HD6417708SF60 datasheet, PDF - EEWORLD Datasheet

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HD6417708SF60: DescriptionRISC MICROCONTROLLER; Categorysemiconductor The embedded processor and controller; File Size3MB，625 Pages; ManufacturerHitachi （Renesas ）; Websitehttp://www.renesas.com/eng/

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HD6417708SF60 Overview

RISC MICROCONTROLLER

HD6417708SF60 Parametric

Parameter Name	Attribute value
state	ACTIVE
Microprocessor type	RISC MICROCONTROLLER

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SH7708 Series

SH7708, SH7708S, SH7708R

Hardware Manual

ADE-602-105E

Rev.6.0

5/5/99

Hitachi, Ltd.

Cautions

1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s

patent, copyright, trademark, or other intellectual property rights for information contained in

this document. Hitachi bears no responsibility for problems that may arise with third party’s

rights, including intellectual property rights, in connection with use of the information

contained in this document.

2. Products and product specifications may be subject to change without notice. Confirm that you

have received the latest product standards or specifications before final design, purchase or use.

3. Hitachi makes every attempt to ensure that its products are of high quality and reliability.

However, contact Hitachi’s sales office before using the product in an application that demands

especially high quality and reliability or where its failure or malfunction may directly threaten

human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power,

combustion control, transportation, traffic, safety equipment or medical equipment for life

support.

4. Design your application so that the product is used within the ranges guaranteed by Hitachi

particularly for maximum rating, operating supply voltage range, heat radiation characteristics,

installation conditions and other characteristics. Hitachi bears no responsibility for failure or

damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider

normally foreseeable failure rates or failure modes in semiconductor devices and employ

systemic measures such as fail-safes, so that the equipment incorporating Hitachi product does

not cause bodily injury, fire or other consequential damage due to operation of the Hitachi

product.

5. This product is not designed to be radiation resistant.

6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document

without written approval from Hitachi.

7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi

semiconductor products.

Contents

Section 1 Overview and Pin Functions............................................... 1

1.1 SH7708 Series Features ........................................................................................1

1.2 Block Diagram ....................................................................................................6

1.3 Pin Description ...................................................................................................7

1.3.1 Pin Arrangement ......................................................................................7

1.3.2 SH7708 Series Pin Functions.....................................................................8

Section 2 CPU .......................................................................... 13

2.1 Register Configuration..........................................................................................13

2.1.1 Privileged Mode and Banks.........................................................................13

2.1.2 General Registers .....................................................................................16

2.1.3 System Registers .....................................................................................17

2.1.4 Control Registers .....................................................................................17

2.2 Data Formats ......................................................................................................19

2.2.1 Data Format in Registers ...........................................................................19

2.2.2 Data Format in Memory............................................................................19

2.3 Instruction Features..............................................................................................20

2.3.1 Execution Environment.............................................................................20

2.3.2 Addressing Modes.....................................................................................22

2.3.3 Instruction Formats ..................................................................................26

2.4 Instruction Set.....................................................................................................29

2.4.1 Instruction Set Classified by Function..........................................................29

2.4.2 Instruction Code Map................................................................................45

2.5 Processor States and Processor Modes......................................................................48

2.5.1 Processor States.......................................................................................48

2.5.2 Processor Modes ......................................................................................49

Section 3 Memory Management Unit (MMU)....................................... 51

3.1 Overview............................................................................................................51

3.1.1 Features..................................................................................................51

3.1.2 Role of MMU .........................................................................................51

3.1.3 SH7708 Series MMU ...............................................................................54

3.1.4 Register Configuration ..............................................................................57

3.2 Register Description .............................................................................................58

3.3 TLB Functions ....................................................................................................60

3.3.1 Configuration of the TLB ..........................................................................60

3.3.2 TLB Indexing ..........................................................................................62

3.3.3 TLB Address Comparison ..........................................................................63

3.3.4 Page Management Information....................................................................65

HD6417708SF60 Related Products

	HD6417708SF60	SH7708	SH7708R	SH7708S	HD6417708F60	HD6417708STF60	HD6417708RF100
Description	RISC MICROCONTROLLER	RISC MICROCONTROLLER	RISC MICROCONTROLLER	RISC MICROCONTROLLER	RISC MICROCONTROLLER	RISC MICROCONTROLLER	RISC MICROCONTROLLER
Maker	-	Hitachi （Renesas ）	Hitachi （Renesas ）	Hitachi （Renesas ）	-	Hitachi （Renesas ）	Hitachi （Renesas ）
Parts packaging code	-	QFP	QFP	QFP	QFP	QFP	QFP
package instruction	-	LFQFP, QFP144,.87SQ,20	LFQFP,	LFQFP,	LFQFP,	TFQFP,	LFQFP,
Contacts	-	144	144	144	144	144	144
Reach Compliance Code	-	unknow	unknow	unknow	unknow	unknow	unknow
ECCN code	-	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	-	3A001.A.3
Address bus width	-	26	26	26	-	-	26
bit size	-	32	32	32	-	-	32
maximum clock frequency	-	60 MHz	100 MHz	60 MHz	60 MHz	-	60 MHz
External data bus width	-	32	32	32	32	-	32
JESD-30 code	-	S-PQFP-G144	S-PQFP-G144	S-PQFP-G144	S-PQFP-G144	S-PQFP-G144	S-PQFP-G144
length	-	20 mm	20 mm	20 mm	20 mm	16 mm	20 mm
Number of terminals	-	144	144	144	144	144	144
Maximum operating temperature	-	75 °C	75 °C	75 °C	-	-	75 °C
Minimum operating temperature	-	-20 °C	-20 °C	-20 °C	-	-	-20 °C
Package body material	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	-	LFQFP	LFQFP	LFQFP	LFQFP	TFQFP	LFQFP
Package shape	-	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	-	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, THIN PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH
Certification status	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	-	1.7 mm	1.7 mm	1.7 mm	1.7 mm	1.2 mm	1.7 mm
Maximum supply voltage	-	3.6 V	3.6 V	3.6 V	-	-	3.6 V
Minimum supply voltage	-	3 V	3.15 V	3 V	-	-	3.15 V
Nominal supply voltage	-	3.3 V	3.3 V	3.3 V	3.3 V	-	3.3 V
surface mount	-	YES	YES	YES	YES	YES	YES
technology	-	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	-	COMMERCIAL EXTENDED	COMMERCIAL EXTENDED	COMMERCIAL EXTENDED	-	-	COMMERCIAL EXTENDED
Terminal form	-	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	-	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.4 mm	0.5 mm
Terminal location	-	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD
width	-	20 mm	20 mm	20 mm	20 mm	16 mm	20 mm
uPs/uCs/peripheral integrated circuit type	-	MICROPROCESSOR, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC
Has ADC	-	-	NO	NO	NO	-	NO
DAC channel	-	-	NO	NO	NO	-	NO
DMA channel	-	-	NO	NO	NO	-	NO
Number of I/O lines	-	-	8	8	8	-	8
PWM channel	-	-	NO	NO	NO	-	NO

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