½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
½½½½½
½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½ ½
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
FEATURES
•
•
•
•
•
•
•
•
•
•
•
•
MONOLITHIC MOS TECHNOLOGY
LOW COST
HIGH VOLTAGE OPERATION—350V
LOW QUIESCENT CURRENT TYP.—2.2mA
NO SECOND BREAKDOWN
HIGH OUTPUT CURRENT—120mA PEAK
AVAILABLE IN DIE FORM—CPA241
APPLICATIONS
8-PIN TO-3
PACKAGE STYLE CE
24-PIN PSOP
PACKAGE STYLE DF
10-PIN SIP
PACKAGE STYLE DW
PIEZO ELECTRIC POSITIONING
ELECTROSTATIC TRANSDUCER & DEFLECTION
DEFORMABLE MIRROR FOCUSING
BIOCHEMISTRY STIMULATORS
COMPUTER TO VACUUM TUBE INTERFACE
TYPICAL APPLICATION
Ref: APPLICATION NOTE 20: "Bridge Mode Operation of Power Amplifiers"
½
½
½½
½½½½
½½½
½½½
½½½
½½½½
DESCRIPTION
The PA241 is a high voltage monolithic MOSFET operational
amplifier which achieves performance features previously
found only in hybrid designs while increasing reliability. Inputs
are protected from excessive common mode and differential
mode voltages. The safe operating area (SOA) has no second
breakdown limitation and can be observed with all type loads
by choosing an appropriate current limiting resistor. External
compensation provides the user flexibility in choosing optimum
gain and bandwidth for the application.
The PA241CE is packaged in a hermetically sealed 8-pin
TO-3 package. The metal case of the PA241CE is isolated in
excess of full supply voltage.
The PA241DF is packaged in a 24 pin PSOP (JEDEC MO-
166) package. The metal heat slug of the PA241DF is isolated
in excess of full supply voltage.
The PA241DW is packaged in Apex’s hermetic ceramic SIP
package. The alumina ceramic isolates the die in excess of
full supply voltage.
½½½½
½½
½½½½½
½½½½
½½
½½½½½
½
½½
½½½½½
½½½
½½½½½½½½½½
½½½
½
½½
½½
½½
½½½½
LOW COST 660V p-p
PIEZO DRIVE
½½½½
Two PA241 amplifiers operated as a bridge driver for a piezo
transducer provides a low cost 660 volt total drive capability.
The R
N
C
N
network serves to raise the apparent gain of A2 at
high frequencies. If R
N
is set equal to R the amplifiers can be
compensated identically and will have matching bandwidths.
EXTERNAL CONNECTIONS
PA241CE
R
CL
C
C
PA241DW
1
2
3
4
5
6
7
8
9
10
NC NC -V
S
+V
S
I
LIM
C
C
2 C
C
1 OUT
C
C
1 3
OUT 4
2 C
C
2
1 I
LIM
-IN +IN
C
C
EQUIVALENT SCHEMATIC
TOP VIEW
6
+IN
8
7
–V
S
NC
+V
S
5
–IN
+V
S
For CC values, see graph on page 4.
Note: CC must be rated for full supply
voltage.
NC
NC
NC
OUT
NC
COMP
NC
COMP
NC
ILIM
NC
+VS
C
C
R
CL
R
CL
C
C
1
C
C
2
+IN
-IN
I
LIM
OUT
PA241DF
NC
NC
NC
NC
+IN
NC
NC
NC
NC
-VS
-IN
1
24
-V
S
NOTE: PA241CE Recommended mounting torque is 4-7
in•lbs (.45 -.79 N•m)
CAUTION: The use of compressible, thermally conductive
insulators may void warranty.
