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Datasheet> All Categories > storage> storage> CY7C1314BV18-167BZC
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CY7C1314BV18-167BZC

Description
512KX36 QDR SRAM, 0.5ns, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165
Categorystorage    storage   
File Size2MB，30 Pages
ManufacturerRochester Electronics
Websitehttps://www.rocelec.com/
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CY7C1314BV18-167BZC Overview

512KX36 QDR SRAM, 0.5ns, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165

CY7C1314BV18-167BZC Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerRochester Electronics
Parts packaging codeBGA
package instruction13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165
Contacts165
Reach Compliance Codeunknown
Maximum access time0.5 ns
Other featuresPIPELINED ARCHITECTURE
JESD-30 codeR-PBGA-B165
JESD-609 codee0
length15 mm
memory density18874368 bit
Memory IC TypeQDR SRAM
memory width36
Humidity sensitivity level3
Number of functions1
Number of terminals165
word count524288 words
character code512000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize512KX36
Package body materialPLASTIC/EPOXY
encapsulated codeLBGA
Package shapeRECTANGULAR
Package formGRID ARRAY, LOW PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)220
Certification statusCOMMERCIAL
Maximum seat height1.4 mm
Maximum supply voltage (Vsup)1.9 V
Minimum supply voltage (Vsup)1.7 V
Nominal supply voltage (Vsup)1.8 V
surface mountYES
Temperature levelCOMMERCIAL
Terminal surfaceTIN LEAD
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width13 mm
Base Number Matches1

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CY7C1314BV18-167BZC Related Products

CY7C1314BV18-167BZC CY7C1314BV18-250BZC CY7C1314BV18-200BZC CY7C1314BV18-250BZXC CY7C1312BV18-167BZC CY7C1312BV18-200BZC CY7C1312BV18-250BZC CY7C1312BV18-200BZXC CY7C1312BV18-200BZI CY7C1312BV18-167BZI
Description 512KX36 QDR SRAM, 0.5ns, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 512KX36 QDR SRAM, 0.45ns, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 512KX36 QDR SRAM, 0.45ns, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 512KX36 QDR SRAM, 0.45ns, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 1MX18 QDR SRAM, 0.5ns, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 1MX18 QDR SRAM, 0.45ns, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 1MX18 QDR SRAM, 0.45ns, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 1MX18 QDR SRAM, 0.45ns, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 1MX18 QDR SRAM, 0.45ns, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 1MX18 QDR SRAM, 0.5ns, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165
Is it lead-free? Contains lead Contains lead Contains lead Lead free Contains lead Contains lead Contains lead Lead free Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible conform to incompatible incompatible incompatible conform to incompatible incompatible
Maker Rochester Electronics Rochester Electronics Rochester Electronics Rochester Electronics Rochester Electronics Rochester Electronics Rochester Electronics Rochester Electronics Rochester Electronics Rochester Electronics
Parts packaging code BGA BGA BGA BGA BGA BGA BGA BGA BGA BGA
package instruction 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165
Contacts 165 165 165 165 165 165 165 165 165 165
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknown unknown
Maximum access time 0.5 ns 0.45 ns 0.45 ns 0.45 ns 0.5 ns 0.45 ns 0.45 ns 0.45 ns 0.45 ns 0.5 ns
Other features PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE
JESD-30 code R-PBGA-B165 R-PBGA-B165 R-PBGA-B165 R-PBGA-B165 R-PBGA-B165 R-PBGA-B165 R-PBGA-B165 R-PBGA-B165 R-PBGA-B165 R-PBGA-B165
JESD-609 code e0 e0 e0 e1 e0 e0 e0 e1 e0 e0
length 15 mm 15 mm 15 mm 15 mm 15 mm 15 mm 15 mm 15 mm 15 mm 15 mm
memory density 18874368 bit 18874368 bit 18874368 bit 18874368 bit 18874368 bit 18874368 bit 18874368 bit 18874368 bit 18874368 bit 18874368 bit
Memory IC Type QDR SRAM QDR SRAM QDR SRAM QDR SRAM QDR SRAM QDR SRAM QDR SRAM QDR SRAM QDR SRAM QDR SRAM
memory width 36 36 36 36 18 18 18 18 18 18
Humidity sensitivity level 3 3 3 3 3 3 3 3 3 3
Number of functions 1 1 1 1 1 1 1 1 1 1
Number of terminals 165 165 165 165 165 165 165 165 165 165
word count 524288 words 524288 words 524288 words 524288 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words
character code 512000 512000 512000 512000 1000000 1000000 1000000 1000000 1000000 1000000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 85 °C 85 °C
organize 512KX36 512KX36 512KX36 512KX36 1MX18 1MX18 1MX18 1MX18 1MX18 1MX18
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LBGA LBGA LBGA LBGA LBGA LBGA LBGA LBGA LBGA LBGA
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 220 220 220 260 220 220 220 260 220 220
Certification status COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Maximum seat height 1.4 mm 1.4 mm 1.4 mm 1.4 mm 1.4 mm 1.4 mm 1.4 mm 1.4 mm 1.4 mm 1.4 mm
Maximum supply voltage (Vsup) 1.9 V 1.9 V 1.9 V 1.9 V 1.9 V 1.9 V 1.9 V 1.9 V 1.9 V 1.9 V
Minimum supply voltage (Vsup) 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V
Nominal supply voltage (Vsup) 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V
surface mount YES YES YES YES YES YES YES YES YES YES
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL INDUSTRIAL INDUSTRIAL
Terminal surface TIN LEAD TIN LEAD TIN LEAD TIN SILVER COPPER TIN LEAD TIN LEAD TIN LEAD TIN SILVER COPPER TIN LEAD TIN LEAD
Terminal form BALL BALL BALL BALL BALL BALL BALL BALL BALL BALL
Terminal pitch 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED 20 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED 20 NOT SPECIFIED NOT SPECIFIED
width 13 mm 13 mm 13 mm 13 mm 13 mm 13 mm 13 mm 13 mm 13 mm 13 mm

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