Digital monolithic integrated circuits(MOS)
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| package instruction | DIP, |
| Reach Compliance Code | unknow |
| Commercial integrated circuit types | CONSUMER CIRCUIT |
| JESD-30 code | R-PDIP-T8 |
| JESD-609 code | e0 |
| length | 9.6 mm |
| Number of functions | 1 |
| Number of terminals | 8 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | -10 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Certification status | Not Qualified |
| Maximum seat height | 4.5 mm |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 7.62 mm |
| Base Number Matches | 1 |
| MN3101 | MN3102 | MN3133 | |
|---|---|---|---|
| Description | Digital monolithic integrated circuits(MOS) | Digital monolithic integrated circuits(MOS) | Digital monolithic integrated circuits(MOS) |
| Is it Rohs certified? | incompatible | incompatible | - |
| package instruction | DIP, | DIP, | - |
| Reach Compliance Code | unknow | unknow | - |
| Commercial integrated circuit types | CONSUMER CIRCUIT | CONSUMER CIRCUIT | - |
| JESD-30 code | R-PDIP-T8 | R-PDIP-T8 | - |
| JESD-609 code | e0 | e0 | - |
| length | 9.6 mm | 9.6 mm | - |
| Number of functions | 1 | 1 | - |
| Number of terminals | 8 | 8 | - |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| encapsulated code | DIP | DIP | - |
| Package shape | RECTANGULAR | RECTANGULAR | - |
| Package form | IN-LINE | IN-LINE | - |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | - |
| Certification status | Not Qualified | Not Qualified | - |
| Maximum seat height | 4.5 mm | 4.8 mm | - |
| surface mount | NO | NO | - |
| technology | CMOS | MOS | - |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | - |
| Terminal pitch | 2.54 mm | 2.54 mm | - |
| Terminal location | DUAL | DUAL | - |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | - |
| width | 7.62 mm | 7.62 mm | - |
| Base Number Matches | 1 | 1 | - |
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