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TC40H375F

Description
C2MOS DIGITAL INTERGRATED CIRCUIT SILICON MONOLITHIC
Categorylogic    logic   
File Size129KB,4 Pages
ManufacturerToshiba Semiconductor
Websitehttp://toshiba-semicon-storage.com/
Download Datasheet Parametric Compare View All

TC40H375F Overview

C2MOS DIGITAL INTERGRATED CIRCUIT SILICON MONOLITHIC

TC40H375F Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerToshiba Semiconductor
package instructionSOP, SOP16,.3
Reach Compliance Codeunknow
JESD-30 codeR-PDSO-G16
JESD-609 codee0
Load capacitance (CL)15 pF
Logic integrated circuit typeD LATCH
MaximumI(ol)0.0014 A
Number of digits4
Number of functions1
Number of terminals16
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Encapsulate equivalent codeSOP16,.3
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Prop。Delay @ Nom-Su65 ns
Certification statusNot Qualified
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
Base Number Matches1

TC40H375F Related Products

TC40H375F TC40H375P TC40H375
Description C2MOS DIGITAL INTERGRATED CIRCUIT SILICON MONOLITHIC C2MOS DIGITAL INTERGRATED CIRCUIT SILICON MONOLITHIC C2MOS DIGITAL INTERGRATED CIRCUIT SILICON MONOLITHIC
Is it Rohs certified? incompatible incompatible -
Maker Toshiba Semiconductor Toshiba Semiconductor -
package instruction SOP, SOP16,.3 DIP, DIP16,.3 -
Reach Compliance Code unknow unknow -
JESD-30 code R-PDSO-G16 R-PDIP-T16 -
JESD-609 code e0 e0 -
Load capacitance (CL) 15 pF 15 pF -
Logic integrated circuit type D LATCH D LATCH -
MaximumI(ol) 0.0014 A 0.0014 A -
Number of digits 4 4 -
Number of functions 1 1 -
Number of terminals 16 16 -
Maximum operating temperature 85 °C 85 °C -
Minimum operating temperature -40 °C -40 °C -
Package body material PLASTIC/EPOXY PLASTIC/EPOXY -
encapsulated code SOP DIP -
Encapsulate equivalent code SOP16,.3 DIP16,.3 -
Package shape RECTANGULAR RECTANGULAR -
Package form SMALL OUTLINE IN-LINE -
Prop。Delay @ Nom-Su 65 ns 65 ns -
Certification status Not Qualified Not Qualified -
surface mount YES NO -
technology CMOS CMOS -
Temperature level INDUSTRIAL INDUSTRIAL -
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) -
Terminal form GULL WING THROUGH-HOLE -
Terminal pitch 1.27 mm 2.54 mm -
Terminal location DUAL DUAL -
Base Number Matches 1 1 -
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