CY7C1312BV18-200BZI datasheet, PDF

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CY7C1312BV18-200BZI: Description1MX18 QDR SRAM, 0.45ns, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165; Categorystorage storage; File Size2MB，30 Pages; ManufacturerRochester Electronics; Websitehttps://www.rocelec.com/

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CY7C1312BV18-200BZI Overview

1MX18 QDR SRAM, 0.45ns, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165

CY7C1312BV18-200BZI Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Rochester Electronics
Parts packaging code	BGA
package instruction	13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165
Contacts	165
Reach Compliance Code	unknown
Maximum access time	0.45 ns
Other features	PIPELINED ARCHITECTURE
JESD-30 code	R-PBGA-B165
JESD-609 code	e0
length	15 mm
memory density	18874368 bit
Memory IC Type	QDR SRAM
memory width	18
Humidity sensitivity level	3
Number of functions	1
Number of terminals	165
word count	1048576 words
character code	1000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	1MX18
Package body material	PLASTIC/EPOXY
encapsulated code	LBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, LOW PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	220
Certification status	COMMERCIAL
Maximum seat height	1.4 mm
Maximum supply voltage (Vsup)	1.9 V
Minimum supply voltage (Vsup)	1.7 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
Temperature level	INDUSTRIAL
Terminal surface	TIN LEAD
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	13 mm

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CY7C1312BV18-200BZI Related Products

	CY7C1312BV18-200BZI	CY7C1314BV18-250BZC	CY7C1314BV18-200BZC	CY7C1314BV18-250BZXC	CY7C1314BV18-167BZC	CY7C1312BV18-167BZC	CY7C1312BV18-200BZC	CY7C1312BV18-250BZC	CY7C1312BV18-200BZXC	CY7C1312BV18-167BZI
Description	1MX18 QDR SRAM, 0.45ns, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165	512KX36 QDR SRAM, 0.45ns, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165	512KX36 QDR SRAM, 0.45ns, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165	512KX36 QDR SRAM, 0.45ns, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165	512KX36 QDR SRAM, 0.5ns, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165	1MX18 QDR SRAM, 0.5ns, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165	1MX18 QDR SRAM, 0.45ns, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165	1MX18 QDR SRAM, 0.45ns, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165	1MX18 QDR SRAM, 0.45ns, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165	1MX18 QDR SRAM, 0.5ns, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165
Is it lead-free?	Contains lead	Contains lead	Contains lead	Lead free	Contains lead	Contains lead	Contains lead	Contains lead	Lead free	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	conform to	incompatible	incompatible	incompatible	incompatible	conform to	incompatible
Maker	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics
Parts packaging code	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA
package instruction	13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165	13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165	13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165	13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165	13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165	13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165	13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165	13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165	13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165	13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165
Contacts	165	165	165	165	165	165	165	165	165	165
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
Maximum access time	0.45 ns	0.45 ns	0.45 ns	0.45 ns	0.5 ns	0.5 ns	0.45 ns	0.45 ns	0.45 ns	0.5 ns
Other features	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE
JESD-30 code	R-PBGA-B165	R-PBGA-B165	R-PBGA-B165	R-PBGA-B165	R-PBGA-B165	R-PBGA-B165	R-PBGA-B165	R-PBGA-B165	R-PBGA-B165	R-PBGA-B165
JESD-609 code	e0	e0	e0	e1	e0	e0	e0	e0	e1	e0
length	15 mm	15 mm	15 mm	15 mm	15 mm	15 mm	15 mm	15 mm	15 mm	15 mm
memory density	18874368 bit	18874368 bit	18874368 bit	18874368 bit	18874368 bit	18874368 bit	18874368 bit	18874368 bit	18874368 bit	18874368 bit
Memory IC Type	QDR SRAM	QDR SRAM	QDR SRAM	QDR SRAM	QDR SRAM	QDR SRAM	QDR SRAM	QDR SRAM	QDR SRAM	QDR SRAM
memory width	18	36	36	36	36	18	18	18	18	18
Humidity sensitivity level	3	3	3	3	3	3	3	3	3	3
Number of functions	1	1	1	1	1	1	1	1	1	1
Number of terminals	165	165	165	165	165	165	165	165	165	165
word count	1048576 words	524288 words	524288 words	524288 words	524288 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words
character code	1000000	512000	512000	512000	512000	1000000	1000000	1000000	1000000	1000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	85 °C
organize	1MX18	512KX36	512KX36	512KX36	512KX36	1MX18	1MX18	1MX18	1MX18	1MX18
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LBGA	LBGA	LBGA	LBGA	LBGA	LBGA	LBGA	LBGA	LBGA	LBGA
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	220	220	220	260	220	220	220	220	260	220
Certification status	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Maximum seat height	1.4 mm	1.4 mm	1.4 mm	1.4 mm	1.4 mm	1.4 mm	1.4 mm	1.4 mm	1.4 mm	1.4 mm
Maximum supply voltage (Vsup)	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V
Minimum supply voltage (Vsup)	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V
Nominal supply voltage (Vsup)	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
Temperature level	INDUSTRIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL
Terminal surface	TIN LEAD	TIN LEAD	TIN LEAD	TIN SILVER COPPER	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN SILVER COPPER	TIN LEAD
Terminal form	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL
Terminal pitch	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	20	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	20	NOT SPECIFIED
width	13 mm	13 mm	13 mm	13 mm	13 mm	13 mm	13 mm	13 mm	13 mm	13 mm

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