S25FL004D0LNAI013 datasheet, PDF

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S25FL004D0LNAI013: Description4 Megabit CMOS 3.0 Volt Flash Memory with 50 Mhz SPI Bus Interface; File Size480KB，36 Pages; ManufacturerSPANSION; Websitehttp://www.spansion.com/

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S25FL004D0LNAI013 Overview

4 Megabit CMOS 3.0 Volt Flash Memory with 50 Mhz SPI Bus Interface

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S25FL Family (Serial Peripheral Interface)

S25FL004D

4 Megabit CMOS 3.0 Volt Flash Memory

with 50 Mhz SPI Bus Interface

ADVANCE

INFORMATION

Distinctive Characteristics

ARCHITECTURAL ADVANTAGES

Single power supply operation

— Full voltage range: 2.7 to 3.6 V read and program

operations

Memory Architecture

— Eight sectors with 512 Kb each

Program

— Page Program (up to 256 bytes) in 1.5 ms (typical)

— Program cycles are on a page by page basis

Erase

— 0.5 s typical sector erase time

— 4 s typical bulk erase time

Endurance

— 100,000 cycles per sector typical

Data Retention

— 20 years typical

Device ID

— Electronic signature

Process Technology

— Manufactured on 0.25 µm process technology

Package Option

— Industry Standard Pinouts

— 8-pin SO (208mil) package

— 8-contact WSON leadless package (6x5mm)

PERFORMANCE CHARACTERISTICS

Speed

— 50 MHz clock rate (maximum)

Power Saving Standby Mode

— Standby Mode 1 µA (typical)

Memory Protection Features

Memory Protection

— W# pin works in conjunction with Status Register Bits

to protect specified memory areas

— Status Register Block Protection bits (BP1, BP0) in

status register configure parts of memory as read-

only

SOFTWARE FEATURES

SPI Bus Compatible Serial Interface

Publication Number

S25FL004D_00

Revision

Amendment

Issue Date

June 28, 2004

A d v a n c e

I n f o r m a t i o n

Table of Contents

Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4

Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . .5

Input/Output Descriptions . . . . . . . . . . . . . . . . . . . 5

Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Ordering Information . . . . . . . . . . . . . . . . . . . . . . . .6

Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . .7

SPI Modes ...................................................................................................7

Figure 1. Bus Master and Memory Devices on the SPI Bus ....... 8

Figure 2. SPI Modes Supported............................................ 8

Page Program (PP) ................................................................................. 19

Figure 11. Page Program (PP) Instruction Sequence .............. 20

Sector Erase (SE) ..................................................................................20

Figure 12. Sector Erase (SE) Instruction Sequence ................ 21

Bulk Erase (BE) ....................................................................................... 21

Figure 13. Bulk Erase (BE) Instruction Sequence................... 22

Deep Power Down (DP) .................................................................... 22

Figure 14. Deep Power Down (DP) Instruction Sequence ........ 23

Release from Deep Power Down (RES) ....................................... 23

Figure 15. Release from Deep Power Down I

nstruction Sequence.......................................................... 24

Operating Features . . . . . . . . . . . . . . . . . . . . . . . . .9

Page Programming .................................................................................. 9

Sector Erase, or Bulk Erase ................................................................. 9

Polling During a Write, Program, or Erase Cycle ........................ 9

Status Register ......................................................................................... 9

Protection Modes ..................................................................................10

Table 1. Protected Area Sizes (S25FL004D). .........................10

Release from Deep Power Down and Read Electronic

Signature (RES) ...................................................................................... 24

Figure 16. Release from Deep Power Down and Read Electronic

Signature (RES) Instruction Sequence ................................. 25

Power-up and Power-down . . . . . . . . . . . . . . . . . . 26

Figure 17. Power-Up Timing ............................................... 27

Figure 18. Power-Down and Voltage Drop ............................ 27

Table 5. Power-Up Timing ................................................. 28

Hold Condition Modes ........................................................................10

Figure 3. Hold Condition Activation...................................... 11

Memory Organization . . . . . . . . . . . . . . . . . . . . . . 12

Table 2. Sector Address Table – S25FL004D .........................12

Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Table 3. Instruction Set. ....................................................13

Write Enable (WREN) ......................................................................... 14

Figure 4. Write Enable (WREN) Instruction Sequence............. 14

Initial Delivery State . . . . . . . . . . . . . . . . . . . . . . . 28

Maximum Rating . . . . . . . . . . . . . . . . . . . . . . . . . . 28

Absolute Maximum Ratings . . . . . . . . . . . . . . . . . 28

Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . . 28

DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 29

Table 6. DC Characteristics ............................................... 29

Write Disable (WRDI) ........................................................................ 14

Figure 5. Write Disable (WRDI) Instruction Sequence ............ 14

Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

Figure 19. AC Measurements I/O Waveform ......................... 30

Table 7. Test Specifications ............................................... 30

Table 8. AC Characteristics ................................................ 31

Figure 20. SPI Mode 0 (0,0) Input Timing............................. 32

Figure 21. SPI Mode 0 (0,0) Output Timing .......................... 32

Figure 22. HOLD# Timing .................................................. 33

Figure 23. Write Protect Setup and Hold Timing during WRSR when

SRWD=1 ......................................................................... 33

Read Status Register (RDSR) ............................................................. 15

Figure 6. Read Status Register (RDSR)

Instruction Sequence ........................................................ 15

Figure 7. Status Register Format......................................... 15

Write Status Register (WRSR) .......................................................... 16

