S25FL004D0LMAI011 datasheet, PDF

Datasheet> All Categories > storage> storage> S25FL004D0LMAI011

S25FL004D0LMAI011: Description4 Megabit CMOS 3.0 Volt Flash Memory with 50 Mhz SPI Bus Interface; Categorystorage storage; File Size480KB，36 Pages; ManufacturerSPANSION; Websitehttp://www.spansion.com/

Download Datasheet Parametric Compare View All

S25FL004D0LMAI011 Overview

4 Megabit CMOS 3.0 Volt Flash Memory with 50 Mhz SPI Bus Interface

S25FL004D0LMAI011 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	SPANSION
Parts packaging code	SOIC
package instruction	SOP, SOP8,.3
Contacts	8
Reach Compliance Code	compli
ECCN code	EAR99
Maximum clock frequency (fCLK)	50 MHz
Data retention time - minimum	20
Durability	100000 Write/Erase Cycles
JESD-30 code	S-PDSO-G8
JESD-609 code	e0
length	5.23 mm
memory density	4194304 bi
Memory IC Type	FLASH
memory width	1
Number of functions	1
Number of terminals	8
word count	4194304 words
character code	4000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	4MX1
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Encapsulate equivalent code	SOP8,.3
Package shape	SQUARE
Package form	SMALL OUTLINE
Parallel/Serial	SERIAL
Peak Reflow Temperature (Celsius)	240
power supply	3/3.3 V
Programming voltage	3 V
Certification status	Not Qualified
Maximum seat height	2.03 mm
Serial bus type	SPI
Maximum standby current	0.000005 A
Maximum slew rate	0.023 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	TIN LEAD
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	30
type	NOR TYPE
width	5.23 mm
write protect	HARDWARE/SOFTWARE

Preview

Download Datasheet

View All

S25FL Family (Serial Peripheral Interface)

S25FL004D

4 Megabit CMOS 3.0 Volt Flash Memory

with 50 Mhz SPI Bus Interface

ADVANCE

INFORMATION

Distinctive Characteristics

ARCHITECTURAL ADVANTAGES

Single power supply operation

— Full voltage range: 2.7 to 3.6 V read and program

operations

Memory Architecture

— Eight sectors with 512 Kb each

Program

— Page Program (up to 256 bytes) in 1.5 ms (typical)

— Program cycles are on a page by page basis

Erase

— 0.5 s typical sector erase time

— 4 s typical bulk erase time

Endurance

— 100,000 cycles per sector typical

Data Retention

— 20 years typical

Device ID

— Electronic signature

Process Technology

— Manufactured on 0.25 µm process technology

Package Option

— Industry Standard Pinouts

— 8-pin SO (208mil) package

— 8-contact WSON leadless package (6x5mm)

PERFORMANCE CHARACTERISTICS

Speed

— 50 MHz clock rate (maximum)

Power Saving Standby Mode

— Standby Mode 1 µA (typical)

Memory Protection Features

Memory Protection

— W# pin works in conjunction with Status Register Bits

to protect specified memory areas

— Status Register Block Protection bits (BP1, BP0) in

status register configure parts of memory as read-

only

SOFTWARE FEATURES

SPI Bus Compatible Serial Interface

Publication Number

S25FL004D_00

Revision

Amendment

Issue Date

June 28, 2004

A d v a n c e

I n f o r m a t i o n

Table of Contents

Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4

Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . .5

Input/Output Descriptions . . . . . . . . . . . . . . . . . . . 5

Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Ordering Information . . . . . . . . . . . . . . . . . . . . . . . .6

Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . .7

SPI Modes ...................................................................................................7

Figure 1. Bus Master and Memory Devices on the SPI Bus ....... 8

Figure 2. SPI Modes Supported............................................ 8

Page Program (PP) ................................................................................. 19

Figure 11. Page Program (PP) Instruction Sequence .............. 20

Sector Erase (SE) ..................................................................................20

Figure 12. Sector Erase (SE) Instruction Sequence ................ 21

Bulk Erase (BE) ....................................................................................... 21

Figure 13. Bulk Erase (BE) Instruction Sequence................... 22

Deep Power Down (DP) .................................................................... 22

Figure 14. Deep Power Down (DP) Instruction Sequence ........ 23

Release from Deep Power Down (RES) ....................................... 23

Figure 15. Release from Deep Power Down I

nstruction Sequence.......................................................... 24

Operating Features . . . . . . . . . . . . . . . . . . . . . . . . .9

Page Programming .................................................................................. 9

Sector Erase, or Bulk Erase ................................................................. 9

Polling During a Write, Program, or Erase Cycle ........................ 9

Status Register ......................................................................................... 9

Protection Modes ..................................................................................10

Table 1. Protected Area Sizes (S25FL004D). .........................10

Release from Deep Power Down and Read Electronic

Signature (RES) ...................................................................................... 24

