Maximum Junction Temperature (Plastic Package) . . . . . . . .150
o
C
Maximum Storage Temperature Range . . . . . . . . . -65
o
C to 150
o
C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . .300
o
C
(MQFP - Lead Tips Only)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1.
θ
JA
is measured with the component mounted on an evaluation PC board in free air.
Electrical Specifications
AV
CC
= DV
CC1
= DV
CC2
= +5.0V, f
S
= 5MSPS at 50% Duty Cycle, V
RIN
= V
ROUT
, C
L
= 15pF,
T
A
= 25
o
C, Differential Analog Input, Unless Otherwise Specified
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Microcontroller MCU
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