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WF4M32-120H2M5

Description
4M X 32 FLASH 5V PROM MODULE, 100 ns, CPGA66
Categorystorage    storage   
File Size559KB，15 Pages
ManufacturerWhite Electronic Designs Corporation
Websitehttp://www.wedc.com/
Download Datasheet Parametric Compare View All

WF4M32-120H2M5 Overview

4M X 32 FLASH 5V PROM MODULE, 100 ns, CPGA66

WF4M32-120H2M5 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerWhite Electronic Designs Corporation
package instruction1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66
Reach Compliance Codeunknow
Maximum access time120 ns
Other featuresCAN ALSO BE CONFIGURED AS 2 X 4M X 16 OR 4 X 4M X 8
Data pollingYES
JESD-30 codeS-CPGA-P66
JESD-609 codee0
length35.2 mm
memory density134217728 bi
Memory IC TypeFLASH MODULE
memory width32
Number of functions1
Number of departments/size64
Number of terminals66
word count4194304 words
character code4000000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize4MX32
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codePGA
Encapsulate equivalent codePGA66,11X11
Package shapeSQUARE
Package formGRID ARRAY
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Programming voltage5 V
Certification statusNot Qualified
Filter level38535Q/M;38534H;883B
Maximum seat height5.7 mm
Department size64K
Maximum standby current0.02 A
Maximum slew rate0.42 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formPIN/PEG
Terminal pitch2.54 mm
Terminal locationPERPENDICULAR
Maximum time at peak reflow temperatureNOT SPECIFIED
switch bitYES
typeNOR TYPE
width35.2 mm