Figure 16. Release from Deep Power Down and Read Electronic

Signature (RES) Instruction Sequence ................................. 25

Power-up and Power-down . . . . . . . . . . . . . . . . . . 26

Figure 17. Power-Up Timing ............................................... 27

Figure 18. Power-Down and Voltage Drop ............................ 27

Table 5. Power-Up Timing ................................................. 28

Hold Condition Modes ........................................................................10

Figure 3. Hold Condition Activation...................................... 11

Memory Organization . . . . . . . . . . . . . . . . . . . . . . 12

Table 2. Sector Address Table – S25FL004D .........................12

Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Table 3. Instruction Set. ....................................................13

Write Enable (WREN) ......................................................................... 14

Figure 4. Write Enable (WREN) Instruction Sequence............. 14

Initial Delivery State . . . . . . . . . . . . . . . . . . . . . . . 28

Maximum Rating . . . . . . . . . . . . . . . . . . . . . . . . . . 28

Absolute Maximum Ratings . . . . . . . . . . . . . . . . . 28

Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . . 28

DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 29

Table 6. DC Characteristics ............................................... 29

Write Disable (WRDI) ........................................................................ 14

Figure 5. Write Disable (WRDI) Instruction Sequence ............ 14

Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

Figure 19. AC Measurements I/O Waveform ......................... 30

Table 7. Test Specifications ............................................... 30

Table 8. AC Characteristics ................................................ 31

Figure 20. SPI Mode 0 (0,0) Input Timing............................. 32

Figure 21. SPI Mode 0 (0,0) Output Timing .......................... 32

Figure 22. HOLD# Timing .................................................. 33

Figure 23. Write Protect Setup and Hold Timing during WRSR when

SRWD=1 ......................................................................... 33

Read Status Register (RDSR) ............................................................. 15

Figure 6. Read Status Register (RDSR)

Instruction Sequence ........................................................ 15

Figure 7. Status Register Format......................................... 15

Write Status Register (WRSR) .......................................................... 16

Figure 8. Write Status Register (WRSR)

Instruction Sequence ........................................................ 17

Table 4. Protection Modes ..................................................17

Read Data Bytes (READ) ....................................................................18

Figure 9. Read Data Bytes (READ) Instruction Sequence ........ 18

Read Data Bytes at Higher Speed (FAST_READ) ....................... 18

Figure 10. Read Data Bytes at Higher Speed

(FAST_READ) Instruction Sequence..................................... 19

Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . . . 34

S08 wide—8-pin Plastic Small Outline 208mils Body Width

Package ................................................................................................... 34

