DATASHEET
High Density Secure Memory
DDR3 SDRAM
Available From 1GB to 8GB
• Advanced miniaturization technology
• Data transfer speeds up to 1600 Mb/s
• -55 to +125°C operating temperatures
• Including Decoupling and Terminations
• Manufactured in a DMEA-trusted US facility
Mercury Systems’ advanced design and packaging techniques
miniaturize DDR3 SDRAM memory in a compact, highly ruggedized
package. These devices are ideally suited for military and
commercial aerospace applications requiring high-speed DDR3
memory optimized for size, weight, and power.
Mercury Systems is currently engaging with customers in design
opportunities requiring DDR3 memory performance. To participate
in this design program, please contact your Mercury Systems
representative or contact us at
Secure.Memory@mrcy.com
• Programmable CAS write latency (CWL)
• Programmable Posted CAS additive latency (AL)
• Write leveling
•
Configured as 1-Rank x72-bit or x64-bit data
•
Requires V
TT
•
Built-in Termination and Decoupling
Benefits
•
Up to 75% space savings vs discrete chip packages
•
Military-grade performance without sacrificing the benefits of
DDR3 memory
•
Up to 88% component reduction
•
100% burn-in and electrical test for the highest quality assurance
•
Available component End of Life management for long-term supply
continuity
Product Features
•
DDR3 Data Rate = 800, 1066, 1333, 1600 Mb/s
•
Supply Voltage = 1.35V (DDR3L) or 1.5V (DDR3)
•
Center terminated push/pull I/O
•
Differential bidirectional data strobe
•
Differential clock inputs (CK, CK#)
•
8n-bit prefetch architecture
•
Eight internal banks
•
Fixed Burst length (BL) of 8 and Burst Chop (BC) of 4
•
Selectable BC4 or BL8 on-the-fly (OTF)
•
Auto Refresh and Self Refresh Modes
•
Nominal and dynamic On Die Termination (ODT)
• Programmable CAS read latency (CL)
Package
•
21.5mm x 20.5mm - 375 plastic ball grid array (PBGA); 10mm x
14.5mm - 136/204 PBGA; 23mm x 32mm - 543 PBGA; 14mm x
21.5mm - 399 PBGA; 24mm x 32mm - 543 PBGA
•
0.8mm or 1.00mm pitch
•
Solder ball composition: Eutectic, lead free upon request
•
Moisture Sensitivity Level (MSL): 3
* These products are subject to change without notice.
www.mrcy.com
Mercury Systems is a leading commercial provider of secure sensor and
safety-critical processing subsystems. Optimized for customer and mission
success, Mercury’s solutions power a wide variety of critical defense and
intelligence programs.
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110101100
100101010
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110101100
100101010
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110101100
100101010
001101011
110101100
ACQUIRE
ACQUIRE
DIGITIZE
ACQUIRE
PROCESS
DIGITIZE
ACQUIRE
PROCESS
DIGITIZE
STORAGE
ACQUIRE
PROCESS
DIGITIZE
STORAGE
EXPLOIT
ACQUIRE
PROCESS
DIGITIZE
STORAGE
DISSEMINATE
EXPLOIT
Figure 1
- Part Numbers
DDR3 SDRAM MCPs
Size
1GB
1GB
1GB
1GB
2GB
2GB
4GB
4GB
4GB
4GB
4GB HD
4GB HD
8GB
8GB
Organization
128M x 64
128M x 72
128M x 64
128M x 72
512M x 32
512M x 32
512M x 64
512M x 72
512M x 64
512M x 72
512M x 64
512M x 72
8GB x 64
8GB x 72
Part Number
W3J128M64X-XPBX
W3J128M72X-XPBX
W3J128M64X-XLBX
W3J128M72X-XLBX
W3J512M32XT-XB3X
W3J512M32X-XB3X
W3J512M64X-XPB2X
W3J512M72X-XPB2X
W3J512M64X-XLB2X
W3J512M72X-XLB2X
W3J512M64X(T)-XHDX
W3J512M72X(T)-XHDX
W3J1G64X-XPBX
W3J1G72X-XPBX
Data Rate (Mb/s)
800-1600
800-1600
800-1600
800-1600
800-1600
800-1600
800-1600
800-1600
800-1600
800-1600
800-1600
800-1600
800-1600
800-1600
Voltage (V)
K=1.35, G=1.5
K=1.35, G=1.5
K=1.35, G=1.5
K=1.35, G=1.5
K=1.35, G=1.5
K=1.35, G=1.5
K=1.35, G=1.5
K=1.35, G=1.5
K=1.35, G=1.5
K=1.35, G=1.5
K=1.35, G=1.5
K=1.35, G=1.5
K=1.35, G=1.5
K=1.35, G=1.5
Package
375 PBGA
375 PBGA
375 PBGA
375 PBGA
204 PBGA,
0.8mm Pitch
136 PBGA
0.8mm Pitch
543 PBGA
543 PBGA
543 PBGA
543 PBGA
399 PBGA
399 PBGA
543 PBGA
543 PBGA
Dimensions
21.5mm x 20.5mm
21.5mm x 20.5mm
21.5mm x 20.5mm
21.5mm x 20.5mm
10mm x 14.5mm
10mm x 14.5mm
23mm x 32mm
23mm x 32mm
23mm x 32mm
23mm x 32mm
14mm x 21.5mm
14mm x 21.5mm
24mm x 32mm
24mm x 32mm
Temperature
C, I, M
C, I, M
C, I, M
C, I, M
C, I, M
C, I, M
C, I, M
C, I, M
C, I, M
C, I, M
C, I, M
C, I, M
C, I, M
C, I, M
Figure 2
- Part Numbering Matrix
W 3J XXMXX X T - X XX X X
MERCURY SYSTEMS
DDR3 SDRAM:
CONFIGURATION:
1GB
2GB
4GB
8GB
G
K
=
=
=
=
128M x 64, 128M x 72
512M x 32
512M x 64, 512M x 72
1G x 64, 1G x 72
POWER SUPPLY:
= 1.5V
= 1.35V
OPTIONAL
(2GB (512M x 32) and 4GB HD only)
:
Blank
T
800
1066
1333
1600
HD
LB
PB
B3
M
I
C
= Not terminated
= Address/Control/Clock Termination resistors included
=
=
=
=
800Mb/s
1,066Mb/s
1,333Mb/s
1,600Mb/s
4 GB High Density
Low profile PBGA
Standard PBGA package
Standard PBGA package
DATA RATE (Mbs):
PACKAGE:
=
=
=
=
LB2 = Low profile PBGA
PB2 = PBGA
DEVICE GRADE:
= Military
= Industrial
= Commercial
-55°C to +125°C
-40°C to +85°C
0°C to +70°C
www.mrcy.com
SOLDER BALL COMPOSITION:
Blank
F
= Leaded Sn63Pb37
= Lead Free SAC305 (contact factory for availability)
Example Part Number: W3J1G72K-1600PBM
Need More Help?
Contact Mercury’s Secure Memory application engineering team at
secure.memory@mrcy.com
Innovation That Matters and Mercury Systems are trademarks of Mercury Systems, Inc. Other product and company names mentioned may be trademarks and/or registered trademarks of their respective holders. Mercury
Systems, Inc. believes this information is accurate as of its publication date and is not responsible for any inadvertent errors. The information contained herein is subject to change without notice.
Copyright © 2019 Mercury Systems, Inc.
www.mrcy.com/ddr3
5027.01E_0119_DDR3-Product-Family-Flyer
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orporate
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eadquarterS
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icroelectronic
S
ecure
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olutionS
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