AM27S31/BKA datasheet, PDF - EEWORLD Datasheet

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AM27S31/BKA: Description(512X8) Bipolar PROM; Categorystorage storage; File Size257KB，7 Pages; ManufacturerAMD; Websitehttp://www.amd.com

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AM27S31/BKA Overview

(512X8) Bipolar PROM

AM27S31/BKA Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Parts packaging code	DFP
package instruction	DFP, FL24,.4
Contacts	24
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	70 ns
JESD-30 code	R-GDFP-F24
JESD-609 code	e0
length	15.367 mm
memory density	4096 bit
Memory IC Type	OTP ROM
memory width	8
Number of functions	1
Number of terminals	24
word count	512 words
character code	512
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	512X8
Output characteristics	3-STATE
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DFP
Encapsulate equivalent code	FL24,.4
Package shape	RECTANGULAR
Package form	FLATPACK
Parallel/Serial	PARALLEL
power supply	5 V
Certification status	Not Qualified
Filter level	38535Q/M;38534H;883B
Maximum seat height	2.286 mm
Maximum slew rate	0.175 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	BIPOLAR
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	FLAT
Terminal pitch	1.27 mm
Terminal location	DUAL
width	9.525 mm
Base Number Matches	1

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AM27S31/BKA Related Products

	AM27S31/BKA	AM27S31	AM27S31/BJA	AM27S31/BUA	AM27S31A/BJA	AM27S31A/BKA	AM27S31A/BUA	AM27S31A
Description	(512X8) Bipolar PROM	(512X8) Bipolar PROM	(512X8) Bipolar PROM	(512X8) Bipolar PROM	(512X8) Bipolar PROM	(512X8) Bipolar PROM	(512X8) Bipolar PROM	(512X8) Bipolar PROM
Is it Rohs certified?	incompatible	-	incompatible	incompatible	incompatible	incompatible	incompatible	-
Parts packaging code	DFP	-	DIP	QFJ	DIP	DFP	QFJ	-
package instruction	DFP, FL24,.4	-	DIP, DIP24,.6	QCCN, LCC32,.45X.55	DIP, DIP24,.6	DFP, FL24,.4	QCCN, LCC32,.45X.55	-
Contacts	24	-	24	32	24	24	32	-
Reach Compliance Code	unknown	-	unknown	unknown	unknown	unknown	unknow	-
ECCN code	EAR99	-	EAR99	EAR99	EAR99	EAR99	EAR99	-
Maximum access time	70 ns	-	70 ns	70 ns	45 ns	45 ns	45 ns	-
JESD-30 code	R-GDFP-F24	-	R-GDIP-T24	R-CQCC-N32	R-GDIP-T24	R-GDFP-F24	R-CQCC-N32	-
JESD-609 code	e0	-	e0	e0	e0	e0	e0	-
length	15.367 mm	-	32.0675 mm	13.97 mm	32.0675 mm	15.367 mm	13.97 mm	-
memory density	4096 bit	-	4096 bit	4096 bit	4096 bit	4096 bit	4096 bi	-
Memory IC Type	OTP ROM	-	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	-
memory width	8	-	8	8	8	8	8	-
Number of functions	1	-	1	1	1	1	1	-
Number of terminals	24	-	24	32	24	24	32	-
word count	512 words	-	512 words	512 words	512 words	512 words	512 words	-
character code	512	-	512	512	512	512	512	-
Operating mode	ASYNCHRONOUS	-	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	-
Maximum operating temperature	125 °C	-	125 °C	125 °C	125 °C	125 °C	125 °C	-
Minimum operating temperature	-55 °C	-	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-
organize	512X8	-	512X8	512X8	512X8	512X8	512X8	-
Output characteristics	3-STATE	-	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	-
Package body material	CERAMIC, GLASS-SEALED	-	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	-
encapsulated code	DFP	-	DIP	QCCN	DIP	DFP	QCCN	-
Encapsulate equivalent code	FL24,.4	-	DIP24,.6	LCC32,.45X.55	DIP24,.6	FL24,.4	LCC32,.45X.55	-
Package shape	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	-
Package form	FLATPACK	-	IN-LINE	CHIP CARRIER	IN-LINE	FLATPACK	CHIP CARRIER	-
Parallel/Serial	PARALLEL	-	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	-
power supply	5 V	-	5 V	5 V	5 V	5 V	5 V	-
Certification status	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-
Filter level	38535Q/M;38534H;883B	-	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B	-
Maximum seat height	2.286 mm	-	5.588 mm	2.54 mm	5.588 mm	2.286 mm	2.54 mm	-
Maximum slew rate	0.175 mA	-	0.175 mA	0.175 mA	0.175 mA	0.175 mA	0.175 mA	-
Maximum supply voltage (Vsup)	5.5 V	-	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	-
Minimum supply voltage (Vsup)	4.5 V	-	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	-
Nominal supply voltage (Vsup)	5 V	-	5 V	5 V	5 V	5 V	5 V	-
surface mount	YES	-	NO	YES	NO	YES	YES	-
technology	BIPOLAR	-	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	-
Temperature level	MILITARY	-	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	-
Terminal surface	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-
Terminal form	FLAT	-	THROUGH-HOLE	NO LEAD	THROUGH-HOLE	FLAT	NO LEAD	-
Terminal pitch	1.27 mm	-	2.54 mm	1.27 mm	2.54 mm	1.27 mm	1.27 mm	-
Terminal location	DUAL	-	DUAL	QUAD	DUAL	DUAL	QUAD	-
width	9.525 mm	-	15.24 mm	11.43 mm	15.24 mm	9.525 mm	11.43 mm	-
Base Number Matches	1	-	1	1	1	1	-	-

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