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Datasheet> All Categories > storage> storage> WSF41632-22H2I
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WSF41632-22H2I

Description
128KX32 SRAM & 512Kx32 FLASH MIXED MODULE
Categorystorage    storage   
File Size526KB，14 Pages
ManufacturerWhite Electronic Designs Corporation
Websitehttp://www.wedc.com/
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WSF41632-22H2I Overview

128KX32 SRAM & 512Kx32 FLASH MIXED MODULE

WSF41632-22H2I Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerWhite Electronic Designs Corporation
package instruction1.385 X 1.385 INCH, PGA TYPE, HERMETIC SEALED, CERAMIC, HIP-66
Reach Compliance Codeunknow
Maximum access time120 ns
Other featuresSRAM IS ORGANISED AS 128K X 32
JESD-30 codeS-CPGA-P66
JESD-609 codee0
length35.2 mm
memory density16777216 bi
Memory IC TypeMEMORY CIRCUIT
memory width32
Mixed memory typesFLASH+SRAM
Number of functions1
Number of terminals66
word count524288 words
character code512000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize512KX32
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codePGA
Encapsulate equivalent codePGA66,11X11
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
Maximum seat height5.7 mm
Maximum standby current0.08 A
Maximum slew rate0.5 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formPIN/PEG
Terminal pitch2.54 mm
Terminal locationPERPENDICULAR
Maximum time at peak reflow temperatureNOT SPECIFIED
width35.2 mm

WSF41632-22H2I Preview

White Electronic Designs
WSF41632-22XX
PRELIMINARY*
128K
X
32 SRAM & 512Kx32 FLASH MIXED MODULE
FEATURES
Access times of 25ns (SRAM) and 120ns (FLASH)
Packaging
• 66 pin, PGA Type, 1.385" square HIP, hermetic
ceramic HIP (Package 402)
• 68 lead, hermetic CQFP (G2T), 22.4mm (0.880")
square (Package 509) 4.57mm (0.180") height
Designed to fit JEDEC 68 lead 0.990" CQFJ
footprint (FIGURE 2). Package to be developed.
128Kx32 SRAM
512Kx32 5V Flash
Organized as 128Kx32 of SRAM and 512Kx32 of
Flash Memory with common data bus
Low power CMOS
Commercial, industrial and military temperature
ranges
TTL compatible inputs and outputs
* This product is under development, is not qualified or characterized and is subject to
change without notice.
Built-in decoupling caps and multiple ground pins
for low noise operation
Weight - 13 grams typical
FLASH MEMORY FEATURES
100,000 erase/program cycles minimum
Sector architecture
• 8 equal size sectors of 64KBytes each
• Any combination of sectors can be concurrently
erased. Also supports full chip erase
5V programming; 5V ± 10% supply
Embedded erase and program algorithms
Hardware write protection
Page program operation and internal program
control time.
Note: For programming information refer to flash programming 4M5 application note.
PIN CONFIGURATION FOR WSF41632-22H2X
Top View
1
I/O
8
I/O
9
I/O
10
A
14
A
16
A
11
A
0
A
18
I/O
0
I/O
1
I/O
2
11
22
12
FWE
2
#
SWE
2
#
GND
I/O
11
A
10
A
9
A
15
V
CC
FCS#
SCS#
I/O
3
33
23
I/O
15
I/O
14
I/O
13
I/O
12
OE#
A
17
FWE
1
#
I/O
7
I/O
6
I/O
5
I/O
4
I/O
24
I/O
25
I/O
26
A
7
A
12
SWE
1
#
A
13
A
8
I/O
16
I/O
17
I/O
18
44
34
V
CC
SWE
4
#
FWE
4
#
I/O
27
A
4
A
5
A
6
FWE
3
#
SWE
3
#
GND
I/O
19
55
45
I/O
31
I/O
30