APEX MICROTECHNOLOGY CORPORATION • TELEPHONE (520) 690-8600 • FAX (520) 888-3329 • ORDERS (520) 690-8601 • EMAIL prodlit@apexmicrotech.com
+
-
1
PA241
ABSOLUTE MAXIMUM RATINGS
SUPPLY VOLTAGE, +V
S
to –V
S
OUTPUT CURRENT, continuous within SOA
OUTPUT CURRENT, peak
POWER DISSIPATION, continuous @ T
C
= 25°C
INPUT VOLTAGE, differential
INPUT VOLTAGE, common mode
TEMPERATURE, pin solder – 10 sec
TEMPERATURE, junction
2
TEMPERATURE, storage
TEMPERATURE RANGE, powered (case)
ABSOLUTE MAXIMUM RATINGS
SPECIFICATIONS
PA241CE
PA241CEA
350V
60 mA
120 mA
12W
±16 V
±V
S
300°C
150°C
–65 to +150°C
–40 to +125°C
MIN
PA241CEA
TYP
15
*
*
*
*
*
*
*
*
*
*
*
*
*
*
±V
S
–8.5
*
*
*
*
*
*
*
*
*
*
*
*
PA241DF
PA241DFA
350V
60 mA
120 mA
12W
±16 V
±V
S
220°C
150°C
–65 to +150°C
–40 to +125°C
MAX
30
*
*
*
*
UNITS
mV
µV/°C
µV/V
µV/kh
pA
pA/V
pA
pF
V
V
dB
µV RMS
µV p-p
dB
MHz
kHz
V
mA
mA
µs
V/µs
Ω
Ω
*
2.3
*
*
*
*
*
V
mA
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C
SPECIFICATIONS
PARAMETER
INPUT
OFFSET VOLTAGE, initial
OFFSET VOLTAGE, vs. temperature
3
OFFSET VOLTAGE, vs supply
OFFSET VOLTAGE, vs time
BIAS CURRENT, initial
6
BIAS CURRENT, vs supply
OFFSET CURRENT, initial
6
INPUT IMPEDANCE, DC
INPUT CAPACITANCE
COMMON MODE, voltage range
COMMON MODE, voltage range
COMMON MODE REJECTION, DC
NOISE, broad band
NOISE, low frequency
GAIN
OPEN LOOP at 15Hz
BANDWIDTH, gain bandwidth product
POWER BANDWIDTH
OUTPUT
VOLTAGE SWING
CURRENT, peak
4
CURRENT, continuous
SETTLING TIME to .1%
SLEW RATE
RESISTANCE
5
, 1mA
RESISTANCE
5
, 40 mA
POWER SUPPLY
VOLTAGE
CURRENT, quiescent
THERMAL
PA241CE RESISTANCE, AC junction to case
PA241DF RESISTANCE, AC junction to case
PA241CE RESISTANCE, DC junction to case
PA241DF RESISTANCE, DC junction to case
PA241CE RESISTANCE, junction to air
PA241DF RESISTANCE, junction to air
7
TEMPERATURE RANGE, case
F > 60Hz
F > 60Hz
F < 60Hz
F < 60Hz
Full temperature range
Full temperature range
Meets full range spec's
TEST CONDITIONS
1
PA241CE, PA241DF
MIN
TYP
MAX
25
100
3
70
5/50
0.2/2
2.5/50
10
11
6
94
50
125
96
3
30
±V
S
–10
2
30
150
5
±150
2.2
5.4
6
9
9
30
25
±175
2.5
6.5
7
10.4
11
+85
40
500
130
50/200
50/200
Full temperature range
V
CM
= ±90V DC
10kHz BW, R
S
= 1K
1-10 Hz
R
L
= 5K
280V p-p
I
O
= 40mA
10V step, A
V
= –10
C
C
= 3.3pF
R
CL
= 0
R
CL
= 0
+V
S
–14
-V
S
+12
84
*
*
*
90
*
±V
S
–12
120
60
±V
S
–10
*
*
±50
*
–25
*
NOTES:
*
1.
2.
3.
4.
5.
6.
7.
"A" specification is the same as the non "A" specification.
Unless otherwise noted T
C
= 25°C, C
C
= 6.8pF. DC input specifications are ± value given. Power supply voltage is typical
rating.
Long term operation at the maximum junction temperature will result in reduced product life. Derate internal power dissipation
to achieve high MTTF. For guidance, refer to heatsink data sheet.
Sample tested by wafer to 95%.
Guaranteed but not tested.
The selected value of R
CL
must be added to the values given for total output resistance.
Specifications separated by / indicate values for the PA241CE and PA241DF respectively.
Rating applies with solder connection of heatslug to a minimum 1 square inch foil area of the printed circuit board.
The PA241 is constructed from MOSFET transistors. ESD handling procedures must be observed.