Figure 8. Write Status Register (WRSR)

Instruction Sequence ........................................................ 17

Table 4. Protection Modes ..................................................17

Read Data Bytes (READ) ....................................................................18

Figure 9. Read Data Bytes (READ) Instruction Sequence ........ 18

Read Data Bytes at Higher Speed (FAST_READ) ....................... 18

Figure 10. Read Data Bytes at Higher Speed

(FAST_READ) Instruction Sequence..................................... 19

Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . . . 34

S08 wide—8-pin Plastic Small Outline 208mils Body Width

Package ................................................................................................... 34

8-Contact WSON (6mm x 5mm) Leadless Package .................35

Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . . 36

June 28, 2004 S25FL004D_00A0

S25FL Family (Serial Peripheral Interface) S25FL004D

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Is it Rohs certified?	-	incompatible	-	conform to	incompatible	-	conform to	conform to	conform to
Maker	-	SPANSION	-	SPANSION	SPANSION	-	SPANSION	SPANSION	SPANSION
Parts packaging code	-	SOIC	-	SOIC	SOIC	-	SOIC	SON	SON
package instruction	-	SOP, SOP8,.3	-	SOP, SOP8,.3	SOP, SOP8,.3	-	SOP, SOP8,.3	HVSON,	HVSON,
Contacts	-	8	-	8	8	-	8	8	8
Reach Compliance Code	-	compli	-	compli	compli	-	compli	compli	compli
ECCN code	-	EAR99	-	EAR99	EAR99	-	EAR99	EAR99	EAR99
Maximum clock frequency (fCLK)	-	50 MHz	-	50 MHz	50 MHz	-	50 MHz	50 MHz	50 MHz
JESD-30 code	-	S-PDSO-G8	-	S-PDSO-G8	S-PDSO-G8	-	S-PDSO-G8	R-XDSO-N8	R-XDSO-N8
JESD-609 code	-	e0	-	e3	e0	-	e3	e3	e3
length	-	5.23 mm	-	5.23 mm	5.23 mm	-	5.23 mm	6 mm	6 mm
memory density	-	4194304 bi	-	4194304 bi	4194304 bi	-	4194304 bi	4194304 bi	4194304 bi
Memory IC Type	-	FLASH	-	FLASH	FLASH	-	FLASH	FLASH	FLASH
memory width	-	1	-	1	1	-	1	1	1
Number of functions	-	1	-	1	1	-	1	1	1
Number of terminals	-	8	-	8	8	-	8	8	8
word count	-	4194304 words	-	4194304 words	4194304 words	-	4194304 words	4194304 words	4194304 words
character code	-	4000000	-	4000000	4000000	-	4000000	4000000	4000000
Operating mode	-	SYNCHRONOUS	-	SYNCHRONOUS	SYNCHRONOUS	-	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	-	85 °C	-	85 °C	85 °C	-	85 °C	85 °C	85 °C
Minimum operating temperature	-	-40 °C	-	-40 °C	-40 °C	-	-40 °C	-40 °C	-40 °C
organize	-	4MX1	-	4MX1	4MX1	-	4MX1	4MX1	4MX1
Package body material	-	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY	UNSPECIFIED	UNSPECIFIED
encapsulated code	-	SOP	-	SOP	SOP	-	SOP	HVSON	HVSON
Package shape	-	SQUARE	-	SQUARE	SQUARE	-	SQUARE	RECTANGULAR	RECTANGULAR
Package form	-	SMALL OUTLINE	-	SMALL OUTLINE	SMALL OUTLINE	-	SMALL OUTLINE	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Parallel/Serial	-	SERIAL	-	SERIAL	SERIAL	-	SERIAL	SERIAL	SERIAL
Peak Reflow Temperature (Celsius)	-	240	-	260	240	-	260	260	260
Programming voltage	-	3 V	-	3 V	3 V	-	3 V	3 V	3 V
Certification status	-	Not Qualified	-	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	-	2.03 mm	-	2.03 mm	2.03 mm	-	2.03 mm	0.8 mm	0.8 mm
Maximum supply voltage (Vsup)	-	3.6 V	-	3.6 V	3.6 V	-	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	-	2.7 V	-	2.7 V	2.7 V	-	2.7 V	2.7 V	2.7 V
Nominal supply voltage (Vsup)	-	3 V	-	3 V	3 V	-	3 V	3 V	3 V
surface mount	-	YES	-	YES	YES	-	YES	YES	YES
technology	-	CMOS	-	CMOS	CMOS	-	CMOS	CMOS	CMOS
Temperature level	-	INDUSTRIAL	-	INDUSTRIAL	INDUSTRIAL	-	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	-	TIN LEAD	-	MATTE TIN	TIN LEAD	-	MATTE TIN	MATTE TIN	MATTE TIN
Terminal form	-	GULL WING	-	GULL WING	GULL WING	-	GULL WING	NO LEAD	NO LEAD
Terminal pitch	-	1.27 mm	-	1.27 mm	1.27 mm	-	1.27 mm	1.27 mm	1.27 mm
Terminal location	-	DUAL	-	DUAL	DUAL	-	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	-	30	-	40	30	-	40	40	40
type	-	NOR TYPE	-	NOR TYPE	NOR TYPE	-	NOR TYPE	NOR TYPE	NOR TYPE
width	-	5.23 mm	-	5.23 mm	5.23 mm	-	5.23 mm	4.9 mm	4.9 mm

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