I/O
29
I/O
28
A
1
A
2
A
3
I/O
23
I/O
22
I/O
21
I/O
20
66
I/O
0-7
OE#
A
0-18
SCS#
FCS#
Pin Description
D0-31
A0-18
SWE#1-4
SCS#
OE#
VCC
GND
NC
FWE#1-4
FCS
Data Inputs/Outputs
Address Inputs
SRAM Write Enables
SRAM Chip Select
Output Enable
Power Supply
Ground
Not Connected
Flash Write Enables
Flash Chip Select
56
Block Diagram
FWE
1
#
SWE
1
#
FWE
2
#
SWE
2
#
FWE
3
#
SWE
3
#
FWE
4
#
SWE
4
#
128K x 8 Flash
128K x 8 SRAM
128K x 8 Flash
128K x 8 SRAM
128K x 8 Flash
128K x 8 SRAM
128K x 8 Flash
128K x 8 SRAM
I/O
8-15
I/O
16-23
I/O
24-31
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
October, 2002
Rev. 4
1
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
White Electronic Designs
WSF41632-22XX
PRELIMINARY
FIGURE 2 – PIN CONFIGURATION FOR WSF41632-22G2TX
Top View
SWE
3
#
SWE
4
#
FWE
1
#
GND
A
6
V
CC
A
10
NC
A
0
A
1
A
2
A
3
A
4
A
5
A
7
A
8
A
9
Pin Description
D0-31
A0-18
SWE#1-4
SCS#
OE#
VCC
GND
NC
FWE#1-4
FCS
Data Inputs/Outputs
Address Inputs
SRAM Write Enables
SRAM Chip Select
Output Enable
Power Supply
Ground
Not Connected
Flash Write Enables
Flash Chip Select
9 8 7 6 5 4 3 2 1 68 67 66 65 64 63 62 61
I/O
0
I/O
1
I/O
2
I/O
3
I/O
4
I/O
5
I/O
6
I/O
7
GND
I/O
8
I/O
9
I/O
10
I/O
11
I/O
12
I/O
13
I/O
14
I/O
15
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
I/O
16
I/O
17
I/O
18
I/O
19
I/O
20
I/O
21
I/O
22
I/O
23
GND
I/O
24
I/O
25
I/O
26
I/O
27
I/O
28
I/O
29
I/O
30
I/O
31
27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43
FCS#
SWE
2
#
FWE
2
#
FWE
3
#
FWE
4
#
SCS#
SWE
1
#
OE#
V
CC
A
12
A
13
A
14
A
15
A
16
NC
A
11
NC
Block Diagram
FWE
1
#
OE#
A
0-18
SCS#
FCS#
SWE
1
#
FWE
2
#
SWE
2
#
FWE
3
#
SWE
3
#
FWE
4
#
SWE
4
#
128K x 8 Flash
128K x 8 SRAM
128K x 8 Flash
128K x 8 SRAM
128K x 8 Flash
128K x 8 SRAM
128K x 8 Flash
128K x 8 SRAM
I/O
0-7
I/O
8-15
I/O
16-23
I/O
24-31
0.940"
The WEDC 68 lead G2T CQFP fills the same fit and function
as the JEDEC 68 lead CQFJ or 68 PLCC. But the G2T has
the TCE and lead inspection advantage of the CQFP form.
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
October, 2002
Rev. 4
2
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
White Electronic Designs
ABSOLUTE MAXIMUM RATINGS
Parameter
Operating Temperature
Storage Temperature
Signal Voltage Relative to GND
Junction Temperature
Supply Voltage
Parameter
Flash Data Retention
20 years
WSF41632-22XX
PRELIMINARY
SRAM TRUTH TABLE
Unit
°C
°C
V
°C
V
SCS#
H
L
L
L
OE#
X
L
H
X
SWE#
X
H
H
L
Mode
Standby
Read
Read
Write
Data I/O
High Z
Data Out
High Z
Data In
Power
Standby
Active
Active
Active
Symbol
T
A
T
STG
V
G
T
J
V
CC
Min
-55
-65
-0.5
-0.5
Max
+125
+150
7.0
150
7.0
NOTE:
1. FCS# must remain high when SCS# is low.
Flash Endurance (write/erase cycles)
100,000 min
Parameter
OE# capacitance
F/S WE
1-4
# capacitance
F/S CS# capacitance
D
0-31
capacitance
A
0-16
capacitance
CAPACITANCE
Ta = +25°C
Symbol
C
OE
C
WE
C
CS
C
I/O
C
AD
Conditions
Max Unit
V
IN
= 0 V, f = 1.0 MHz 80 pF
V
IN
= 0 V, f = 1.0 MHz 30 pF
V
IN
= 0 V, f = 1.0 MHz 50 pF
V
IN
= 0 V, f = 1.0 MHz 30 pF
V
IN
= 0 V, f = 1.0 MHz 80 pF
NOTE:
1. Stresses above the absolute maximum rating may cause permanent damage to the
device. Extended operation at the maximum levels may degrade performance and
affect reliability.
