24LC08BHT-I-MS datasheet, PDF - EEWORLD Datasheet

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24LC08BHT-I-MS: DescriptionEEPROM 8K 1K X 8 2.5V SER EE IND 1/2 ARRAY WP; Categorystorage; File Size795KB，33 Pages; ManufacturerMicrochip; Websitehttps://www.microchip.com

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EEPROM 8K 1K X 8 2.5V SER EE IND 1/2 ARRAY WP

24LC08BHT-I-MS Parametric

Parameter Name	Attribute value
Product Attribute	Attribute Value
Manufacturer	Microchip
Product Category	EEPROM
RoHS	Details
Mounting Style	SMD/SMT
Package / Case	MSOP-8
Memory Size	8 kbit
Organization	1 k x 8
Interface Type	Serial, 2-Wire, I2C
Access Time	900 ns
Data Retention	200 Year
Maximum Clock Frequency	400 kHz
Supply Current - Max	3 mA
Supply Voltage - Min	2.5 V
Supply Voltage - Max	5.5 V
Minimum Operating Temperature	- 40 C
Maximum Operating Temperature	+ 85 C
Packaging	Reel
NumOfPackaging	1
Operating Supply Current	3 mA
Operating Supply Voltage	2.5 V to 5.5 V
Factory Pack Quantity	2500
Unit Weight	0.004938 oz

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24AA08H/24LC08BH

8K I

™

Serial EEPROM with Half-Array Write-Protect

Device Selection Table

Part

Number

24AA08H

24LC08BH

Note 1:

Range

1.7-5.5

2.5-5.5

Max. Clock

Frequency

400 kHz

(1)

400 kHz

Temp.

Ranges

I, E

Description:

The Microchip Technology Inc. 24AA08H/24LC08BH

(24XX08H*) is an 8 Kbit Electrically Erasable PROM.

The device is organized as four blocks of 256 x 8-bit

memory with a 2-wire serial interface. Low-voltage

design permits operation down to 1.7V, with standby

and active currents of only 1

A

and 1 mA,

respectively. The 24XX08H also has a page write

capability for up to 16 bytes of data. The 24XX08H is

available in the standard 8-pin PDIP, surface mount

SOIC, TSSOP, 2x3 TDFN and MSOP packages, and

is also available in the 5-lead SOT-23 package. All

packages are RoHS compliant.

100 kHz for V

<2.5V

Features:

• Single Supply with Operation Down to 1.7V for

24AA08H Devices, 2.5V for 24LC08BH Devices

• Low-Power CMOS Technology:

- Read current 1 mA, max.

- Standby current 1

A,

max.

• 2-Wire Serial Interface, I

C™ Compatible

• Schmitt Trigger Inputs for Noise Suppression

• Output Slope Control to eliminate Ground Bounce

• 100 kHz and 400 kHz Clock Compatibility

• Page Write Time 3 ms, typical

• Self-Timed Erase/Write Cycle

• 16-Byte Page Write Buffer

• Hardware Write-Protect for Half-Array (200h-3FFh)

• ESD Protection >4,000V

• More than 1 Million Erase/Write Cycles

• Data Retention >200 years

• Factory Programming available

• Packages include 8-lead PDIP, SOIC, TSSOP,

TDFN, MSOP and 5-lead SOT-23

• RoHS Compliant

• Temperature Ranges:

- Industrial (I): -40°C to +85°C

- Automotive (E): -40°C to +125°C

Block Diagram

Generator

I/O

Control

Logic

Memory

Control

Logic

XDEC

EEPROM

Array

Page

Latches

I/O

SCL

YDEC

SDA

Sense Amp.

R/W Control

Package Types

PDIP, MSOP

SOT-23-5

SCL

Vss

SDA

Note:

Vcc

A0 1

A1 2

A2 3

SCL

SOIC, TSSOP

TDFN

8 V

7 WP

6 SCL

5 SDA

SCL

SDA

SDA V

*24XX08H is used in this document as a generic part

number for the 24AA08H/24LC08BH devices.

Pins A0, A1 and A2 are not used by the 24XX08. (No

internal connections).



2008-2013 Microchip Technology Inc.

