|
TC40H375P |
TC40H375 |
TC40H375F |
| Description |
C2MOS DIGITAL INTERGRATED CIRCUIT SILICON MONOLITHIC |
C2MOS DIGITAL INTERGRATED CIRCUIT SILICON MONOLITHIC |
C2MOS DIGITAL INTERGRATED CIRCUIT SILICON MONOLITHIC |
| Is it Rohs certified? |
incompatible |
- |
incompatible |
| Maker |
Toshiba Semiconductor |
- |
Toshiba Semiconductor |
| package instruction |
DIP, DIP16,.3 |
- |
SOP, SOP16,.3 |
| Reach Compliance Code |
unknow |
- |
unknow |
| JESD-30 code |
R-PDIP-T16 |
- |
R-PDSO-G16 |
| JESD-609 code |
e0 |
- |
e0 |
| Load capacitance (CL) |
15 pF |
- |
15 pF |
| Logic integrated circuit type |
D LATCH |
- |
D LATCH |
| MaximumI(ol) |
0.0014 A |
- |
0.0014 A |
| Number of digits |
4 |
- |
4 |
| Number of functions |
1 |
- |
1 |
| Number of terminals |
16 |
- |
16 |
| Maximum operating temperature |
85 °C |
- |
85 °C |
| Minimum operating temperature |
-40 °C |
- |
-40 °C |
| Package body material |
PLASTIC/EPOXY |
- |
PLASTIC/EPOXY |
| encapsulated code |
DIP |
- |
SOP |
| Encapsulate equivalent code |
DIP16,.3 |
- |
SOP16,.3 |
| Package shape |
RECTANGULAR |
- |
RECTANGULAR |
| Package form |
IN-LINE |
- |
SMALL OUTLINE |
| Prop。Delay @ Nom-Su |
65 ns |
- |
65 ns |
| Certification status |
Not Qualified |
- |
Not Qualified |
| surface mount |
NO |
- |
YES |
| technology |
CMOS |
- |
CMOS |
| Temperature level |
INDUSTRIAL |
- |
INDUSTRIAL |
| Terminal surface |
Tin/Lead (Sn/Pb) |
- |
Tin/Lead (Sn/Pb) |
| Terminal form |
THROUGH-HOLE |
- |
GULL WING |
| Terminal pitch |
2.54 mm |
- |
1.27 mm |
| Terminal location |
DUAL |
- |
DUAL |
| Base Number Matches |
1 |
- |
1 |