HD6417708F60 datasheet, PDF - EEWORLD Datasheet

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HD6417708F60: DescriptionRISC MICROCONTROLLER; CategoryThe embedded processor and controller Microcontrollers and processors; File Size3MB，625 Pages; ManufacturerHitachi （Renesas ）; Websitehttp://www.renesas.com/eng/

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HD6417708F60 Overview

RISC MICROCONTROLLER

HD6417708F60 Parametric

Parameter Name	Attribute value
Parts packaging code	QFP
package instruction	LFQFP,
Contacts	144
Reach Compliance Code	unknow
ECCN code	3A001.A.3
Has ADC	NO
maximum clock frequency	60 MHz
DAC channel	NO
DMA channel	NO
External data bus width	32
JESD-30 code	S-PQFP-G144
length	20 mm
Number of I/O lines	8
Number of terminals	144
PWM channel	NO
Package body material	PLASTIC/EPOXY
encapsulated code	LFQFP
Package shape	SQUARE
Package form	FLATPACK, LOW PROFILE, FINE PITCH
Certification status	Not Qualified
Maximum seat height	1.7 mm
Nominal supply voltage	3.3 V
surface mount	YES
technology	CMOS
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	QUAD
width	20 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC
Base Number Matches	1

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SH7708 Series

SH7708, SH7708S, SH7708R

Hardware Manual

ADE-602-105E

Rev.6.0

5/5/99

Hitachi, Ltd.

Cautions

1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s

patent, copyright, trademark, or other intellectual property rights for information contained in

this document. Hitachi bears no responsibility for problems that may arise with third party’s

rights, including intellectual property rights, in connection with use of the information

contained in this document.

2. Products and product specifications may be subject to change without notice. Confirm that you

have received the latest product standards or specifications before final design, purchase or use.

3. Hitachi makes every attempt to ensure that its products are of high quality and reliability.

However, contact Hitachi’s sales office before using the product in an application that demands

especially high quality and reliability or where its failure or malfunction may directly threaten

human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power,

combustion control, transportation, traffic, safety equipment or medical equipment for life

support.

4. Design your application so that the product is used within the ranges guaranteed by Hitachi

particularly for maximum rating, operating supply voltage range, heat radiation characteristics,

installation conditions and other characteristics. Hitachi bears no responsibility for failure or

damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider

normally foreseeable failure rates or failure modes in semiconductor devices and employ

systemic measures such as fail-safes, so that the equipment incorporating Hitachi product does

not cause bodily injury, fire or other consequential damage due to operation of the Hitachi

product.

5. This product is not designed to be radiation resistant.

6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document

without written approval from Hitachi.

7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi

semiconductor products.

Contents

Section 1 Overview and Pin Functions............................................... 1

1.1 SH7708 Series Features ........................................................................................1

1.2 Block Diagram ....................................................................................................6

1.3 Pin Description ...................................................................................................7

1.3.1 Pin Arrangement ......................................................................................7

1.3.2 SH7708 Series Pin Functions.....................................................................8

Section 2 CPU .......................................................................... 13

2.1 Register Configuration..........................................................................................13

2.1.1 Privileged Mode and Banks.........................................................................13

2.1.2 General Registers .....................................................................................16

2.1.3 System Registers .....................................................................................17

2.1.4 Control Registers .....................................................................................17

2.2 Data Formats ......................................................................................................19

2.2.1 Data Format in Registers ...........................................................................19

2.2.2 Data Format in Memory............................................................................19

2.3 Instruction Features..............................................................................................20

2.3.1 Execution Environment.............................................................................20

2.3.2 Addressing Modes.....................................................................................22

2.3.3 Instruction Formats ..................................................................................26

2.4 Instruction Set.....................................................................................................29

2.4.1 Instruction Set Classified by Function..........................................................29

2.4.2 Instruction Code Map................................................................................45

2.5 Processor States and Processor Modes......................................................................48

2.5.1 Processor States.......................................................................................48

2.5.2 Processor Modes ......................................................................................49

Section 3 Memory Management Unit (MMU)....................................... 51

3.1 Overview............................................................................................................51

