CYStech Electronics Corp.
NPN Digital Transistors (Built-in Resistors
)
Spec. No. : C350S3
Issued Date : 2005.01.12
Revised Date :
Page No. : 1/3
DTC113ZS3
Features
•
Built-in bias resistors enable the configuration of an inverter circuit without connecting external input
resistors (see equivalent circuit).
•
The bias resistors consist of thin-film resistors with complete isolation to allow negative biasing of the
input. They also have the advantage of almost completely eliminating parasitic effects.
•
Only the on/off conditions need to be set for operation, making device design easy.
•
Complements the DTA113ZS3
Equivalent Circuit
DTC113ZS3
Outline
SOT-323
R1=1kΩ , R2=10 kΩ
IN(B) : Base
OUT(C) : Collector
GND(E) : Emitter
Absolute Maximum Ratings
(Ta=25°C)
Parameter
Supply Voltage
Input Voltage
Output Current
Power Dissipation
Junction Temperature
Storage Temperature
Symbol
V
CC
V
IN
I
O
I
O(max.)
Pd
Tj
Tstg
Limits
50
-5~+10
100
100
200
150
-55~+150
Unit
V
V
mA
mA
mW
°C
°C
DTC113ZS3
CYStek Product Specification
CYStech Electronics Corp.
Electrical Characteristics
(Ta=25°C)
Parameter
Input Voltage
Output Voltage
Input Current
Output Current
DC Current Gain
Input Resistance
Resistance Ratio
Transition Frequency
Symbol
V
I(off)
V
I(on)
V
O(on)
I
I
I
O(off)
G
I
R
1
R
2
/R
1
f
T
Min.
-
3
-
-
-
33
0.7
8
-
Typ.
-
-
-
-
-
-
1
10
250
Max.
0.3
-
0.3
7.2
0.5
-
1.3
12
-
Unit
V
V
V
mA
µA
-
kΩ
-
MHz
Spec. No. : C350S3
Issued Date : 2005.01.12
Revised Date :
Page No. : 2/3
Test Conditions
V
CC
=5V, I
O
=100µA
V
O
=0.3V, I
O
=20mA
I
O
/I
I
=10mA/0.5mA
V
I
=5V
V
CC
=50V, V
I
=0V
V
O
=5V, I
O
=5mA
-
-
V
CE
=10V, I
C
=5mA, f=100MHz *
* Transition frequency of the device
DTC113ZS3
CYStek Product Specification
CYStech Electronics Corp.
SOT-323 Dimension
Spec. No. : C350S3
Issued Date : 2005.01.12
Revised Date :
Page No. : 3/3
3
A
Marking:
A1
Q
Lp
detail Z
W
B
C
1
e1
e
D
bp
2
TE
8Z
E
A
Z
θ
He
0
1
scale
2 mm
3-Lead SOT-323 Plastic
Surface Mounted Package
CYStek Package Code: S3
v
A
Style: Pin 1.Base 2.Emitter 3.Collector
*: Typical
DIM
A
A1
bp
C
D
E
e
Inches
Min.
Max.
0.0315 0.0433
0.0000 0.0039
0.0118 0.0157
0.0039 0.0098
0.0709 0.0866
0.0453 0.0531
0.0512
-
Millimeters
Min.
Max.
0.80
1.10
0.00
0.10
0.30
0.40
0.10
0.25
1.80
2.20
1.15
1.35
1.3
-
DIM
e1
He
Lp
Q
v
w
θ
Inches
Min.
Max.
0.0256
-
0.0787 0.0886
0.0059 0.0177
0.0051 0.0091
0.0079
-
0.0079
-
-
-
Millimeters
Min.
Max.
0.65
-
2.00
2.25
0.15
0.45
0.13
0.23
0.2
-
0.2
-
10°
0°
Notes:
1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
•
Lead: 42 Alloy ; solder plating
•
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
•
CYStek reserves the right to make changes to its products without notice.
•
CYStek
semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
DTC113ZS3
CYStek Product Specification
DIY/Open Source Hardware
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