DS20002084B-page 1

24LC08BHT-I-MS Related Products

	24LC08BHT-I-MS	24LC08BHT-E-SN	24AA08H-I-P	24LC08BH-I/SN	24LC08BH-E/MS	24LC08BHT-I/OT	24AA08HT-I/ST	24LC08BH-E/ST
Description	EEPROM 8K 1K X 8 2.5V SER EE IND 1/2 ARRAY WP	EEPROM 8K 1K X 8 2.5V SER EE EXT 1/2 ARRAY WP	EEPROM 8K 1K X 8 1.8V SER EE IND 1/2 ARRAY WP	EEPROM 8K 1K X 8 2.5V SER EE EXT 1/2 ARRAY WP	Electrically erasable programmable read-only memory 8K 1K X 8 2.5V SER EE EXT 1/2 ARRAY WP	Electrically Erasable Programmable Read Only Memory 8K 1K X 8 2.5V SER EE IND 1/2 ARRAY WP	Electrically Erasable Programmable Read Only Memory 8K 1K X 8 1.8V SER EE IND 1/2 ARRAY WP	Electrically erasable programmable read-only memory 8K 1K X 8 2.5V SER EE EXT 1/2 ARRAY WP
Is it lead-free?	-	-	-	Lead free	Lead free	Lead free	Lead free	Lead free
Is it Rohs certified?	-	-	-	conform to	conform to	conform to	conform to	conform to
Parts packaging code	-	-	-	SOIC	MSOP	SOT-23	SOIC	SOIC
package instruction	-	-	-	3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8	ROHS COMPLIANT, PLASTIC, MSOP-8	LSSOP, TSOP5/6,.11,37	4.40 MM, ROHS COMPLIANT, PLASTIC, TSSOP-8	4.40 MM, ROHS COMPLIANT, PLASTIC, TSSOP-8
Contacts	-	-	-	8	8	5	8	8
Reach Compliance Code	-	-	-	compliant	compliant	compliant	compliant	compliant
ECCN code	-	-	-	EAR99	EAR99	EAR99	EAR99	EAR99
Factory Lead Time	-	-	-	15 weeks	8 weeks	13 weeks	13 weeks	6 weeks
Maximum clock frequency (fCLK)	-	-	-	0.4 MHz	0.4 MHz	0.4 MHz	0.1 MHz	0.4 MHz
Data retention time - minimum	-	-	-	200	200	200	200	200
Durability	-	-	-	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles
I2C control byte	-	-	-	1010XMMR	1010XMMR	1010XMMR	1010XMMR	1010XMMR
JESD-30 code	-	-	-	R-PDSO-G8	S-PDSO-G8	R-PDSO-G5	R-PDSO-G8	R-PDSO-G8
JESD-609 code	-	-	-	e3	e3	e3	e3	e3
length	-	-	-	4.9 mm	3 mm	2.9 mm	4.4 mm	4.4 mm
memory density	-	-	-	2048 bit	2048 bit	2048 bit	2048 bit	2048 bit
Memory IC Type	-	-	-	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM
memory width	-	-	-	8	8	8	8	8
Humidity sensitivity level	-	-	-	3	1	1	1	1
Number of functions	-	-	-	1	1	1	1	1
Number of terminals	-	-	-	8	8	5	8	8
word count	-	-	-	256 words	256 words	256 words	256 words	256 words
character code	-	-	-	256	256	256	256	256
Operating mode	-	-	-	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	-	-	-	85 °C	125 °C	85 °C	85 °C	125 °C
Minimum operating temperature	-	-	-	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
organize	-	-	-	256X8	256X8	256X8	256X8	256X8
Package body material	-	-	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	-	-	-	SOP	TSSOP	LSSOP	TSSOP	TSSOP
Encapsulate equivalent code	-	-	-	SOP8,.25	TSSOP8,.19	TSOP5/6,.11,37	TSSOP8,.25	TSSOP8,.25
Package shape	-	-	-	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	-	-	-	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial	-	-	-	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL
Peak Reflow Temperature (Celsius)	-	-	-	260	260	260	260	260
power supply	-	-	-	3/5 V	3/5 V	3/5 V	2/5 V	3/5 V
Certification status	-	-	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	-	-	-	1.75 mm	1.1 mm	1.45 mm	1.2 mm	1.2 mm
Serial bus type	-	-	-	I2C	I2C	I2C	I2C	I2C
Maximum standby current	-	-	-	0.000001 A	0.000005 A	0.000001 A	0.000001 A	0.000005 A
Maximum slew rate	-	-	-	0.003 mA	0.003 mA	0.003 mA	0.003 mA	0.003 mA
Maximum supply voltage (Vsup)	-	-	-	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	-	-	-	2.5 V	2.5 V	2.5 V	1.7 V	2.5 V
Nominal supply voltage (Vsup)	-	-	-	5 V	5 V	5 V	2.5 V	5 V
surface mount	-	-	-	YES	YES	YES	YES	YES
technology	-	-	-	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	-	-	-	INDUSTRIAL	AUTOMOTIVE	INDUSTRIAL	INDUSTRIAL	AUTOMOTIVE
Terminal surface	-	-	-	Matte Tin (Sn) - annealed	Matte Tin (Sn) - annealed	Matte Tin (Sn) - annealed	Matte Tin (Sn) - annealed	Matte Tin (Sn) - annealed
Terminal form	-	-	-	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	-	-	-	1.27 mm	0.65 mm	0.95 mm	0.65 mm	0.65 mm
Terminal location	-	-	-	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	-	-	-	40	40	40	40	40
width	-	-	-	3.9 mm	3 mm	1.55 mm	3 mm	3 mm
Maximum write cycle time (tWC)	-	-	-	5 ms	5 ms	5 ms	5 ms	5 ms
write protect	-	-	-	HARDWARE	HARDWARE	HARDWARE	HARDWARE	HARDWARE
Base Number Matches	-	-	-	1	1	1	1	1

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