RECOMMENDED OPERATING CONDITIONS
Parameter
Supply Voltage
Input High Voltage
Input Low Voltage
Symbol
V
CC
V
IH
V
IL
Min
4.5
2.2
-0.5
Max
5.5
V
CC
+ 0.3
+0.8
Unit
V
V
V
This parameter is guaranteed by design but not tested.
DC CHARACTERISTICS
V
CC
= 5.0V, V
SS
= 0V, -55°C
≤
T
A
≤
+125°C
Parameter
Input Leakage Current
Output Leakage Current
SRAM Operating Supply Current x 32 Mode
Standby Current
SRAM Output Low Voltage
SRAM Output High Voltage
Flash V
CC
Active Current for Read (1)
Flash V
CC
Active Current for Program or Erase (2)
Flash Output Low Voltage
Flash Output High Voltage
Flash Output High Voltage
Flash Low V
CC
Lock Out Voltage
Symbol
I
LI
I
LO
I
CCx32
I
SB
V
OL
V
OH
I
CC1
I
CC2
V
OL
V
OH1
V
OH2
V
LKO
Conditions
V
CC
= 5.5, V
IN
= GND to V
CC
SCS# = V
IH
, OE# = V
IH
, V
OUT
= GND to V
CC
SCS# = V
IL
, OE# = FCS# = V
IH
, f = 5MHz, V
CC
= 5.5
FCS# = SCS# = V
IH
, OE# = V
IH
, f = 5MHz, V
CC
= 5.5
I
OL
= 8mA, V
CC
= 4.5
I
OH
= -4.0mA, V
CC
= 4.5
FCS# = V
IL
, OE# = SCS# = V
IH
FCS# = V
IL
, OE# = SCS# = V
IH
I
OL
= 8.0mA, V
CC
= 4.5
I
OH
= -2.5 mA, V
CC
= 4.5
I
OH
= -100 µA, V
CC
= 4.5
Min
Max
10
10
620
80
0.4
260
300
0.45
0.85 x V
CC
V
CC
-0.4
3.2
Unit
µA
µA
mA
mA
V
V
mA
mA
V
V
V
V
2.4
4.2
NOTES:
1. The I
CC
current listed includes both the DC operating current and the frequency dependent component (@ 5 MHz).
The frequency component typically is less than 2mA/MHz, with OE# at V
IH
.
2. I
CC
active while Embedded Algorithm (program or erase) is in progress.
3. DC test conditions: V
IL
= 0.3V, V
IH
= V
CC
- 0.3V
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
October, 2002
Rev. 4
3
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
White Electronic Designs
SRAM AC CHARACTERISTICS
V
CC
= 5.0V, -55°C
≤
T
A
≤
+125°C
Parameter
Read Cycle
Read Cycle Time
Address Access Time
Output Hold from Address Change
Chip Select Access Time
Output Enable to Output Valid
Chip Select to Output in Low Z
Output Enable to Output in Low Z
Chip Disable to Output in High Z
Output Disable to Output in High Z
Symbol
Min
t
RC
t
AA
t
OH
t
ACS
t
OE
t
CLZ
1
t
OLZ
1
t
CHZ
1
t
OHZ
1
25
25
0
25
15
3
0
12
12
-25
Max
ns
ns
ns
ns
ns
ns
ns
ns
ns
Units
Parameter
Write Cycle
Write Cycle Time
Chip Select to End of Write
Address Valid to End of Write
Data Valid to End of Write
Write Pulse Width
Address Setup Time
Address Hold Time
Output Active from End of Write
Write Enable to Output in High Z
Data Hold from Write Time
WSF41632-22XX
PRELIMINARY
SRAM AC CHARACTERISTICS
V
CC
= 5.0V, -55°C
≤
T
A
≤
+125°C
Symbol
Min
t
WC
t
CW
t
AW
t
DW
t
WP
t
AS
t
AH
t
OW
1
t
WHZ
1
t
DH
25
20
20
15
20
3
0
3
15
0
-25
Max
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Units
1. This parameter is guaranteed by design but not tested.
1. This parameter is guaranteed by design but not tested.
FIGURE 2 – AC TEST CIRCUIT
AC Test Conditions
I
OL
Current Source
D.U.T.
C
eff
= 50 pf
V
Z
≈ 1.5V
(Bipolar Supply)
Parameter
Input Pulse Levels
Input Rise and Fall
Input and Output Reference Level
Output Timing Reference Level
Typ
V
IL
= 0, V
IH
= 3.0
5
1.5
1.5
Unit
V
ns
V
V
I
OH
Current Source
Notes:
V
Z
is programmable from -2V to +7V.
