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ATF-551M4-BLK

Description
X BAND, Si, N-CHANNEL, RF SMALL SIGNAL, HEMFET
CategoryDiscrete semiconductor    The transistor   
File Size201KB,24 Pages
ManufacturerHP(Keysight)
Websitehttp://www.semiconductor.agilent.com/
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ATF-551M4-BLK Overview

X BAND, Si, N-CHANNEL, RF SMALL SIGNAL, HEMFET

ATF-551M4-BLK Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerHP(Keysight)
package instructionCHIP CARRIER, R-CBCC-N4
Contacts4
Reach Compliance Codeunknown
ECCN codeEAR99
Other featuresLOW NOISE
ConfigurationSINGLE
Minimum drain-source breakdown voltage5 V
Maximum drain current (ID)0.1 A
FET technologyHIGH ELECTRON MOBILITY
highest frequency bandX BAND
JESD-30 codeR-CBCC-N4
JESD-609 codee0
Number of components1
Number of terminals4
Operating modeDEPLETION MODE
Maximum operating temperature150 °C
Package body materialCERAMIC, METAL-SEALED COFIRED
Package shapeRECTANGULAR
Package formCHIP CARRIER
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Polarity/channel typeN-CHANNEL
Maximum power consumption environment0.27 W
Minimum power gain (Gp)15.5 dB
Certification statusNot Qualified
surface mountYES
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formNO LEAD
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
transistor applicationsAMPLIFIER
Transistor component materialsSILICON
Base Number Matches1
Agilent ATF-551M4 Low Noise
Enhancement Mode
Pseudomorphic HEMT in a
Miniature Leadless Package
Data Sheet
Features
• Very low noise figure and high
linearity
• Single Supply Enhancement Mode
Technology
[1]
optimized for 3V
operation
Description
Agilent Technologies’ ATF-551M4
is a high dynamic range, super
low noise, single supply
E-pHEMT GAAs FET housed in a
thin miniature leadless package.
The combination of small device
size, super low noise (under 1 dB
Fmin from 2 to 6 GHz), high
linearity and low power makes
the ATF-551M4 ideal for LNA or
hybrid module designs in wire-
less receiver in the 450 MHz to
10 GHz frequency band.
Applications include Cellular/
PCS/ WCDMA handsets and data
modem cards, fixed wireless
infrastructure in the 2.4, 3.5 GHz
and UNII frequency bands, as
well as 2.4 GHz 802.11b, 5 GHz
802.11a and HIPERLAN/2
Wireless LAN PC-cards.
MiniPak 1.4 mm x 1.2 mm Package
• Excellent uniformity in product
specifications
• 400 micron gate width
• Thin miniature package
1.4 mm x 1.2 mm x 0.7 mm
• Tape-and-reel packaging option
available
Pin Connections and
Package Marking
Source
Pin 3
Drain
Pin 4
Vx
Specifications
• 2 GHz; 2.7V, 10 mA (typ.)
• 24.1 dBm output 3
rd
order intercept
• 14.6 dBm output power at 1 dB gain
compression
• 0.5 dB noise figure
• 17.5 dB associated gain
Vx
Gate
Pin 2
Source
Pin 1
Note:
Top View. Package marking provides orientation,
product identification and date code.
“V” = Device Type Code
“x” = Date code character. A different
character is assigned for each month and
year.
Applications
• Low Noise Amplifier for:
– Cellular/PCS/WCDMA hand-
sets and modem cards
– 2.4 GHz, 3.5 GHz and UNII fixed
wireless infrastructure
– 2.4 GHz 802.11b Wireless LAN
– 5 GHz 802.11a and HIPERLAN
Wireless LAN
• General purpose discrete E-pHEMT
for other ultra low noise applications
Note:
1. Agilent’s enhancement mode E-pHEMT
devices are the first commercially available
single-supply GaAs transistors that do not
need a negative gate bias voltage for
operation. They can help simplify the design
and reduce the cost of receivers and
transmitters in many applications in the
450 MHz to 10 GHz frequency range.

ATF-551M4-BLK Related Products

ATF-551M4-BLK ATF-551M4 ATF-551M4-TR2 ATF-551M4-TR1
Description X BAND, Si, N-CHANNEL, RF SMALL SIGNAL, HEMFET X BAND, Si, N-CHANNEL, RF SMALL SIGNAL, HEMFET X BAND, Si, N-CHANNEL, RF SMALL SIGNAL, HEMFET X BAND, Si, N-CHANNEL, RF SMALL SIGNAL, HEMFET
highest frequency band X BAND X BAND X BAND X BAND
Number of components 1 1 1 1
Number of terminals 4 4 4 4
surface mount YES Yes YES YES
Terminal form NO LEAD NO LEAD NO LEAD NO LEAD
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM
transistor applications AMPLIFIER AMPLIFIER AMPLIFIER AMPLIFIER
Transistor component materials SILICON SILICON SILICON SILICON
Is it Rohs certified? incompatible - incompatible incompatible
Maker HP(Keysight) - HP(Keysight) HP(Keysight)
package instruction CHIP CARRIER, R-CBCC-N4 - CHIP CARRIER, R-CBCC-N4 CHIP CARRIER, R-CBCC-N4
Contacts 4 - 4 4
Reach Compliance Code unknown - unknown unknown
ECCN code EAR99 - EAR99 EAR99
Other features LOW NOISE - LOW NOISE LOW NOISE
Configuration SINGLE - SINGLE SINGLE
Minimum drain-source breakdown voltage 5 V - 5 V 5 V
Maximum drain current (ID) 0.1 A - 0.1 A 0.1 A
FET technology HIGH ELECTRON MOBILITY - HIGH ELECTRON MOBILITY HIGH ELECTRON MOBILITY
JESD-30 code R-CBCC-N4 - R-CBCC-N4 R-CBCC-N4
JESD-609 code e0 - e0 e0
Operating mode DEPLETION MODE - DEPLETION MODE DEPLETION MODE
Maximum operating temperature 150 °C - 150 °C 150 °C
Package body material CERAMIC, METAL-SEALED COFIRED - CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package shape RECTANGULAR - RECTANGULAR RECTANGULAR
Package form CHIP CARRIER - CHIP CARRIER CHIP CARRIER
Peak Reflow Temperature (Celsius) NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED
Polarity/channel type N-CHANNEL - N-CHANNEL N-CHANNEL
Maximum power consumption environment 0.27 W - 0.27 W 0.27 W
Minimum power gain (Gp) 15.5 dB - 15.5 dB 15.5 dB
Certification status Not Qualified - Not Qualified Not Qualified
Terminal surface Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Maximum time at peak reflow temperature NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED
Base Number Matches 1 - 1 1

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