AM27S31 datasheet, PDF - EEWORLD Datasheet

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AM27S31: Description(512X8) Bipolar PROM; File Size257KB，7 Pages; ManufacturerAMD; Websitehttp://www.amd.com

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AM27S31 Overview

(512X8) Bipolar PROM

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AM27S31 Related Products

	AM27S31	AM27S31/BJA	AM27S31/BKA	AM27S31/BUA	AM27S31A/BJA	AM27S31A/BKA	AM27S31A/BUA	AM27S31A
Description	(512X8) Bipolar PROM	(512X8) Bipolar PROM	(512X8) Bipolar PROM	(512X8) Bipolar PROM	(512X8) Bipolar PROM	(512X8) Bipolar PROM	(512X8) Bipolar PROM	(512X8) Bipolar PROM
Is it Rohs certified?	-	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	-
Parts packaging code	-	DIP	DFP	QFJ	DIP	DFP	QFJ	-
package instruction	-	DIP, DIP24,.6	DFP, FL24,.4	QCCN, LCC32,.45X.55	DIP, DIP24,.6	DFP, FL24,.4	QCCN, LCC32,.45X.55	-
Contacts	-	24	24	32	24	24	32	-
Reach Compliance Code	-	unknown	unknown	unknown	unknown	unknown	unknow	-
ECCN code	-	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	-
Maximum access time	-	70 ns	70 ns	70 ns	45 ns	45 ns	45 ns	-
JESD-30 code	-	R-GDIP-T24	R-GDFP-F24	R-CQCC-N32	R-GDIP-T24	R-GDFP-F24	R-CQCC-N32	-
JESD-609 code	-	e0	e0	e0	e0	e0	e0	-
length	-	32.0675 mm	15.367 mm	13.97 mm	32.0675 mm	15.367 mm	13.97 mm	-
memory density	-	4096 bit	4096 bit	4096 bit	4096 bit	4096 bit	4096 bi	-
Memory IC Type	-	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	-
memory width	-	8	8	8	8	8	8	-
Number of functions	-	1	1	1	1	1	1	-
Number of terminals	-	24	24	32	24	24	32	-
word count	-	512 words	512 words	512 words	512 words	512 words	512 words	-
character code	-	512	512	512	512	512	512	-
Operating mode	-	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	-
Maximum operating temperature	-	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	-
Minimum operating temperature	-	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-
organize	-	512X8	512X8	512X8	512X8	512X8	512X8	-
Output characteristics	-	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	-
Package body material	-	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	-
encapsulated code	-	DIP	DFP	QCCN	DIP	DFP	QCCN	-
Encapsulate equivalent code	-	DIP24,.6	FL24,.4	LCC32,.45X.55	DIP24,.6	FL24,.4	LCC32,.45X.55	-
Package shape	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	-
Package form	-	IN-LINE	FLATPACK	CHIP CARRIER	IN-LINE	FLATPACK	CHIP CARRIER	-
Parallel/Serial	-	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	-
power supply	-	5 V	5 V	5 V	5 V	5 V	5 V	-
Certification status	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-
Filter level	-	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B	-
Maximum seat height	-	5.588 mm	2.286 mm	2.54 mm	5.588 mm	2.286 mm	2.54 mm	-
Maximum slew rate	-	0.175 mA	0.175 mA	0.175 mA	0.175 mA	0.175 mA	0.175 mA	-
Maximum supply voltage (Vsup)	-	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	-
Minimum supply voltage (Vsup)	-	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	-
Nominal supply voltage (Vsup)	-	5 V	5 V	5 V	5 V	5 V	5 V	-
surface mount	-	NO	YES	YES	NO	YES	YES	-
technology	-	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	-
Temperature level	-	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	-
Terminal surface	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-
Terminal form	-	THROUGH-HOLE	FLAT	NO LEAD	THROUGH-HOLE	FLAT	NO LEAD	-
Terminal pitch	-	2.54 mm	1.27 mm	1.27 mm	2.54 mm	1.27 mm	1.27 mm	-
Terminal location	-	DUAL	DUAL	QUAD	DUAL	DUAL	QUAD	-
width	-	15.24 mm	9.525 mm	11.43 mm	15.24 mm	9.525 mm	11.43 mm	-
Base Number Matches	-	1	1	1	1	1	-	-

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