I
OL
& I
OH
programmable from 0 to 16mA.
Tester Impedance Z0 = 75 Ω.
V
Z
is typically the midpoint of V
OH
and V
OL
.
I
OL
& I
OH
are adjusted to simulate a typical resistive load circuit.
ATE tester includes jig capacitance.
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
October, 2002
Rev. 4
4
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
White Electronic Designs
WSF41632-22XX
PRELIMINARY
FIGURE 3 – SRAM TIMING WAVEFORM - READ CYCLE
t
RC
ADDRESS
t
AA
t
RC
ADDRESS
SCS#
t
ACS
t
AA
t
OH
SOE#
t
CHZ
t
CLZ
t
OE
t
OLZ
DATA I/O
HIGH IMPEDANCE
DATA I/O
PREVIOUS DATA VALID
DATA VALID
t
OHZ
DATA VALID
READ CYCLE 1, (SCS# = OE# = V
IL
, SWE# = FCS# = V
IH
)
READ CYCLE 2, (SWE# = FCS# = V
IH
)
FIGURE 4 – SRAM WRITE CYCLE - SWE# CONTROLLED
t
WC
ADDRESS
t
AW
t
CW
SCS#
t
AH
t
AS
SWE#
t
WP
t
OW
t
WHZ
t
DW
DATA VALID
t
DH
DATA I/O
WRITE CYCLE 1, SWE# CONTROLLED (FCS# = V
IH
)
FIGURE 5 – SRAM WRITE CYCLE - SCS# CONTROLLED
t
WC
ADDRESS
t
AS
SCS#
t
AW
t
CW
t
AH
t
WP
SWE#
t
DW
DATA I/O
DATA VALID
t
DH
WRITE CYCLE 2, SCS# CONTROLLED (FCS# = V
IH
)
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
October, 2002
Rev. 4
5
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com
More (Only the first 5 pages are displayed. Please Download Datasheet to view the full content.) >

WSF41632-22H2I Related Products

WSF41632-22H2I WSF41632-22G2TM WSF41632-22XX WSF41632-22H2MA WSF41632-22H2IA WSF41632-22H2C WSF41632-22H2CA WSF41632-22G2TMA WSF41632-22G2TIA WSF41632-22G2TI
Description 128KX32 SRAM & 512Kx32 FLASH MIXED MODULE 128KX32 SRAM & 512Kx32 FLASH MIXED MODULE 128KX32 SRAM & 512Kx32 FLASH MIXED MODULE 128KX32 SRAM & 512Kx32 FLASH MIXED MODULE 128KX32 SRAM & 512Kx32 FLASH MIXED MODULE 128KX32 SRAM & 512Kx32 FLASH MIXED MODULE 128KX32 SRAM & 512Kx32 FLASH MIXED MODULE 128KX32 SRAM & 512Kx32 FLASH MIXED MODULE 128KX32 SRAM & 512Kx32 FLASH MIXED MODULE 128KX32 SRAM & 512Kx32 FLASH MIXED MODULE
Is it Rohs certified? incompatible incompatible - incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Maker White Electronic Designs Corporation White Electronic Designs Corporation - White Electronic Designs Corporation White Electronic Designs Corporation White Electronic Designs Corporation White Electronic Designs Corporation White Electronic Designs Corporation White Electronic Designs Corporation White Electronic Designs Corporation
package instruction 1.385 X 1.385 INCH, PGA TYPE, HERMETIC SEALED, CERAMIC, HIP-66 22.40 MM, CERAMIC, QFP-68 - 1.385 X 1.385 INCH, PGA TYPE, HERMETIC SEALED, CERAMIC, HIP-66 1.385 X 1.385 INCH, PGA TYPE, HERMETIC SEALED, CERAMIC, HIP-66 1.385 X 1.385 INCH, PGA TYPE, HERMETIC SEALED, CERAMIC, HIP-66 1.385 X 1.385 INCH, PGA TYPE, HERMETIC SEALED, CERAMIC, HIP-66 22.40 MM, CERAMIC, QFP-68 22.40 MM, CERAMIC, QFP-68 22.40 MM, CERAMIC, QFP-68
Reach Compliance Code unknow unknown - unknow unknow unknow unknow unknow unknow unknow
Other features SRAM IS ORGANISED AS 128K X 32 SRAM IS ORGANISED AS 128K X 32 - SRAM IS ORGANISED AS 128K X 32 SRAM IS ORGANISED AS 128K X 32 SRAM IS ORGANISED AS 128K X 32 SRAM IS ORGANISED AS 128K X 32 SRAM IS ORGANISED AS 128K X 32 SRAM IS ORGANISED AS 128K X 32 SRAM IS ORGANISED AS 128K X 32
JESD-30 code S-CPGA-P66 S-CQMA-G68 - S-CPGA-P66 S-CPGA-P66 S-CPGA-P66 S-CPGA-P66 S-CQMA-G68 S-CQMA-G68 S-CQMA-G68
JESD-609 code e0 e4 - e0 e0 e4 e0 e0 e0 e4
memory density 16777216 bi 16777216 bit - 16777216 bi 16777216 bi 16777216 bi 16777216 bi 16777216 bi 16777216 bi 16777216 bi