WF4M32-120H2M5 Preview

White Electronic Designs
4Mx32 5V FLASH MODULE
FEATURES
Access Times of 100, 120, 150ns
Packaging:
• 66 pin, PGA Type, 1.385" square, Hermetic
Ceramic HIP (Package 402).
• 68 lead, 40mm Low Profile CQFP (Package
502), 3.5mm (0.140") height.
• 68 lead, Hermetic CQFP (G2T), 22.4mm (0.880")
square (Package 509) 4.57mm (0.180") height.
Designed to fit JEDEC 68 lead 0.990CQFJ
footprint (Fig. 3)
Sector Architecture
• 32 equal size sectors of 64KBytes per each 2Mx8
chip
• Any combination of sectors can be erased. Also
supports full chip erase.
Minimum 100,000 Write/Erase Cycles Minimum
Organized as 4Mx32
WF4M32-XXX5
PRELIMINARY*
User configurable as 2x4Mx16 or 4x4Mx8 in HIP
and G4T packages.
Commercial, Industrial, and Military Temperature
Ranges
5 Volt Read and Write. 5V ± 10% Supply.
Low Power CMOS
Data# Polling and Toggle Bit feature for detection of
program or erase cycle completion.
Supports reading or programming data to a sector
not being erased.
RESET# pin resets internal state machine to the
read mode.
Built-in Decoupling Caps and Multiple Ground Pins
for Low Noise Operation, Separate Power and
Ground Planes to improve noise immunity
* This product is under development, is not qualified or characterized and is subject to
change without notice.
Note: For programming information refer to Flash Programming 16M5 Application Note.
FIGURE 1 – PIN CONFIGURATION FOR WF4M32-XH2X5
PIN DESCRIPTION
Top View
1
I/O
8
I/O
9
I/O
10
A
14
A
16
A
11
A
0
A
18
I/O
0
I/O
1
I/O
2
11
22
12
RESET#
23
I/O
15
I/O
14
I/O
13
I/O
12
OE#
A
17
WE#
I/O
7
I/O
6
I/O
5
I/O
4
33
I/O
24
I/O
25
I/O
26
A
7
A
12
A
21
A
13
A
8
I/O
16
I/O
17
I/O
18
34
V
CC
CS
4#
NC
I/O
27
A
4
A
5
A
6
A20
CS
3#
GND
I/O
19
44
45
I/O
31
I/O
30
I/O
29
I/O
28
A
1
56
CS
2#
GND
I/O
11
A
10
A
9
A
15
V
CC
CS
1#
A
19
I/O
3
I/O
0-31
A
0-21
WE#
CS
1-4
#
OE#
V
CC
V
SS
RESET#
Data Inputs/Outputs
Address Inputs
Write Enable
Chip Select
Output Enable
Power Supply
Ground
Reset
Block Diagram
CS1#
CS2#
CS3#
CS4#
A
21
A
2
A
3
I/O
23
I/O
22
I/O
21
I/O
20
55
66
OE#
WE#
A
0-20
RESET#
2M x 8
2M x 8
2Mx 8
2M x 8
2M
x 8
2M
x 8
2M
x 8
2M
x 8
I/O
0-7
I/O
8-15
I/O
16-23
I/O
24-31
June 2004
Rev. 6
1
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
White Electronic Designs
WF4M32-XXX5
PRELIMINARY
FIGURE 2 – PIN CONFIGURATION FOR WF4M32-XG4TX5
TOP VIEW
NC
A
0
A
1
A
2
A
3
A
4
A
5
CS
1
#
GND
CS
3
#
WE#
A
6
A
7
A
8
A
9
A
10
V
CC
PIN DESCRIPTION
I/O
0-31
A
0-21
WE#
CS
1-4
#
OE#
V
CC
GND
RESET#
NC
Data Inputs/Outputs
Address Inputs
Write Enable
Chip Select
Output Enable
Power Supply
Ground
Reset
Not Connected
9 8 7 6 5 4 3 2 1 68 67 66 65 64 63 62 61
I/O
0
I/O
1
I/O
2
I/O
3
I/O
4
I/O
5
I/O
6
I/O
7
GND
I/O
8
I/O
9
I/O
10
I/O
11
I/O
12
I/O
13
I/O
14
I/O
15
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
I/O
16
I/O
17
I/O
18
I/O
19
I/O
20
I/O
21
I/O
22
I/O
23
GND
I/O
24
I/O
25
I/O
26
I/O
27
I/O
28
I/O
29
I/O
30
I/O
31
BLOCK DIAGRAM
CS1#
A
21
CS2#
CS3#
CS4#
OE#
WE#
A
0-20
RESET#
2M x 8
2M x 8
2M x 8
2M x 8
BUFFER
V
CC
A
11
A
12
A
13
A
14
A
15
A
16
CS
2
#
OE#
CS
4
#
A
17
A
18
A
19
A
20
RESET#
NC
A21
2M
x 8
2M
x 8
2M
x 8
2M
x 8
I/O
0-7
I/O
8-15
I/O
16-23
I/O
24-31
FIGURE 3 – PIN CONFIGURATION FOR WF4M32-XG2TX5
TOP VIEW
RESET#
A
0
A
