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PMEG3002TV

Description
0.2 A very low VF MEGA Schottky barrier dual rectifier in SOT666 package
CategoryDiscrete semiconductor    diode   
File Size44KB,10 Pages
ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.)
Websitehttps://www.nxp.com/
Environmental Compliance
Download Datasheet Parametric View All

PMEG3002TV Overview

0.2 A very low VF MEGA Schottky barrier dual rectifier in SOT666 package

PMEG3002TV Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerPhilips Semiconductors (NXP Semiconductors N.V.)
Reach Compliance Codeunknown
Maximum forward voltage (VF)0.19 V
Maximum operating temperature150 °C
Minimum operating temperature-65 °C
Maximum power dissipation0.4 W
Maximum repetitive peak reverse voltage30 V
Maximum reverse current30 µA
Reverse test voltage30 V
surface mountYES
PMEG3002TV
0.2 A very low V
F
MEGA Schottky barrier dual rectifier in
SOT666 package
Rev. 01 — 21 October 2005
Product data sheet
1. Product profile
1.1 General description
Planar Maximum Efficiency General Application (MEGA) Schottky barrier dual rectifier
with an integrated guard ring for stress protection, encapsulated in a SOT666 ultra small
and flat lead Surface Mounted Device (SMD) plastic package.
Table 1:
Product overview
Package
Philips
PMEG3002TV
SOT666
JEITA
-
dual isolated
Configuration
Type number
1.2 Features
s
s
s
s
Forward current:
0.2 A
Reverse voltage:
30 V
Very low forward voltage
Ultra small and flat lead SMD plastic package
1.3 Applications
s
s
s
s
s
Low voltage rectification
High efficiency DC-to-DC conversion
Switch mode power supply
Inverse polarity protection
Low power consumption applications
1.4 Quick reference data
Table 2:
Symbol
Per diode
I
F
V
R
V
F
[1]
[2]
Quick reference data
Parameter
forward current
reverse voltage
forward voltage
I
F
= 200 mA
[2]
Conditions
T
amb
25
°C
[1]
Min
-
-
-
Typ
-
-
420
Max
0.2
30
480
Unit
A
V
mV
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
Pulse test: t
p
300
µs; δ ≤
0.02.

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