CAUTION
APEX MICROTECHNOLOGY CORPORATION • 5980 NORTH SHANNON ROAD • TUCSON, ARIZONA 85741 • USA • APPLICATIONS HOTLINE: 1 (800) 546-2739
2
ABSOLUTE MAXIMUM RATINGS
SPECIFICATIONS
PA241
SUPPLY VOLTAGE, +V
S
to –V
S
OUTPUT CURRENT, continuous within SOA
OUTPUT CURRENT, peak
POWER DISSIPATION, continuous @ T
C
= 25°C
INPUT VOLTAGE, differential
INPUT VOLTAGE, common mode
TEMPERATURE, pin solder – 10 sec
TEMPERATURE, junction
2
TEMPERATURE, storage
TEMPERATURE RANGE, powered (case)
PA241DW
PA241DWA
350V
60 mA
120 mA
9W
±16 V
±V
S
220°C
150°C
–65 to +150°C
–40 to +125°C
PA241DWA
TYP
15
*
*
*
*
*
*
*
*
*
*
*
*
*
*
±V
S
–8.5
*
*
*
*
*
*
*
*
*
*
2.3
*
*
*
ABSOLUTE MAXIMUM RATINGS
SPECIFICATIONS
PARAMETER
INPUT
OFFSET VOLTAGE, initial
OFFSET VOLTAGE, vs. temperature
3
OFFSET VOLTAGE, vs supply
OFFSET VOLTAGE, vs time
BIAS CURRENT, initial
BIAS CURRENT, vs supply
OFFSET CURRENT, initial
INPUT IMPEDANCE, DC
INPUT CAPACITANCE
COMMON MODE, voltage range
COMMON MODE, voltage range
COMMON MODE REJECTION, DC
NOISE, broad band
NOISE, low frequency
GAIN
OPEN LOOP at 15Hz
BANDWIDTH, gain bandwidth product
POWER BANDWIDTH
OUTPUT
VOLTAGE SWING
CURRENT, peak
4
CURRENT, continuous
SETTLING TIME to .1%
SLEW RATE
RESISTANCE
5
, 1mA
RESISTANCE
5
, 40 mA
POWER SUPPLY
VOLTAGE
CURRENT, quiescent
THERMAL
PA241DW RESISTANCE, AC junction to case
PA241DW RESISTANCE, DC junction to case
PA241DW RESISTANCE, junction to air
TEMPERATURE RANGE, case
F > 60Hz
F < 60Hz
Full temperature range
Meets full range spec's
TEST CONDITIONS
1
MIN
PA241DW
TYP
25
100
3
70
100
15
100
10
11
6
94
50
125
96
3
30
±V
S
–10
2
30
150
5
±150
2.2
7
12
55
MAX
40
500
130
2000
50
400
MIN
MAX
30
*
*
*
*
UNITS
mV
µV/°C
µV/V
µV/kh
pA
pA/V
pA
pF
V
V
dB
µV RMS
µV p-p
dB
MHz
kHz
V
mA
mA
µs
V/µs
Ω
Ω
V
mA
°C/W
°C/W
°C/W
°C
Full temperature range
V
CM
= ±90V DC
10kHz BW, R
S
= 1K
1-10 Hz
R
L
= 5K
280V p-p
I
O
= 40mA
10V step, A
V
= –10
C
C
= 3.3pF
R
CL
= 0
R
CL
= 0
+V
S
–14
-V
S
+12
84
*
*
*
90
*
±V
S
–12
120
60
±V
S
–10
*
*
±50
±175
2.5
10
14
+85
*
–25
*
NOTES:
*
1.
2.
3.
4.
5.
"A" specification is the same as the non "A" specification.
Unless otherwise noted T
C
= 25°C, C
C
= 6.8pF. DC input specifications are ± value given. Power supply voltage is typical
rating.
Long term operation at the maximum junction temperature will result in reduced product life. Derate internal power dissipation
to achieve high MTTF. For guidance, refer to heatsink data sheet.
Sample tested by wafer to 95%.
Guaranteed but not tested.
The selected value of R
CL
must be added to the values given for total output resistance.
CAUTION
The PA241 is constructed from MOSFET transistors. ESD handling procedures must be observed.
APEX MICROTECHNOLOGY CORPORATION • TELEPHONE (520) 690-8600 • FAX (520) 888-3329 • ORDERS (520) 690-8601 • EMAIL prodlit@apexmicrotech.com
3
PA241
½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
½½
½½
½
½
½
½
½½½½½
½
½½½½½
½
TYPICAL PERFORMANCE
GRAPHS
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½½
½½
½½
½½½ ½½½
½½½ ½½½ ½½½ ½½½
½½½½½½½½½½½½½½½½½½½½½½½½½
½
½½½½½½½½½½½½½½½½
½½½½½½½½½½½½½½½
½½½½½½½
½½½½½½½
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½½
½½
½ ½½½½½
½
½
½½½
½½
½ ½½½½½
½½½½
½½½½½½½
½½½½½½½½½
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½½
½
½½½½½½½½½
½½½½½
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½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½½
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½
½ ½½ ½½ ½½ ½½ ½½ ½½ ½½
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½½½½½½½½½½½½½½½½½½½½½½½
APEX MICROTECHNOLOGY CORPORATION • 5980 NORTH SHANNON ROAD • TUCSON, ARIZONA 85741 • USA • APPLICATIONS HOTLINE: 1 (800) 546-2739
4
OPERATING
CONSIDERATIONS
PA241
CURRENT LIMIT
For proper operation, the current limit resistor, Rcl, must be
connected as shown in the external connection diagram. The
minimum value is 3.9 ohms, however for optimum reliability,
the resistor should be set as high as possible. The maximum
practical value is 110 ohms. Current limit values can be pre-
dicted as follows:
Ilimit = Vbe
Rcl
Where Vbe is shown in the CURRENT LIMIT typical
graph.
