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TC40H375

Description
C2MOS DIGITAL INTERGRATED CIRCUIT SILICON MONOLITHIC
File Size129KB,4 Pages
ManufacturerToshiba Semiconductor
Websitehttp://toshiba-semicon-storage.com/
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TC40H375 Overview

C2MOS DIGITAL INTERGRATED CIRCUIT SILICON MONOLITHIC

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TC40H375 TC40H375P TC40H375F
Description C2MOS DIGITAL INTERGRATED CIRCUIT SILICON MONOLITHIC C2MOS DIGITAL INTERGRATED CIRCUIT SILICON MONOLITHIC C2MOS DIGITAL INTERGRATED CIRCUIT SILICON MONOLITHIC
Is it Rohs certified? - incompatible incompatible
Maker - Toshiba Semiconductor Toshiba Semiconductor
package instruction - DIP, DIP16,.3 SOP, SOP16,.3
Reach Compliance Code - unknow unknow
JESD-30 code - R-PDIP-T16 R-PDSO-G16
JESD-609 code - e0 e0
Load capacitance (CL) - 15 pF 15 pF
Logic integrated circuit type - D LATCH D LATCH
MaximumI(ol) - 0.0014 A 0.0014 A
Number of digits - 4 4
Number of functions - 1 1
Number of terminals - 16 16
Maximum operating temperature - 85 °C 85 °C
Minimum operating temperature - -40 °C -40 °C
Package body material - PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code - DIP SOP
Encapsulate equivalent code - DIP16,.3 SOP16,.3
Package shape - RECTANGULAR RECTANGULAR
Package form - IN-LINE SMALL OUTLINE
Prop。Delay @ Nom-Su - 65 ns 65 ns
Certification status - Not Qualified Not Qualified
surface mount - NO YES
technology - CMOS CMOS
Temperature level - INDUSTRIAL INDUSTRIAL
Terminal surface - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form - THROUGH-HOLE GULL WING
Terminal pitch - 2.54 mm 1.27 mm
Terminal location - DUAL DUAL
Base Number Matches - 1 1
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