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LWY87S

Description
Micro SIDELED White Hyper-Bright LED
CategoryLED optoelectronic/LED    photoelectric   
File Size132KB,14 Pages
ManufacturerOsram Opto Semiconductor
Websitehttps://www.osram.com/index-2.jsp
Download Datasheet Parametric Compare View All

LWY87S Overview

Micro SIDELED White Hyper-Bright LED

LWY87S Parametric

Parameter NameAttribute value
MakerOsram Opto Semiconductor
Reach Compliance Codeunknow
colorWHITE
ConfigurationSINGLE
Maximum forward current0.01 A
Lens typeDIFFUSED
Nominal luminous intensity70.0 mcd
Installation featuresSURFACE MOUNT
Number of functions1
Number of terminals2
Optoelectronic device typesSINGLE COLOR LED
total height1.1 mm
method of packingBULK
shapeRECTANGULAR
size1.7 mm
surface mountYES
Micro SIDELED
White Hyper-Bright LED
LW Y87S
Vorläufige Daten / Preliminary Data
Besondere Merkmale
Gehäusetyp:
weißes SMT Gehäuse
Besonderheit des Bauteils:
kleine Bauform
mit extrem breiter Abstrahlcharakteristik; ideal
für Hinterleuchtungen und Einkopplungen in
Lichtleiter
Farbort:
x = 0,33, y = 0,33 nach
CIE 1931 (weiß)
typische Farbtemperatur:
5600 K
Farbwiedergabeindex:
80
Abstrahlwinkel:
Lambertscher Strahler (120°)
Technologie:
InGaN
optischer Wirkungsgrad:
4 lm/W
Gruppierungsparameter:
Lichtstärke, Farbort
Verarbeitungsmethode:
für alle
SMT-Bestücktechniken geeignet
Lötmethode:
IR Reflow Löten und
Wellenlöten (TTW)
Vorbehandlung:
nach JEDEC Level 2
Gurtung:
8 mm Gurt mit 3000/Rolle, ø180 mm
oder 10000/Rolle, ø330 mm
ESD-Festigkeit:
ESD-sicher bis 2 kV nach
EOS/ESD-5.1-1993
Anwendungen
• Hinterleuchtung (LCD, Mobiltelefone, Schalter,
Tasten, Displays, Werbebeleuchtung)
• optimierte Einkopplung in Lichtleiter
Features
package:
white SMT package
feature of the deivce:
small package with
extremely wide viewing angle; ideal for
backlighting and coupling in light guides
color coordinates:
x = 0.33, y = 0.33 acc. to
CIE 1931 (white)
typ. color temperature:
5600 K
color reproduction index:
80
viewing angle:
Lambertian Emitter (120°)
technology:
InGaN
optical efficiency:
4 lm/W
grouping parameter:
luminous intensity,
color coordinates
assembly methods:
suitable for all
SMT assembly methods
soldering methods:
IR reflow soldering and
TTW soldering
preconditioning:
acc. to JEDEC Level 2
taping:
8 mm tape with 3000/reel, ø180 mm
or 10000/reel, ø330 mm
ESD-withstand voltage:
up to 2 kV acc. to
EOS/ESD-5.1-1993
Applications
• backlighting (LCD, mobile phones, switches,
keys, displays, illuminated advertising)
• optimized coupling into light guides
2001-02-14
1

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