3.1.1 Features..................................................................................................51

3.1.2 Role of MMU .........................................................................................51

3.1.3 SH7708 Series MMU ...............................................................................54

3.1.4 Register Configuration ..............................................................................57

3.2 Register Description .............................................................................................58

3.3 TLB Functions ....................................................................................................60

3.3.1 Configuration of the TLB ..........................................................................60

3.3.2 TLB Indexing ..........................................................................................62

3.3.3 TLB Address Comparison ..........................................................................63

3.3.4 Page Management Information....................................................................65

HD6417708F60 Related Products

	HD6417708F60	SH7708	SH7708R	SH7708S	HD6417708STF60	HD6417708SF60	HD6417708RF100
Description	RISC MICROCONTROLLER	RISC MICROCONTROLLER	RISC MICROCONTROLLER	RISC MICROCONTROLLER	RISC MICROCONTROLLER	RISC MICROCONTROLLER	RISC MICROCONTROLLER
Parts packaging code	QFP	QFP	QFP	QFP	QFP	-	QFP
package instruction	LFQFP,	LFQFP, QFP144,.87SQ,20	LFQFP,	LFQFP,	TFQFP,	-	LFQFP,
Contacts	144	144	144	144	144	-	144
Reach Compliance Code	unknow	unknow	unknow	unknow	unknow	-	unknow
ECCN code	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	-	-	3A001.A.3
Has ADC	NO	-	NO	NO	-	-	NO
maximum clock frequency	60 MHz	60 MHz	100 MHz	60 MHz	-	-	60 MHz
DAC channel	NO	-	NO	NO	-	-	NO
DMA channel	NO	-	NO	NO	-	-	NO
External data bus width	32	32	32	32	-	-	32
JESD-30 code	S-PQFP-G144	S-PQFP-G144	S-PQFP-G144	S-PQFP-G144	S-PQFP-G144	-	S-PQFP-G144
length	20 mm	20 mm	20 mm	20 mm	16 mm	-	20 mm
Number of I/O lines	8	-	8	8	-	-	8
Number of terminals	144	144	144	144	144	-	144
PWM channel	NO	-	NO	NO	-	-	NO
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY
encapsulated code	LFQFP	LFQFP	LFQFP	LFQFP	TFQFP	-	LFQFP
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	-	SQUARE
Package form	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, THIN PROFILE, FINE PITCH	-	FLATPACK, LOW PROFILE, FINE PITCH
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified
Maximum seat height	1.7 mm	1.7 mm	1.7 mm	1.7 mm	1.2 mm	-	1.7 mm
Nominal supply voltage	3.3 V	3.3 V	3.3 V	3.3 V	-	-	3.3 V
surface mount	YES	YES	YES	YES	YES	-	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	-	CMOS
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	-	GULL WING
Terminal pitch	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.4 mm	-	0.5 mm
Terminal location	QUAD	QUAD	QUAD	QUAD	QUAD	-	QUAD
width	20 mm	20 mm	20 mm	20 mm	16 mm	-	20 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC	MICROPROCESSOR, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	-	MICROCONTROLLER, RISC
Maker	-	Hitachi （Renesas ）	Hitachi （Renesas ）	Hitachi （Renesas ）	Hitachi （Renesas ）	-	Hitachi （Renesas ）
Address bus width	-	26	26	26	-	-	26
bit size	-	32	32	32	-	-	32
Maximum operating temperature	-	75 °C	75 °C	75 °C	-	-	75 °C
Minimum operating temperature	-	-20 °C	-20 °C	-20 °C	-	-	-20 °C
Maximum supply voltage	-	3.6 V	3.6 V	3.6 V	-	-	3.6 V
Minimum supply voltage	-	3 V	3.15 V	3 V	-	-	3.15 V
Temperature level	-	COMMERCIAL EXTENDED	COMMERCIAL EXTENDED	COMMERCIAL EXTENDED	-	-	COMMERCIAL EXTENDED

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