1
A
2
A
3
A
4
A
5
NC
GND
NC
WE#
A
6
A
7
A
8
A
9
A
10
V
CC
PIN DESCRIPTION
I/O
0-31
A
0-21
WE#
CS
1-2
#
OE#
V
CC
GND
RESET#
Data Inputs/Outputs
Address Inputs
Write Enable
Chip Select
Output Enable
Power Supply
Ground
Reset
9 8 7 6 5 4 3 2 1 68 67 66 65 64 63 62 61
I/O
0
I/O
1
I/O
2
I/O
3
I/O
4
I/O
5
I/O
6
I/O
7
GND
I/O
8
I/O
9
I/O
10
I/O
11
I/O
12
I/O
13
I/O
14
I/O
15
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43
I/O
16
I/O
17
I/O
18
I/O
19
I/O
20
I/O
21
I/O
22
I/O
23
GND
I/O
24
I/O
25
I/O
26
I/O
27
I/O
28
I/O
29
I/O
30
I/O
31
The White 68 lead G2T CQFP fills the
same fit and function as the JEDEC 68 lead
CQFJ or 68 PLCC. But the G2T has the
TCE and lead inspection advantage of the
CQFP form.
Block Diagram
CS
1 #
RESET#
WE#
OE#
A
0-20
2M x 8
2M x 8
2M x 8
2M x 8
2M x 8
2M x 8
2M x 8
2M x 8
8
8
8
8
CS
1
#
OE#
CS
2
#
V
CC
A
11
A
17
NC
NC
NC
A
12
A
13
A
14
A
15
A
16
A
18
A
19
A
20
CS
2 #
I/O
0-7
I/O
8-15
I/O
16-23
I/O
24-31
Note: CS1#& CS2# are used as bank select
June 2004
Rev. 6
2
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
White Electronic Designs
ABSOLUTE MAXIMUM RATINGS
Parameter
Voltage on Any Pin Relative to V
SS
Power Dissipation
Storage Temperature
Short Circuit Output Current
Endurance — write/erase cycles
Data Retention (Mil Temp)
WF4M32-XXX5
PRELIMINARY
CAPACITANCE
T
A
= +25°C, V
IN
= OV,
F
= 1.0MHz
Unit
V
W
°C
mA
cycles
years
Symbol
V
T
P
T
T
STG
I
OS
(Mil Temp)
Ratings
-2.0 to +7.0
8
-65 to +125
100
100,000 min.
20
Parameter
OE# capacitance
WE# capacitance
CS# capacitance
Data I/O capacitance
Address input capacitance
Symbol HIP (H2) CQFP (G2T) CQFP(G4T)
75
75
20
C
OE
75
75
20
C
WE
20
50
20
C
CS
30
30
30
C
I/O
75
75
20
C
AD
This parameter is guaranteed by design but not tested.
RECOMMENDED DC OPERATING CONDITIONS
Parameter
Supply Voltage
Ground
Input High Voltage
Input Low Voltage
Operating Temperature (Mil.)
Operating Temperature (Ind.)
Symbol
V
CC
V
SS
V
IH
V
IL
T
A
T
A
Min
4.5
0
2.0
-0.5
-55
-40
Typ
5.0
0
–
–
–
–
Max
5.5
0
V
CC
+ 0.5
+0.8
+125
+85
Unit
V
V
V
V
°C
°C
DC CHARACTERISTICS - CMOS COMPATIBLE
V
CC
= 5.0V, V
SS
= 0V, -55°C
≤
T
A
≤
+125°C
HIP
Parameter
Input Leakage Current
Output Leakage Current
V
CC
Active Current for Read (1)
V
CC
Active Current for Program
or Erase (2)
V
CC
Standby Current
Output Low Voltage
Output High Voltage
Low V
CC
Lock-Out Voltage
Symbol
I
LI
I
LOX32
I
CC1
I
CC2
I
CC3
V
OL
V
OH
V
LKO
Conditions
V
CC
= 5.5, V
IN
= GND to V
CC
V
CC
= 5.5, V
IN
= GND to V
CC
CS# = V
IL
, OE# = V
IH
, f = 5MHz
CS# = V
IL
, OE# = V
IH
V
CC
= 5.5, CS# = V
IH
,
f = 5MHz, RESET# = V
IH
I
OL
= 12.0 mA, V
CC
= 4.5
I
OH
= -2.5 mA, V
CC
= 4.5
Min
Max
10
10
320
420
20
0.45
0.85 x
V
CC
3.2
0.85 x
V
CC
3.2
Min
G2T
Max
10
10
215
295
2.0
0.45
0.85 x
V
CC
3.2
Min
G4T
Max
10
10
345
445
95
0.45
Unit
µA
µA
mA
mA
mA
V
V
V
4.2
4.2
4.2
NOTES:
1. The Icc current listed includes both the DC operating current and the frequency
dependent component (@ 5MHz). The frequency component typically is less than
2mA/MHz, with OE# at V
IH
.
2. I
CC
active while Embedded Algorithm (program or erase) is in progress.
3. DC test conditions V
IL
= 0.3V, V
IH
= V
CC
- 0.3V
HIP = 66 pin, PGA Type, 1.385" square, Hermetic Ceramic HIP (Package 402).
