curve
1000
Product Dimensions
2.03 ± .102
(.080 ± .004)
100
Current (Amperes)
9.65 ± .254
(.38 ± .01)
10
B2000T
B1250T
B0500T
1
3.05 ± .127
(.120 ± .005)
3.05 ± .127
(.120 ± .005)
0.1
0.01
0.01
0.1
1
10
Time (Seconds)
100
1000
10000
Solder Profile
TP
MAX. RAMP-UP RATE = 3 °C/sec.
MAX. RAMP-DOWN RATE = 6 °C/sec.
TL
t
tp
Recommended Pad Layout
3.81
(.15)
Tc -5 °C
4.06
(.16)
Temperature
TS MAX.
5.08
(.20)
DIMENSIONS:
TS MIN.
ts
PREHEAT
MM
(INCHES)
25 °C
t 25 °C TO PEAK
WAVEFORM DURATION OF A/B SECONDS
Time
CURRENT
(Peak Value) lp
0.9 lp
A = Rise Time = T1 - T0 (1.25/b-a)
B = Duration = T2 - T0
IR Reflow Profile
Reflow Parameter
Maximum Preheat Temperature (TSMAX)
Preheat Time
TSMAX to TL Ramp-Up Rate
Peak Temperature (TP)
Ramp-Down Rate
Minimum Preheat Temperature (TSMIN)
Value
130 °C
170 °C
60-180 seconds
3 °C / second max.
0.5 lp
0.1 lp
a
T0
b
T1
T2
TIME
Time above Temperature TL (tL)
Time within 5 °C of Peak TP
200 °C for 60-120 seconds
240 °C max.
20-30 seconds
6 °C / second. max.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
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