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AM27S31/BJA

Description
(512X8) Bipolar PROM
Categorystorage    storage   
File Size257KB,7 Pages
ManufacturerAMD
Websitehttp://www.amd.com
Download Datasheet Parametric Compare View All

AM27S31/BJA Overview

(512X8) Bipolar PROM

AM27S31/BJA Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
Parts packaging codeDIP
package instructionDIP, DIP24,.6
Contacts24
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time70 ns
JESD-30 codeR-GDIP-T24
JESD-609 codee0
length32.0675 mm
memory density4096 bit
Memory IC TypeOTP ROM
memory width8
Number of functions1
Number of terminals24
word count512 words
character code512
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize512X8
Output characteristics3-STATE
Package body materialCERAMIC, GLASS-SEALED
encapsulated codeDIP
Encapsulate equivalent codeDIP24,.6
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
Filter level38535Q/M;38534H;883B
Maximum seat height5.588 mm
Maximum slew rate0.175 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyBIPOLAR
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width15.24 mm
Base Number Matches1

AM27S31/BJA Related Products

AM27S31/BJA AM27S31 AM27S31/BKA AM27S31/BUA AM27S31A/BJA AM27S31A/BKA AM27S31A/BUA AM27S31A
Description (512X8) Bipolar PROM (512X8) Bipolar PROM (512X8) Bipolar PROM (512X8) Bipolar PROM (512X8) Bipolar PROM (512X8) Bipolar PROM (512X8) Bipolar PROM (512X8) Bipolar PROM
Is it Rohs certified? incompatible - incompatible incompatible incompatible incompatible incompatible -
Parts packaging code DIP - DFP QFJ DIP DFP QFJ -
package instruction DIP, DIP24,.6 - DFP, FL24,.4 QCCN, LCC32,.45X.55 DIP, DIP24,.6 DFP, FL24,.4 QCCN, LCC32,.45X.55 -
Contacts 24 - 24 32 24 24 32 -
Reach Compliance Code unknown - unknown unknown unknown unknown unknow -
ECCN code EAR99 - EAR99 EAR99 EAR99 EAR99 EAR99 -
Maximum access time 70 ns - 70 ns 70 ns 45 ns 45 ns 45 ns -
JESD-30 code R-GDIP-T24 - R-GDFP-F24 R-CQCC-N32 R-GDIP-T24 R-GDFP-F24 R-CQCC-N32 -
JESD-609 code e0 - e0 e0 e0 e0 e0 -
length 32.0675 mm - 15.367 mm 13.97 mm 32.0675 mm 15.367 mm 13.97 mm -
memory density 4096 bit - 4096 bit 4096 bit 4096 bit 4096 bit 4096 bi -
Memory IC Type OTP ROM - OTP ROM OTP ROM OTP ROM OTP ROM OTP ROM -
memory width 8 - 8 8 8 8 8 -
Number of functions 1 - 1 1 1 1 1 -
Number of terminals 24 - 24 32 24 24 32 -
word count 512 words - 512 words 512 words 512 words 512 words 512 words -
character code 512 - 512 512 512 512 512 -
Operating mode ASYNCHRONOUS - ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS -
Maximum operating temperature 125 °C - 125 °C 125 °C 125 °C 125 °C 125 °C -
Minimum operating temperature -55 °C - -55 °C -55 °C -55 °C -55 °C -55 °C -
organize 512X8 - 512X8 512X8 512X8 512X8 512X8 -
Output characteristics 3-STATE - 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE -
Package body material CERAMIC, GLASS-SEALED - CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED -
encapsulated code DIP - DFP QCCN DIP DFP QCCN -
Encapsulate equivalent code DIP24,.6 - FL24,.4 LCC32,.45X.55 DIP24,.6 FL24,.4 LCC32,.45X.55 -
Package shape RECTANGULAR - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR -
Package form IN-LINE - FLATPACK CHIP CARRIER IN-LINE FLATPACK CHIP CARRIER -
Parallel/Serial PARALLEL - PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL -
power supply 5 V - 5 V 5 V 5 V 5 V 5 V -
Certification status Not Qualified - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified -
Filter level 38535Q/M;38534H;883B - 38535Q/M;38534H;883B 38535Q/M;38534H;883B 38535Q/M;38534H;883B 38535Q/M;38534H;883B 38535Q/M;38534H;883B -
Maximum seat height 5.588 mm - 2.286 mm 2.54 mm 5.588 mm 2.286 mm 2.54 mm -
Maximum slew rate 0.175 mA - 0.175 mA 0.175 mA 0.175 mA 0.175 mA 0.175 mA -
Maximum supply voltage (Vsup) 5.5 V - 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V -
Minimum supply voltage (Vsup) 4.5 V - 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V -
Nominal supply voltage (Vsup) 5 V - 5 V 5 V 5 V 5 V 5 V -
surface mount NO - YES YES NO YES YES -
technology BIPOLAR - BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR -
Temperature level MILITARY - MILITARY MILITARY MILITARY MILITARY MILITARY -
Terminal surface Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) -
Terminal form THROUGH-HOLE - FLAT NO LEAD THROUGH-HOLE FLAT NO LEAD -
Terminal pitch 2.54 mm - 1.27 mm 1.27 mm 2.54 mm 1.27 mm 1.27 mm -
Terminal location DUAL - DUAL QUAD DUAL DUAL QUAD -
width 15.24 mm - 9.525 mm 11.43 mm 15.24 mm 9.525 mm 11.43 mm -
Base Number Matches 1 - 1 1 1 1 - -
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