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT - MEMORY CIRCUIT MEMORY CIRCUIT MEMORY CIRCUIT MEMORY CIRCUIT MEMORY CIRCUIT MEMORY CIRCUIT MEMORY CIRCUIT
memory width 32 32 - 32 32 32 32 32 32 32
Number of functions 1 1 - 1 1 1 1 1 1 1
Number of terminals 66 68 - 66 66 66 66 68 68 68
word count 524288 words 524288 words - 524288 words 524288 words 524288 words 524288 words 524288 words 524288 words 524288 words
character code 512000 512000 - 512000 512000 512000 512000 512000 512000 512000
Operating mode ASYNCHRONOUS ASYNCHRONOUS - ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C 125 °C - 125 °C 85 °C 70 °C 70 °C 125 °C 85 °C 85 °C
Minimum operating temperature -40 °C -55 °C - -55 °C -40 °C - - -55 °C -40 °C -40 °C
organize 512KX32 512KX32 - 512KX32 512KX32 512KX32 512KX32 512KX32 512KX32 512KX32
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED - CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
encapsulated code PGA QFP - PGA PGA PGA PGA - - QFP
Package shape SQUARE SQUARE - SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY MICROELECTRONIC ASSEMBLY - GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Certification status Not Qualified Not Qualified - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum supply voltage (Vsup) 5.5 V 5.5 V - 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V - 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V - 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount NO YES - NO NO NO NO YES YES YES
technology CMOS CMOS - CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL MILITARY - MILITARY INDUSTRIAL COMMERCIAL COMMERCIAL MILITARY INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) GOLD - TIN LEAD TIN LEAD GOLD TIN LEAD TIN LEAD TIN LEAD GOLD
Terminal form PIN/PEG GULL WING - PIN/PEG PIN/PEG PIN/PEG PIN/PEG GULL WING GULL WING GULL WING
Terminal pitch 2.54 mm 1.27 mm - 2.54 mm 2.54 mm 2.54 mm 2.54 mm - - 1.27 mm
Terminal location PERPENDICULAR QUAD - PERPENDICULAR PERPENDICULAR PERPENDICULAR PERPENDICULAR QUAD QUAD QUAD
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED

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Speaking of this transplantation, it is also quite painful. Hehe: STM32CubeMX can generate FreeRTOS templates, but there is no ucos. As an old user of ucos, I am naturally familiar with ucos-iii, but ...
caizhiwei stm32/stm8
Talking about DDR3
Talking about DDR3...
安_然 Test/Measurement
How does MFC convert the input CNC-specific code into CNC line segments?
I want to do an open CNC project. MFC gets a CNC-specific instruction. How can I convert this code into a CNC line segment? I am new to this and don't understand a lot of things. Please give me some a...
dengjiescut2006 Embedded System
ARM bare metal program vs. MCU - personal feelings
[color=#000000]When I was learning arm by myself before, I had some experience with bare metal, but there were many things I didn't understand. Now I have signed up for a training course to systematic...
Jacktang Microcontroller MCU
PCB routing: Cyclone V MBGA
Does anyone have information on Cyclone V MBGA383 high-speed PCB layout?...
lsfjing PCB Design
Crystal oscillator is an important component in computers
The development of science has made our lives faster, more convenient and more colorful. Computers and faxes have freed people from heavy labor, and the emergence of the Internet has broadened people'...
zkj2014 Integrated technical exchanges
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  1. Talking about DDR3
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