Note that +Vbe should be used to predict current through
the +Vs pin, -Vbe for current through the -Vs pin, and that they
vary with case temperature. Value of the current limit resistor
at a case temperature of 25° can be estimated as follows:
Rcl = 0.7
Ilimit
When the amplifier is current limiting, there may be spurious
oscillation present during the current limited portion of the nega-
tive half cycle. The frequency of the oscillation is not predictable
and depends on the compensation, gain of the amplifier, value
of the current limit resistor, and the load. The oscillation will
cease as the amplifier comes out of current limit.
GENERAL
Please read Application Note 1 "General Operating Consid-
erations" which covers stability, power supplies, heat sinking,
mounting, current limit, SOA interpretation, and specification
interpretation. Visit www.apexmicrotech.com for design tools
that help automate tasks such as calculations for stability,
internal power dissipation, current limit, heat sink selection,
Apex's complete Application Notes library, Technical Seminar
Workbook and Evaluation Kits.
PHASE COMPENSATION
Open loop gain and phase shift both increase with increas-
ing temperature. The PHASE COMPENSATION typical graph
shows closed loop gain and phase compensation capacitor
value relationships for four case temperatures. The curves
are based on achieving a phase margin of 50°. Calculate
the highest case temperature for the application (maximum
ambient temperature and highest internal power dissipation)
before choosing the compensation. Keep in mind that when
working with small values of compensation, parasitics may
play a large role in performance of the finished circuit. The
compensation capacitor must be rated for at least the total
voltage applied to the amplifier and should be a temperature
stable type such as NPO or COG.
OTHER STABILITY CONCERNS
There are two important concepts about closed loop gain
when choosing compensation. They stem from the fact that
while "gain" is the most commonly used term,
β
(the feedback
factor) is really what counts when designing for stability.
1. Gain must be calculated as a non-inverting circuit (equal
input and feedback resistors can provide a signal gain of
-1, but for calculating offset errors, noise, and stability, this
is a gain of 2).
2. Including a feedback capacitor changes the feedback factor
or gain of the circuit. Consider Rin=4.7k, Rf=47k for a gain
of 11. Compensation of 4.7 to 6.8pF would be reasonable.
Adding 33pF parallel to the 47k rolls off the circuit at 103kHz,
and at 2MHz has reduced gain from 11 to roughly 1.5 and
the circuit is likely to oscillate.
As a general rule the DC summing junction impedance
(parallel combination of the feedback resistor and all input
resistors) should be limited to 5k ohms or less. The amplifier
input capacitance of about 6pF, plus capacitance of connecting
traces or wires and (if used) a socket will cause undesirable
circuit performance and even oscillation if these resistances
are too high. In circuits requiring high resistances, measure or
estimate the total sum point capacitance, multiply by Rin/Rf, and
parallel Rf with this value. Capacitors included for this purpose
are usually in the single digit pF range. This technique results
in equal feedback factor calculations for AC and DC cases. It
does not produce a roll off, but merely keeps
β
constant over
a wide frequency range. Paragraph 6 of Application Note 19
details suitable stability tests for the finished circuit.
SAFE OPERATING AREA
The MOSFET output stage of the PA241 is not limited by
second breakdown considerations as in bipolar output stages.
However there are still three distinct limitations:
1. Voltage withstand capability of the transistors.
2. Current handling capability of the die metalization.
3. Temperature of the output MOSFETS.
These limitations can be seen in the SOA (see Safe Operat-
ing Area graphs). Note that each pulse capability line shows
a constant power level (unlike second breakdown limitations
where power varies with voltage stress). These lines are shown
for a case temperature of 25°C and correspond to thermal
resistances of 5.2°C/W for the PA241CE and DF and 10.4°C/W
for the PA241DW respectively. Pulse stress levels for other
case temperatures can be calculated in the same manner as
DC power levels at different temperatures. The output stage
is protected against transient flyback by the parasitic diodes of
the output stage MOSFET structure. However, for protection
against sustained high energy flyback external fast-recovery
diodes must be used.
HEATSINKING
The PA241DF package has a large exposed integrated
copper heatslug to which the monolithic amplifier is directly
attached. The solder connection of the heatslug to a minimum
of 1 square inch foil area on the printed circuit board will result
in thermal performance of 25°C/W junction to air rating of
the PA241DF. Solder connection to an area of 1 to 2 square
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5
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