8-Contact WSON (6mm x 5mm) Leadless Package .................35

Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . . 36

June 28, 2004 S25FL004D_00A0

S25FL Family (Serial Peripheral Interface) S25FL004D

S25FL004D0LMAI011 Related Products

	S25FL004D0LMAI011	S25FL004D	S25FL004D0LMFI011	S25FL004D0LMAI013	S25FL004D0LNAI011	S25FL004D0LMFI013	S25FL004D0LNAI013	S25FL004D0LNFI011	S25FL004D0LNFI013
Description	4 Megabit CMOS 3.0 Volt Flash Memory with 50 Mhz SPI Bus Interface	4 Megabit CMOS 3.0 Volt Flash Memory with 50 Mhz SPI Bus Interface	4 Megabit CMOS 3.0 Volt Flash Memory with 50 Mhz SPI Bus Interface	4 Megabit CMOS 3.0 Volt Flash Memory with 50 Mhz SPI Bus Interface	4 Megabit CMOS 3.0 Volt Flash Memory with 50 Mhz SPI Bus Interface	4 Megabit CMOS 3.0 Volt Flash Memory with 50 Mhz SPI Bus Interface	4 Megabit CMOS 3.0 Volt Flash Memory with 50 Mhz SPI Bus Interface	4 Megabit CMOS 3.0 Volt Flash Memory with 50 Mhz SPI Bus Interface	4 Megabit CMOS 3.0 Volt Flash Memory with 50 Mhz SPI Bus Interface
Is it Rohs certified?	incompatible	-	conform to	incompatible	-	conform to	-	conform to	conform to
Maker	SPANSION	-	SPANSION	SPANSION	-	SPANSION	-	SPANSION	SPANSION
Parts packaging code	SOIC	-	SOIC	SOIC	-	SOIC	-	SON	SON
package instruction	SOP, SOP8,.3	-	SOP, SOP8,.3	SOP, SOP8,.3	-	SOP, SOP8,.3	-	HVSON,	HVSON,
Contacts	8	-	8	8	-	8	-	8	8
Reach Compliance Code	compli	-	compli	compli	-	compli	-	compli	compli
ECCN code	EAR99	-	EAR99	EAR99	-	EAR99	-	EAR99	EAR99
Maximum clock frequency (fCLK)	50 MHz	-	50 MHz	50 MHz	-	50 MHz	-	50 MHz	50 MHz
JESD-30 code	S-PDSO-G8	-	S-PDSO-G8	S-PDSO-G8	-	S-PDSO-G8	-	R-XDSO-N8	R-XDSO-N8
JESD-609 code	e0	-	e3	e0	-	e3	-	e3	e3
length	5.23 mm	-	5.23 mm	5.23 mm	-	5.23 mm	-	6 mm	6 mm
memory density	4194304 bi	-	4194304 bi	4194304 bi	-	4194304 bi	-	4194304 bi	4194304 bi
Memory IC Type	FLASH	-	FLASH	FLASH	-	FLASH	-	FLASH	FLASH
memory width	1	-	1	1	-	1	-	1	1
Number of functions	1	-	1	1	-	1	-	1	1
Number of terminals	8	-	8	8	-	8	-	8	8
word count	4194304 words	-	4194304 words	4194304 words	-	4194304 words	-	4194304 words	4194304 words
character code	4000000	-	4000000	4000000	-	4000000	-	4000000	4000000
Operating mode	SYNCHRONOUS	-	SYNCHRONOUS	SYNCHRONOUS	-	SYNCHRONOUS	-	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	-	85 °C	85 °C	-	85 °C	-	85 °C	85 °C
Minimum operating temperature	-40 °C	-	-40 °C	-40 °C	-	-40 °C	-	-40 °C	-40 °C
organize	4MX1	-	4MX1	4MX1	-	4MX1	-	4MX1	4MX1
Package body material	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY	-	UNSPECIFIED	UNSPECIFIED
encapsulated code	SOP	-	SOP	SOP	-	SOP	-	HVSON	HVSON
Package shape	SQUARE	-	SQUARE	SQUARE	-	SQUARE	-	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE	-	SMALL OUTLINE	SMALL OUTLINE	-	SMALL OUTLINE	-	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Parallel/Serial	SERIAL	-	SERIAL	SERIAL	-	SERIAL	-	SERIAL	SERIAL
Peak Reflow Temperature (Celsius)	240	-	260	240	-	260	-	260	260
Programming voltage	3 V	-	3 V	3 V	-	3 V	-	3 V	3 V
Certification status	Not Qualified	-	Not Qualified	Not Qualified	-	Not Qualified	-	Not Qualified	Not Qualified
Maximum seat height	2.03 mm	-	2.03 mm	2.03 mm	-	2.03 mm	-	0.8 mm	0.8 mm
Maximum supply voltage (Vsup)	3.6 V	-	3.6 V	3.6 V	-	3.6 V	-	3.6 V	3.6 V
Minimum supply voltage (Vsup)	2.7 V	-	2.7 V	2.7 V	-	2.7 V	-	2.7 V	2.7 V
Nominal supply voltage (Vsup)	3 V	-	3 V	3 V	-	3 V	-	3 V	3 V
surface mount	YES	-	YES	YES	-	YES	-	YES	YES
technology	CMOS	-	CMOS	CMOS	-	CMOS	-	CMOS	CMOS
Temperature level	INDUSTRIAL	-	INDUSTRIAL	INDUSTRIAL	-	INDUSTRIAL	-	INDUSTRIAL	INDUSTRIAL
Terminal surface	TIN LEAD	-	MATTE TIN	TIN LEAD	-	MATTE TIN	-	MATTE TIN	MATTE TIN
Terminal form	GULL WING	-	GULL WING	GULL WING	-	GULL WING	-	NO LEAD	NO LEAD
Terminal pitch	1.27 mm	-	1.27 mm	1.27 mm	-	1.27 mm	-	1.27 mm	1.27 mm
Terminal location	DUAL	-	DUAL	DUAL	-	DUAL	-	DUAL	DUAL
Maximum time at peak reflow temperature	30	-	40	30	-	40	-	40	40
type	NOR TYPE	-	NOR TYPE	NOR TYPE	-	NOR TYPE	-	NOR TYPE	NOR TYPE
width	5.23 mm	-	5.23 mm	5.23 mm	-	5.23 mm	-	4.9 mm	4.9 mm

Recommended Resources

Light emitting diode display circuit one b

Temperature regulator drying room temperature control circuit three

Cephalosporin electrode

Current detection and protection circuit

GM3043 TV and VCR) infrared remote control transmitter circuit

SAA3027 (universal) infrared remote control transmitter circuit

Shortcut: 00 01 02 03 04 05 06 07 08 09 0A 0C 0F 0J 0L 0M 0R 0S 0T 0Z 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 1H 1K 1M 1N 1P 1S 1T 1V 1X 1Z 20 21 22 23 24 25 26 27 28 29 2A 2B 2C 2D 2E 2F 2G 2K 2M 2N 2P 2Q 2R 2S 2T 2W 2Z 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F 3G 3H 3J 3K 3L 3M 3N 3P 3R 3S 3T 3V 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4M 4N 4P 4S 4T 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5E 5G 5H 5K 5M 5N 5P 5S 5T 5V 60 61 62 63 64 65 66 67 68 69 6A 6C 6E 6F 6M 6N 6P 6R 6S 6T 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7M 7N 7P 7Q 7V 7W 7X 80 81 82 83 84 85 86 87 88 89 8A 8D 8E 8L 8N 8P 8S 8T 8W 8Y 8Z 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9F 9G 9H 9L 9S 9T 9W

Popular Components