G2T = 68 lead, Hermetic CQFP (G2T), 22.4mm (0.880") square. Designed to fit JEDEC 68
lead 0.990" CQFJ footprint (Fig. 3) (Package 509)
G4T = 68 lead, 40mm Low Profile CQFP, 3.5mm (0.140") (Package 502 )
June 2004
Rev. 6
3
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
White Electronic Designs
V
CC
= 5.0V, -55°C
≤
T
A
≤
+125°C
Parameter
Write Cycle Time
Chip Select Setup Time
Write Enable Pulse Width
Address Setup Time
Data Setup Time
Data Hold Time
Address Hold Time
Write Enable Pulse Width High
Duration of Byte Programming Operation (1)
Sector Erase (2)
Read Recovery Time before Write
V
CC
Setup Time
Chip Programming Time
Chip Erase Time (3)
Output Enable Hold Time (4)
RESET# Pulse Width
NOTES:
1. Typical value for t
WHWH1
is 7µs.
2. Typical value for t
WHWH2
is 1sec.
3. Typical value for Chip Erase Time is 32sec.
4. For Toggle and Data Polling.
WF4M32-XXX5
PRELIMINARY
AC Characteristics – Write/Erase/Program Operations - WE# Controlled
Symbol
t
AVAV
t
ELWL
t
WLWH
t
AVWL
t
DVWH
t
WHDX
t
WLAX
t
WHWL
t
WHWH1
t
WHWH2
t
GHWL
t
VCS
t
WC
t
CS
t
WP
t
AS
t
DS
t
DH
t
AH
t
WPH
Min
100
0
45
0
45
0
45
20
-100
Max
Min
120
0
50
0
50
0
50
20
-120
Max
Min
150
0
50
0
50
0
50
20
-150
Max
ns
ns
ns
ns
ns
ns
ns
ns
µs
sec
µs
µs
sec
sec
ns
ns
Unit
300
15
0
50
44
256
t
OEH
t
RP
10
500
10
500
0
50
300
15
0
50
44
256
10
500
300
15
44
256
AC CHARACTERISTICS – READ-ONLY OPERATIONS
V
CC
= 5.0V, V
SS
= 0V, -55°C
≤
T
A
≤
+125°C
Parameter
Read Cycle Time
Address Access Time
Chip Select Access Time
Output Enable to Output Valid
Chip Select High to Output High Z (1)
Output Enable High to Output High Z (1)
Output Hold from Addresses, CS# or OE# Change,
whichever is First
RESET# Low to Read Mode (1)
1. Guaranteed by design, not tested.
Symbol
Min
T
AVAV
T
AVQV
T
ELQV
T
GLQV
T
EHQZ
T
GHQZ
T
AXQX
T
RC
T
ACC
T
CE
T
OE
T
DF
T
DF
T
OH
T
READY
0
100
-1000
Max
100
100
40
20
20
0
20
-120
Min
120
120
120
50
30
30
0
20
-150
Max
Min
150
150
150
55
35
35
Unit
Max
ns
ns
ns
ns
ns
ns
ns
20
µs
June 2004
Rev. 6
4
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
White Electronic Designs
WF4M32-XXX5
PRELIMINARY
AC CHARACTERISTICS FOR G2T PACKAGE – WRITE/ERASE/PROGRAM OPERATIONS,
CS# CONTROLLED
V
CC
= 5.0V, GND = 0V, -55°C
≤
T
A
≤
+125°C
Parameter
Write Cycle Time
Write Enable Setup Time
Chip Select Pulse Width
Address Setup Time
Data Setup Time
Data Hold Time
Address Hold Time
Chip Select Pulse Width High
Duration of Byte Programming Operation (1)
Sector Erase Time (2)
Read Recovery Time
Chip Programming Time
t
AVAV
t
WLEL
t
ELEH
t
AVEL
t
DVEH
t
EHDX
t
ELAX
t
EHEL
t
WHWH1
t
WHWH2
t
GHEL
0
44
Symbol
t
WC
t
WS
t
CP
t
AS
t
DS
t
DH
t
AH
t
CPH
Min
100
0
45
0
45
0
45
20
-100
Max
Min
120
0
50
0
50
0
50
20
-120
Max
Min
150
0
50
0
50
0
50
20
-150
Max
Unit
ns
ns
ns
ns
ns
ns
ns
ns
300
15
0
300
15
0
44
300
15
44
µs
sec
µs
sec
Chip Erase Time (3)
Output Enable Hold Time (4)
NOTES:
1. Typical value for t
WHWH1
is 7µs.
2. Typical value for t
WHWH2
is 1sec.
3. Typical value for Chip Erase Time is 32sec.
4. For Toggle and Data Polling.
t
OEH
10
256
10
256
10
256
sec
ns
June 2004
Rev. 6
5
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
More (Only the first 5 pages are displayed. Please Download Datasheet to view the full content.) >

WF4M32-120H2M5 Related Products

WF4M32-120H2M5 WF4M32-150H2M5 WF4M32-XXX5
Description 4M X 32 FLASH 5V PROM MODULE, 100 ns, CPGA66 4M X 32 FLASH 5V PROM MODULE, 100 ns, CPGA66 4M X 32 FLASH 5V PROM MODULE, 100 ns, CPGA66
memory width 32 32 32
Number of functions 1 1 1
Number of terminals 66 66 66
Maximum operating temperature 125 °C 125 °C 125 Cel
Minimum operating temperature -55 °C -55 °C -55 Cel
organize 4MX32 4MX32 4M X 32
Temperature level MILITARY MILITARY MILITARY
Terminal form PIN/PEG PIN/PEG PIN/PEG
Terminal location PERPENDICULAR PERPENDICULAR PERPENDICULAR
Is it Rohs certified? incompatible incompatible -
Maker White Electronic Designs Corporation White Electronic Designs Corporation -
package instruction 1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66 1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66 -
Reach Compliance Code unknow unknow -
Maximum access time 120 ns 150 ns -
Other features CAN ALSO BE CONFIGURED AS 2 X 4M X 16 OR 4 X 4M X 8 CAN ALSO BE CONFIGURED AS 2 X 4M X 16 OR 4 X 4M X 8 -
Data polling YES YES -
JESD-30 code S-CPGA-P66 S-CPGA-P66 -
JESD-609 code e0 e0 -
length 35.2 mm 35.2 mm -
memory density 134217728 bi 134217728 bi -
Memory IC Type FLASH MODULE FLASH MODULE -
Number of departments/size 64 64 -
word count 4194304 words 4194304 words -
character code 4000000 4000000 -
Operating mode ASYNCHRONOUS ASYNCHRONOUS -
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED -
encapsulated code PGA PGA -
Encapsulate equivalent code PGA66,11X11 PGA66,11X11 -
Package shape SQUARE SQUARE -
Package form GRID ARRAY GRID ARRAY -
Parallel/Serial PARALLEL PARALLEL -
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED -
power supply 5 V 5 V -
Programming voltage 5 V 5 V -
Certification status Not Qualified Not Qualified -
Filter level 38535Q/M;38534H;883B 38535Q/M;38534H;883B -
Maximum seat height 5.7 mm 5.7 mm -
Department size 64K 64K -
Maximum standby current 0.02 A 0.02 A -
Maximum slew rate 0.42 mA 0.42 mA -
Maximum supply voltage (Vsup) 5.5 V 5.5 V -
Minimum supply voltage (Vsup) 4.5 V 4.5 V -
Nominal supply voltage (Vsup) 5 V 5 V -
surface mount NO NO -
technology CMOS CMOS -
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) -
Terminal pitch 2.54 mm 2.54 mm -
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED -
switch bit YES YES -
type NOR TYPE NOR TYPE -
width 35.2 mm 35.2 mm -

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LM3S series solidified Bootloader problem~~urgent~~
I am using DK-LM3S9B96... It has a solidified Bootloader. I have studied how to start the Bootloader and want to force it to start from the solidified Bootloader when powered on, without checking whet...
MrStone123 Microcontroller MCU
Is it necessary to connect a data acquisition card when using Matlab serial port data acquisition?
I want to use MATLAB serial port to collect data, why do people say online that I need a data acquisition card or something? . . ....
大家都是好朋友 Analogue and Mixed Signal
Usage of OpenStore
hFlash = OpenStore(L"MSFlash"); hFlash = OpenStore(L"DSK0:"); What is the difference between these two sentences? Why can I only use the first sentence in the case of multi-bin, but only the second se...
frank_wt Embedded System
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